S9S08QD4J2MSC

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of S9S08QD4J2MSCLast Revision (GMT):
Thursday, 25 March 2021, 09:33:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S9S08QD4J2MSCSOT96-4SO875.748496 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 119 185742020-07-2853 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.10848599.9900000.143218
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000110.0100000.000014
Subtotal0.108496100.00000000.143232
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-826.58379397.29100035.094813
Iron and its compoundsIron, metal7439-89-60.6475792.3700000.854907
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0046450.0170000.006132
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0453580.1660000.059880
Tin and its compoundsTin, metal7440-31-50.0081970.0300000.010822
Zinc and its compoundsZinc, metal7440-66-60.0344280.1260000.045451
Subtotal27.324000100.000000036.072003
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000280.0100000.000036
Silver and its compoundsSilver, metal7440-22-40.27597299.9900000.364327
Subtotal0.276000100.00000000.364364
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.2555827.6065004.297883
Inorganic Silicon compoundsSilica, vitreous60676-86-036.89651086.20680048.709232
Inorganic compoundsCarbon Black1333-86-40.1302400.3043000.171938
Organic Phosphorus compoundsOther organic phosphorous compounds0.1302400.3043000.171938
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins2.3874275.5781003.151781
Subtotal42.800000100.000000056.502772
Epoxy AdhesiveEpoxy AdhesiveCopper and its compoundsCupric oxide1317-38-00.0325002.5000000.042905
Inorganic Silicon compoundsSilicon dioxide, syntetic112945-52-50.0002600.0200000.000343
PolymersPlastic: EP - Epoxide, Epoxy0.26624020.4800000.351479
Silver and its compoundsSilver, metal7440-22-41.00100077.0000001.321478
Subtotal1.300000100.00000001.716206
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001580.0200000.000209
Tin and its compoundsTin, metal7440-31-50.78984299.9800001.042716
Subtotal0.790000100.00000001.042925
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped3.08700098.0000004.075328
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0630002.0000000.083170
Subtotal3.150000100.00000004.158498
Total75.748496100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S9S08QD4J2MSC
Product content declaration of S9S08QD4J2MSC
上次修订 Last Revision (GMT):
Thursday, 25 March 2021, 09:33:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S9S08QD4J2MSCLast Revision (GMT):
Thursday, 25 March 2021, 09:33:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
16 Jul 2020
Test Report
16 Jul 2020
Test Report
16 Jul 2020
Test Report
16 Jul 2020
Copper Lead-FrameNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
8 Jul 2020
Test Report
8 Jul 2020
Test Report
8 Jul 2020
Test Report
8 Jul 2020
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Not Available
Post-plating - Lead FreeTest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.