TDF8591TH/N1S

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of TDF8591TH/N1S
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
TDF8591TH/N1SSOT566-3HSOP242067.48300 mg NoNoYesNot AvailableNot AvailableNot Availablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9352 891 441182016-02-1251 | Unlimited24530 sec.1 | Unlimited22520 sec.3Kaohsiung, Taiwan
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
DieDoped siliconSilicon (Si)7440-21-324.27000100.000001.17389
Subtotal24.27000100.000001.17389
Heat Spreader MaterialPure metalCopper (Cu)7440-50-81187.46000100.0000057.43503
Subtotal1187.46000100.0000057.43503
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8156.9072197.470007.58929
Iron (Fe)7439-89-63.863522.400000.18687
Phosphorous (P)7723-14-00.048290.030000.00234
Zinc (Zn)7440-66-60.160980.100000.00779
Subtotal160.98000100.000007.78629
Mould CompoundFillerMisc. Silica compounds 114808-60-7468.3672072.0000022.65398
Flame retardantAntimony Trioxide (Sb2O3) 1309-64-423.418363.600001.13270
Misc. Bromine compounds 27726-95-69.757651.500000.47196
PolymerEpoxy resin systemProprietary148.9667922.900007.20522
Subtotal650.51000100.0000031.46386
Post-platingImpurityAntimony (Sb)7440-36-00.000360.002990.00002
Bismuth (Bi)7440-69-90.000120.001000.00001
Copper (Cu)7440-50-80.000120.001000.00001
Lead (Pb)7439-92-10.000600.004980.00003
Tin solderTin (Sn)7440-31-512.0488099.990030.58278
Subtotal12.05000100.000000.58285
Pre-platingPure metalSilver (Ag)7440-22-43.06000100.000000.14801
Subtotal3.06000100.000000.14801
SCSubstancePolymerResin systemProprietary15.93000100.000000.77050
Subtotal15.93000100.000000.77050
Solder WireLead alloyLead (Pb)7439-92-110.5336595.500000.50949
Silver (Ag)7440-22-40.275752.500000.01334
Tin (Sn)7440-31-50.220602.000000.01067
Subtotal11.03000100.000000.53350
WirePure metalCopper (Cu)7440-50-82.19300100.000000.10607
Subtotal2.19300100.000000.10607
Total2067.48300100.00000100.00000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of TDF8591TH/N1S
产品内容声明 TDF8591TH/N1S
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Die
晶粒
OOOOOO
Heat Spreader Material
散热材料
OOOOOO
Lead Frame Material
极片材料
OOOOOO
Mould Compound
注塑胶料
OOOOOO
Post-plating
后电镀
OOOOOO
Pre-plating
预电镀
OOOOOO
SCSubstance
OOOOOO
Solder Wire
锡线
OOOOOO
Wire
线
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

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