XPC8260VVIFBC

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of XPC8260VVIFBCLast Revision (GMT):
Saturday, 14 May 2022, 03:19:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
XPC8260VVIFBCSOT1752-1LBGA48010083.939661 mg NoYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 253 915572021-10-2053 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-539.07175399.9900000.387465
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0039080.0100000.000039
Subtotal39.075661100.00000000.387504
Die Encapsulant 1Die EncapsulantAnhydridesMethylhexahydrophthalic anhydride25550-51-01.5676606.3726000.015546
AnhydridesSubstituted phthalic anhydride34090-76-11.5676606.3726000.015546
Epoxy Resins3,4-Epoxycyclohexanecarboxylic acid (3,4-epoxycyclohexylmethyl) ester2386-87-01.4312535.8181000.014193
Epoxy ResinsBisphenol A diglycidyl ether1675-54-31.4312535.8181000.014193
Inorganic Silicon compoundsQuartz14808-60-717.87079372.6455000.177220
Inorganic compoundsCarbon Black1333-86-40.1035660.4210000.001027
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.5306222.1570000.005262
Small Mineral and Ceramic FibersCristobalite14464-46-10.0971950.3951000.000964
Subtotal24.600000100.00000000.243952
Die Encapsulant 2Die EncapsulantAnhydridesMethylhexahydrophthalic anhydride25550-51-040.64381414.2410000.403055
Antimony OxidesAntimony(V) oxide1314-60-90.4335230.1519000.004299
Bismuth and its compoundsBismuth, metal7440-69-90.4606360.1614000.004568
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-640.64381414.2410000.403055
Inorganic Silicon compoundsSilica, vitreous60676-86-0203.21821471.2047002.015266
Subtotal285.400000100.00000002.830243
Epoxy AdhesiveEpoxy AdhesiveAniline and its saltsp-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline5026-74-41.4500005.0000000.014379
Aromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.2175000.7500000.002157
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.33502911.5001000.033073
Glycidyl ethersP-Tertbutylphenyl glycidyl ether3101-60-81.4500005.0000000.014379
Glycol Ethers and Acetates - Specific2-butoxyethyl acetate112-07-20.3625001.2500000.003595
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.2175000.7500000.002157
Silver and its compoundsSilver, metal7440-22-421.96747175.7499000.217846
Subtotal29.000000100.00000000.287586
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped58.84900098.0000000.583591
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2010002.0000000.011910
Subtotal60.050000100.00000000.595501
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0082750.0010000.000082
Arsenic and its compoundsArsenic, metal7440-38-20.0082750.0010000.000082
Bismuth and its compoundsBismuth, metal7440-69-90.0082750.0010000.000082
Copper and its compoundsCopper, metal7440-50-85.7925980.7000000.057444
Iron and its compoundsIron, metal7439-89-60.0148950.0018000.000148
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0463410.0056000.000460
Silver and its compoundsSilver, metal7440-22-431.1145263.7600000.308555
Tin and its compoundsTin, metal7440-31-5790.52081495.5296007.839404
Subtotal827.514000100.00000008.206257
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuBarium and its compoundsBarium7440-39-33.1216780.0354000.030957
Chromium and Chromium III compoundsChromium, metal7440-47-30.0881830.0010000.000874
Copper and its compoundsCopper, metal7440-50-88389.04279395.13220083.192116
Copper and its compoundsCupric oxide1317-38-0239.6813942.7180002.376863
Epoxy ResinsOther Non-halogenated Epoxy resins21.7459280.2466000.215649
Gold and its compoundsGold, metal7440-57-52.7336730.0310000.027109
Inorganic compoundsOther inorganic compounds0.1234560.0014000.001224
Nickel and its compoundsNickel, metal7440-02-017.3191410.1964000.171750
Organic compoundsOther organic compounds.30.7494120.3487000.304934
PolymersFormaldehyde, polymer with 4,4'-(1-methylethylidene)bis[phenol]25085-75-06.6049070.0749000.065499
PolymersOther non-halogenated polymers103.7120261.1761001.028487
Zinc and its compoundsZinc, metal7440-66-60.0881830.0010000.000874
Zirconium and its compoundsZirconium, metal7440-67-73.2892260.0373000.032619
Subtotal8818.300000100.000000087.448956
Total10083.939661100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 XPC8260VVIFBC
Product content declaration of XPC8260VVIFBC
上次修订 Last Revision (GMT):
Saturday, 14 May 2022, 03:19:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of XPC8260VVIFBCLast Revision (GMT):
Saturday, 14 May 2022, 03:19:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Die Encapsulant 1Test Report
3 Apr 2019
Test Report
3 Apr 2019
Test Report
3 Apr 2019
Not Available
Die Encapsulant 2Test Report
16 Jul 2019
Test Report
16 Jul 2019
Test Report
16 Jul 2019
Test Report
16 Jul 2019
Epoxy AdhesiveTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Semiconductor DieTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Solder Ball - SAC, Lead FreeTest Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.