NXP Semiconductors 产品内容声明 PCF85063ATT/AJ Product content declaration of PCF85063ATT/AJ | 上次修订 Last Revision (GMT): Thursday, 07 July 2022, 03:20:00 AM | ||||||
部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
---|---|---|---|---|---|---|---|
铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
焊丝-金 Bonding Wire - Au | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
铜引线框架,预镀镍钯金 Copper Lead-Frame, Pre-Plated NiPdAu | 铜引线框架,预镀镍钯金 Copper Lead-Frame, Pre-Plated NiPdAu | O | O | O | O | O | O |
芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
预电镀-贵金属-镍钯金 Pre-plating - Precious metal - NiPdAu | 预电镀-贵金属-镍钯金 Pre-plating - Precious metal - NiPdAu | O | O | O | O | O | O |
半导体芯片 Semiconductor Die | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 | |||||||
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit. | |||||||
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 | |||||||
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. | |||||||
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。 | |||||||
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP). |
免责声明 Disclaimer | |||||||
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