NXP Semiconductors Product Content Declaration of BFU530XRR | Last Revision (GMT): Wednesday, 30 August 2023, 03:36:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
BFU530XRR | SOT143R | SOT143R | 8.820050 mg | Yes | Yes | Yes | Tin (Sn) | Alloy42 | e3 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9340 677 12215 | 2023-11-25 | 6 | 1 / Unlimited | 260 | 30 sec. | 1 / Unlimited | 240 | 20 sec. | 3 | Guangdong, China |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Au | Bonding Wire - Au | Beryllium and its compounds | Beryllium, metal | 7440-41-7 | 0.000001 | 0.001000 | 0.000002 | |||
Gold and its compounds | Gold, metal | 7440-57-5 | 0.017847 | 99.990000 | 0.202360 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.009000 | 0.000018 | ||||||
SubTotal | 0.017850 | 100.0000000 | 0.202380 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.735000 | 15.000000 | 8.333286 | ||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 3.528000 | 72.000000 | 39.999773 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.024500 | 0.500000 | 0.277776 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.098000 | 2.000000 | 1.111105 | ||||||
Phenols and Phenolic Resins | Phenol, polymer with formaldehyde | 9003-35-4 | 0.490000 | 10.000000 | 5.555524 | |||||
Phosphorus compounds | Triphenyl phosphine | 603-35-0 | 0.024500 | 0.500000 | 0.277776 | |||||
SubTotal | 4.900000 | 100.0000000 | 55.555241 | |||||||
Iron Lead-Frame, Pre-Plated | Iron Lead-Frame, Pre-Plated | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 0.003015 | 0.090000 | 0.034183 | |||
Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 0.007035 | 0.210000 | 0.079761 | |||||
Cobalt and its compounds | Cobalt, metal | 7440-48-4 | 0.014070 | 0.420000 | 0.159523 | |||||
Copper and its compounds | Copper, metal | 7440-50-8 | 0.438180 | 13.080000 | 4.967999 | |||||
Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.008375 | 0.250000 | 0.094954 | |||||
Inorganic compounds | Carbon | 7440-44-0 | 0.001340 | 0.040000 | 0.015193 | |||||
Inorganic compounds | Proprietary Material - Other inorganic compounds | 0.000670 | 0.020000 | 0.007596 | ||||||
Iron and its compounds | Iron, metal | 7439-89-6 | 1.583880 | 47.280000 | 17.957721 | |||||
Manganese and its compounds | Manganese, metal | 7439-96-5 | 0.028475 | 0.850000 | 0.322844 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 1.193270 | 35.620000 | 13.529062 | |||||
Phosphorus compounds | Proprietary Material-Other inorganic phosphorous compounds | 0.000670 | 0.020000 | 0.007596 | ||||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.071020 | 2.120000 | 0.805211 | |||||
SubTotal | 3.350000 | 100.0000000 | 37.981644 | |||||||
Post-plating - Lead Free | Post-plating - Lead Free | Antimony and its compounds | Antimony, metal | 7440-36-0 | 0.000047 | 0.010000 | 0.000533 | |||
Bismuth and its compounds | Bismuth, metal | 7440-69-9 | 0.000094 | 0.020000 | 0.001066 | |||||
Iron and its compounds | Iron, metal | 7439-89-6 | 0.000047 | 0.010000 | 0.000533 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000047 | 0.010000 | 0.000533 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.469765 | 99.950000 | 5.326104 | |||||
SubTotal | 0.470000 | 100.0000000 | 5.328768 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.080556 | 98.000000 | 0.913328 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.001644 | 2.000000 | 0.018639 | ||||||
SubTotal | 0.082200 | 100.0000000 | 0.931968 | |||||||
Total | 8.820050 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |