NXP Semiconductors Product Content Declaration of FXTH8709116T1 | Last Revision (GMT): Tuesday, 18 October 2022, 03:48:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
FXTH8709116T1 | SOT1575-1 | HQFN24 | 296.949978 mg | Yes | No | Yes | Other | Cu alloy | e4 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 150 35528 | 2023-11-24 | 8 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | External manufacturing |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Au 1 | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 0.099974 | 99.990000 | 0.033667 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000010 | 0.010000 | 0.000003 | ||||||
SubTotal | 0.099984 | 100.0000000 | 0.033670 | |||||||
Bonding Wire - Au 2 | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 0.399954 | 99.990000 | 0.134687 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000040 | 0.010000 | 0.000013 | ||||||
SubTotal | 0.399994 | 100.0000000 | 0.134701 | |||||||
Copper Lead-Frame, Pre-Plated | Copper Lead-Frame, Pre-Plated | Copper and its compounds | Copper, metal | 7440-50-8 | 6.982294 | 96.976300 | 2.351337 | |||
Gold and its compounds | Gold, metal | 7440-57-5 | 0.001368 | 0.019000 | 0.000461 | |||||
Iron and its compounds | Iron, metal | 7439-89-6 | 0.153814 | 2.136300 | 0.051798 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000072 | 0.001000 | 0.000024 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.057312 | 0.796000 | 0.019300 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.001800 | 0.025000 | 0.000606 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.002045 | 0.028400 | 0.000689 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.001296 | 0.018000 | 0.000436 | |||||
SubTotal | 7.200000 | 100.0000000 | 2.424651 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 7.972000 | 4.000000 | 2.684627 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 146.485500 | 73.500000 | 49.330025 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 31.888000 | 16.000000 | 10.738509 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.996500 | 0.500000 | 0.335578 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 11.958000 | 6.000000 | 4.026941 | ||||||
SubTotal | 199.300000 | 100.0000000 | 67.115681 | |||||||
Epoxy Adhesive 1 | Epoxy Adhesive | Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.120000 | 30.000000 | 0.040411 | |||
Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.036400 | 9.100000 | 0.012258 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 0.240000 | 60.000000 | 0.080822 | |||||
Platinum and its compounds | Other platinum compounds | 0.003600 | 0.900000 | 0.001212 | ||||||
SubTotal | 0.400000 | 100.0000000 | 0.134703 | |||||||
Epoxy Adhesive 2 | Epoxy Adhesive | Anhydrides | Polybutadiene adducted with maleic anhydride | 25655-35-0 | 0.000500 | 0.500000 | 0.000168 | |||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.000500 | 0.500000 | 0.000168 | |||||
Organic compounds | Other Bismaleimides | 0.049000 | 49.000000 | 0.016501 | ||||||
Polymers | Polytetrafluoroethylene | 9002-84-0 | 0.040000 | 40.000000 | 0.013470 | |||||
Titanium and its compounds | Titanium (IV) Oxide | 13463-67-7 | 0.010000 | 10.000000 | 0.003368 | |||||
SubTotal | 0.100000 | 100.0000000 | 0.033676 | |||||||
Epoxy Adhesive 3 | Epoxy Adhesive | Epoxy Resins | Epichlorohydrin, o-cresol, formaldehyde polymer | 29690-82-2 | 0.010000 | 10.000000 | 0.003368 | |||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.025000 | 25.000000 | 0.008419 | |||||
Phenols and Phenolic Resins | Phenol p-xylylene dimethyl ether copolymer | 26834-02-6 | 0.030000 | 30.000000 | 0.010103 | |||||
Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 0.025000 | 25.000000 | 0.008419 | |||||
Polymers | Acrylic acid ester copolymer | 78506-70-4 | 0.010000 | 10.000000 | 0.003368 | |||||
SubTotal | 0.100000 | 100.0000000 | 0.033676 | |||||||
Epoxy Adhesive 4 | Epoxy Adhesive | Epoxy Resins | Other Epoxy resins | 2.475000 | 99.000000 | 0.833474 | ||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.025000 | 1.000000 | 0.008419 | |||||
SubTotal | 2.500000 | 100.0000000 | 0.841893 | |||||||
Lid | Lid | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 12.624118 | 18.138100 | 4.251261 | |||
Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.437714 | 0.628900 | 0.147403 | |||||
Inorganic compounds | Carbon | 7440-44-0 | 0.034730 | 0.049900 | 0.011696 | |||||
Inorganic compounds | Sulfur | 7704-34-9 | 0.002088 | 0.003000 | 0.000703 | |||||
Iron and its compounds | Iron, metal | 7439-89-6 | 49.574340 | 71.227500 | 16.694509 | |||||
Manganese and its compounds | Manganese, metal | 7439-96-5 | 0.729547 | 1.048200 | 0.245680 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 5.989010 | 8.604900 | 2.016841 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.208452 | 0.299500 | 0.070198 | |||||
SubTotal | 69.600000 | 100.0000000 | 23.438291 | |||||||
Semiconductor Die 1 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 5.243000 | 98.000000 | 1.765617 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.107000 | 2.000000 | 0.036033 | ||||||
SubTotal | 5.350000 | 100.0000000 | 1.801650 | |||||||
Semiconductor Die 2 | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 2.548000 | 98.000000 | 0.858057 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.052000 | 2.000000 | 0.017511 | ||||||
SubTotal | 2.600000 | 100.0000000 | 0.875568 | |||||||
Semiconductor Die 3 | Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 2.470880 | 98.000000 | 0.832086 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.050426 | 2.000000 | 0.016981 | ||||||
SubTotal | 2.521306 | 100.0000000 | 0.849068 | |||||||
Glass | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 0.025852 | 32.851000 | 0.008706 | ||||
Lead and its compounds | Lead titanium oxide (PbTiO3) | 12060-00-3 | 0.026991 | 34.298000 | 0.009089 | |||||
Organic compounds | 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate | 25265-77-4 | 0.025852 | 32.851000 | 0.008706 | |||||
SubTotal | 0.078694 | 100.0000000 | 0.026501 | |||||||
Thermally Conductive Gel 1 | Thermally Conductive Gel | Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.201000 | 6.000000 | 0.067688 | |||
Organic Silicon compounds | Dimethylvinylated and trimethylated silica | 68988-89-6 | 0.904500 | 27.000000 | 0.304597 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 2.244500 | 67.000000 | 0.755851 | |||||
SubTotal | 3.350000 | 100.0000000 | 1.128136 | |||||||
Thermally Conductive Gel 2 | Thermally Conductive Gel | Organic Silicon compounds | Dimethylvinylated and trimethylated silica | 68988-89-6 | 1.218181 | 36.363600 | 0.410231 | |||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 2.030304 | 60.606100 | 0.683719 | |||||
Organic Silicon compounds | Tetra (trimethylsiloxy) silane | 3555-47-3 | 0.101515 | 3.030300 | 0.034186 | |||||
SubTotal | 3.350000 | 100.0000000 | 1.128136 | |||||||
Total | 296.949978 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |