NXP Semiconductors Product Content Declaration of JN5189THN/001Y | Last Revision (GMT): Thursday, 07 March 2024, 02:09:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
JN5189THN/001Y | SOT618 | HVQFN40 | 98.558166 mg | Yes | Yes | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | Cu alloy | e4 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 507 35518 | 2023-11-25 | 5 | 3 / 168 hours | 260 | 30 sec. | 3 / 168 hours | 240 | 20 sec. | 3 | Suzhou, China;Kaohsiung, Taiwan |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Au | Bonding Wire - Au | Calcium and its compounds | Calcium | 7440-70-2 | 0.000001 | 0.002000 | 0.000001 | |||
Gold and its compounds | Gold, metal | 7440-57-5 | 0.060982 | 98.840000 | 0.061874 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000005 | 0.008000 | 0.000005 | ||||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.000709 | 1.150000 | 0.000720 | |||||
SubTotal | 0.061698 | 100.0000000 | 0.062601 | |||||||
Bonding Wire - CuPdAu | Bonding Wire - CuPdAu | Copper and its compounds | Copper, metal | 7440-50-8 | 0.357587 | 97.865000 | 0.362818 | |||
Gold and its compounds | Gold, metal | 7440-57-5 | 0.000493 | 0.135000 | 0.000500 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.007308 | 2.000000 | 0.007415 | |||||
SubTotal | 0.365388 | 100.0000000 | 0.370733 | |||||||
Copper Lead-Frame, Pre-Plated NiPdAu | Copper Lead-Frame, Pre-Plated NiPdAu | Copper and its compounds | Copper, metal | 7440-50-8 | 40.178240 | 97.520000 | 40.766018 | |||
Iron and its compounds | Iron, metal | 7439-89-6 | 0.947600 | 2.300000 | 0.961463 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.012360 | 0.030000 | 0.012541 | |||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.061800 | 0.150000 | 0.062704 | |||||
SubTotal | 41.200000 | 100.0000000 | 41.802726 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Tetramethylbiphenyl diglycidyl ether | 85954-11-6 | 1.875692 | 3.640000 | 1.903132 | |||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 40.507733 | 78.610000 | 41.100332 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 4.503722 | 8.740000 | 4.569608 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.087601 | 0.170000 | 0.088883 | |||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 1.602583 | 3.110000 | 1.626028 | ||||||
Phenols and Phenolic Resins | Phenol p-xylylene dimethyl ether copolymer | 26834-02-6 | 1.989058 | 3.860000 | 2.018156 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 0.159743 | 0.310000 | 0.162080 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 0.803868 | 1.560000 | 0.815628 | ||||||
SubTotal | 51.530000 | 100.0000000 | 52.283846 | |||||||
Epoxy Adhesive 1 | Epoxy Adhesive | Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.115420 | 9.950000 | 0.117109 | ||||
Palladium and its compounds | Proprietary Material-Other palladium compounds | 0.000580 | 0.050000 | 0.000589 | ||||||
Polymers | Amines, C36-alkylenedi-, maleated | 682800-79-9 | 0.116000 | 10.000000 | 0.117697 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.928000 | 80.000000 | 0.941576 | |||||
SubTotal | 1.160000 | 100.0000000 | 1.176970 | |||||||
Epoxy Adhesive 2 | Epoxy Adhesive | Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.015000 | 75.000000 | 0.015219 | |||
Organic compounds | Other organic compounds. | 0.000300 | 1.500000 | 0.000304 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 0.004700 | 23.500000 | 0.004769 | ||||||
SubTotal | 0.020000 | 100.0000000 | 0.020293 | |||||||
Pre-plating - Precious metal - NiPdAu | Pre-plating - Precious metal - NiPdAu | Gold and its compounds | Gold, metal | 7440-57-5 | 0.008900 | 1.000000 | 0.009030 | |||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.809900 | 91.000000 | 0.821748 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.071200 | 8.000000 | 0.072242 | |||||
SubTotal | 0.890000 | 100.0000000 | 0.903020 | |||||||
Semiconductor Die 1 | Semiconductor Die 1 | Gold and its compounds | Gold, metal | 7440-57-5 | 0.003023 | 2.000000 | 0.003067 | |||
Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.148117 | 98.000000 | 0.150284 | |||||
SubTotal | 0.151140 | 100.0000000 | 0.153351 | |||||||
Semiconductor Die 2 | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.148117 | 98.000000 | 0.150284 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.003023 | 2.000000 | 0.003067 | ||||||
SubTotal | 0.151140 | 100.0000000 | 0.153351 | |||||||
Semiconductor Die 2 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 2.968224 | 98.000000 | 3.011647 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.060576 | 2.000000 | 0.061462 | ||||||
SubTotal | 3.028800 | 100.0000000 | 3.073109 | |||||||
Total | 98.558166 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |