NXP Semiconductors Product Content Declaration of KCIMX6D6AVT08AC | Last Revision (GMT): Thursday, 07 March 2024, 12:57:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
KCIMX6D6AVT08AC | SOT1643-1 | FBGA624 | 3299.965590 mg | Yes | Yes | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | Other | e1 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 410 41557 | 2023-11-24 | 11 | 3 / 168 hours | 260 | 40 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | Kuala Lumpur, Malaysia;External manufacturing |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Cap | Cap | Copper and its compounds | Copper, metal | 7440-50-8 | 1986.138000 | 99.000000 | 60.186628 | |||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 20.062000 | 1.000000 | 0.607946 | |||||
SubTotal | 2006.200000 | 100.0000000 | 60.794573 | |||||||
Epoxy Adhesive | Epoxy Adhesive | Inorganic Silicon compounds | Quartz | 14808-60-7 | 2.910000 | 30.000000 | 0.088183 | |||
Inorganic Silicon compounds | Silylated silica | 68909-20-6 | 0.388000 | 4.000000 | 0.011758 | |||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.001940 | 0.020000 | 0.000059 | ||||||
Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.388000 | 4.000000 | 0.011758 | |||||
Organic Silicon compounds | Other siloxanes and silicones | 0.291000 | 3.000000 | 0.008818 | ||||||
Organic Silicon compounds | Silicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane | 68584-83-8 | 0.436500 | 4.500000 | 0.013227 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 5.238000 | 54.000000 | 0.158729 | |||||
Organic Silicon compounds | [3-(2,3-epoxypropoxy)propyl]trimethoxysilane | 2530-83-8 | 0.029100 | 0.300000 | 0.000882 | |||||
Organic compounds | Other organic compounds. | 0.014550 | 0.150000 | 0.000441 | ||||||
Platinum and its compounds | Other platinum compounds | 0.002910 | 0.030000 | 0.000088 | ||||||
SubTotal | 9.700000 | 100.0000000 | 0.293942 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 36.324369 | 89.600000 | 1.100750 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.364865 | 0.900000 | 0.011057 | ||||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.202703 | 0.500000 | 0.006143 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.127703 | 0.315000 | 0.003870 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 3.520950 | 8.685000 | 0.106697 | |||||
SubTotal | 40.540590 | 100.0000000 | 1.228516 | |||||||
Solder Ball - SAC, Lead Free | Solder Ball - SAC, Lead Free | Copper and its compounds | Copper, metal | 7440-50-8 | 1.815750 | 0.600000 | 0.055023 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 9.078750 | 3.000000 | 0.275116 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 291.730500 | 96.400000 | 8.840410 | |||||
SubTotal | 302.625000 | 100.0000000 | 9.170550 | |||||||
Substrate | Substrate | Aluminum and its compounds | Aluminum Hydroxide | 21645-51-2 | 143.226198 | 15.620700 | 4.340233 | |||
Arsenic and its compounds | Arsenic, metal | 7440-38-2 | 0.009169 | 0.001000 | 0.000278 | |||||
Barium and its compounds | Barium sulfate | 7727-43-7 | 3.766625 | 0.410800 | 0.114141 | |||||
Copper and its compounds | Copper phthalocyanine | 147-14-8 | 0.602403 | 0.065700 | 0.018255 | |||||
Copper and its compounds | Copper, metal | 7440-50-8 | 315.544717 | 34.414300 | 9.562061 | |||||
Epoxy Resins | Bisphenol A diglycidyl ether | 1675-54-3 | 7.061964 | 0.770200 | 0.214001 | |||||
Epoxy Resins | Other Epoxy resins | 14.236706 | 1.552700 | 0.431420 | ||||||
Epoxy Resins | Proprietary Material-Other Epoxy resins | 38.194386 | 4.165600 | 1.157418 | ||||||
Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 276.900132 | 30.199600 | 8.391001 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 68.639134 | 7.486000 | 2.079995 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.009169 | 0.001000 | 0.000278 | |||||
Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 13.256540 | 1.445800 | 0.401718 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 25.683286 | 2.801100 | 0.778289 | ||||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.294325 | 0.032100 | 0.008919 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 9.475245 | 1.033400 | 0.287132 | |||||
SubTotal | 916.900000 | 100.0000000 | 27.785138 | |||||||
Thermally Conductive Gel | Thermally Conductive Gel | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 8.400000 | 70.000000 | 0.254548 | |||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.360000 | 3.000000 | 0.010909 | ||||||
Organic Silicon compounds | Dimethyl Cyclosiloxanes | 70900-21-9 | 0.120000 | 1.000000 | 0.003636 | |||||
Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.120000 | 1.000000 | 0.003636 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 1.200000 | 10.000000 | 0.036364 | |||||
Zinc and its compounds | Zinc oxide | 1314-13-2 | 1.800000 | 15.000000 | 0.054546 | |||||
SubTotal | 12.000000 | 100.0000000 | 0.363640 | |||||||
Underfill | Underfill | Aromatic amines and their salts | 4,4'-Methylenebis(2-ethylbenzenamine) | 19900-65-3 | 1.320000 | 11.000000 | 0.040000 | |||
Bismuth and its compounds | Bismuth nitrate | 10361-44-1 | 0.012000 | 0.100000 | 0.000364 | |||||
Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.096000 | 0.800000 | 0.002909 | |||||
Epoxy Resins | 1,6-Bis(2,3-epoxypropoxy) naphthalene | 27610-48-6 | 1.680000 | 14.000000 | 0.050910 | |||||
Epoxy Resins | Other Epoxy resins | 0.480000 | 4.000000 | 0.014546 | ||||||
Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 1.200000 | 10.000000 | 0.036364 | |||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 7.200000 | 60.000000 | 0.218184 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.012000 | 0.100000 | 0.000364 | |||||
SubTotal | 12.000000 | 100.0000000 | 0.363640 | |||||||
Total | 3299.965590 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |