NXP Semiconductors Product Content Declaration of LPC1853FET256,551 | Last Revision (GMT): Monday, 04 July 2022, 02:41:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
LPC1853FET256,551 | SOT740-2 | LBGA256 | 743.002376 mg | Yes | Yes | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | Other | e1 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9352 937 96551 | 2020-10-15 | 12 | 3 / 168 hours | 260 | 30 sec. | NA / Not Available | 240 | 20 sec. | 3 | Kaohsiung, Taiwan |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - CuPdAu | Bonding Wire - CuPdAu | Copper and its compounds | Copper, metal | 7440-50-8 | 0.364690 | 97.865000 | 0.049083 | |||
Gold and its compounds | Gold, metal | 7440-57-5 | 0.000503 | 0.135000 | 0.000068 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.007453 | 2.000000 | 0.001003 | |||||
SubTotal | 0.372646 | 100.0000000 | 0.050154 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 42.315000 | 10.500000 | 5.695137 | ||||
Inorganic Silicon compounds | Quartz | 14808-60-7 | 360.685000 | 89.500000 | 48.544259 | |||||
SubTotal | 403.000000 | 100.0000000 | 54.239396 | |||||||
Epoxy Adhesive | Epoxy Adhesive | Acrylates | Isobornyl methacrylate | 7534-94-3 | 0.280000 | 10.000000 | 0.037685 | |||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.056000 | 2.000000 | 0.007537 | ||||||
Organic compounds | N,N'-Bismaleimido-4,4'-diphenylmethane | 35325-39-4 | 0.280000 | 10.000000 | 0.037685 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 2.184000 | 78.000000 | 0.293942 | |||||
SubTotal | 2.800000 | 100.0000000 | 0.376849 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 10.613135 | 98.000000 | 1.428412 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.216595 | 2.000000 | 0.029151 | ||||||
SubTotal | 10.829730 | 100.0000000 | 1.457563 | |||||||
Solder Ball - SAC, Lead Free | Solder Ball - SAC, Lead Free | Copper and its compounds | Copper, metal | 7440-50-8 | 0.615000 | 0.500000 | 0.082772 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 1.230000 | 1.000000 | 0.165545 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 121.155000 | 98.500000 | 16.306139 | |||||
SubTotal | 123.000000 | 100.0000000 | 16.554456 | |||||||
Substrate | Copper Foil | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 0.008300 | 0.010000 | 0.001117 | |||
Copper and its compounds | Copper, metal | 7440-50-8 | 82.962226 | 99.950000 | 11.165809 | |||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.033202 | 0.040000 | 0.004469 | |||||
SubTotal | 83.003728 | 100.0000000 | 11.171395 | |||||||
Copper Plating | Copper and its compounds | Copper, metal | 7440-50-8 | 58.434768 | 99.950000 | 7.864681 | ||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.029232 | 0.050000 | 0.003934 | |||||
SubTotal | 58.464000 | 100.0000000 | 7.868615 | |||||||
Gold Plating | Gold and its compounds | Gold, metal | 7440-57-5 | 0.507449 | 99.990000 | 0.068297 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000051 | 0.010000 | 0.000007 | ||||||
SubTotal | 0.507500 | 100.0000000 | 0.068304 | |||||||
Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.007592 | 0.200000 | 0.001022 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 3.788508 | 99.800000 | 0.509892 | |||||
SubTotal | 3.796100 | 100.0000000 | 0.510914 | |||||||
Solder Mask | Barium and its compounds | Barium sulfate | 7727-43-7 | 6.864283 | 29.100000 | 0.923857 | ||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.141532 | 0.600000 | 0.019049 | |||||
Magnesium and its compounds | Talc | 14807-96-6 | 0.707658 | 3.000000 | 0.095243 | |||||
Organic compounds | Other organic compounds. | 0.849190 | 3.600000 | 0.114292 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 4.623366 | 19.600000 | 0.622255 | ||||||
Polymers | Plastic: PAK | 10.402573 | 44.100000 | 1.400073 | ||||||
SubTotal | 23.588600 | 100.0000000 | 3.174768 | |||||||
Substrate Core | Aluminum and its compounds | Aluminum hydroxide oxide | 24623-77-6 | 7.333536 | 21.800000 | 0.987014 | ||||
Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 15.070752 | 44.800000 | 2.028358 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.403681 | 1.200000 | 0.054331 | |||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 2.152965 | 6.400000 | 0.289766 | ||||||
Phenols - Specific | Bisphenol A | 80-05-7 | 0.336401 | 1.000000 | 0.045276 | |||||
Polymers | BT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound] | 4.844170 | 14.400000 | 0.651972 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 3.498568 | 10.400000 | 0.470869 | ||||||
SubTotal | 33.640072 | 100.0000000 | 4.527586 | |||||||
Total | 743.002376 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |