NXP Semiconductors Product Content Declaration of LX2080SC71826B | Last Revision (GMT): Wednesday, 18 January 2023, 03:54:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
LX2080SC71826B | SOT1848 | BGA1517 | 20333.271000 mg | Yes | Yes | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | Other | e1 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9354 025 51557 | 2023-11-24 | 7 | 3 / 168 hours | 245 | 30 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | External manufacturing |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Epoxy Adhesive | Epoxy Adhesive | Inorganic Silicon compounds | Quartz | 14808-60-7 | 15.623200 | 40.000000 | 0.076836 | |||
Organic Silicon compounds | Dimethylvinylated and trimethylated silica | 68988-89-6 | 5.858700 | 15.000000 | 0.028813 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 17.576100 | 45.000000 | 0.086440 | |||||
SubTotal | 39.058000 | 100.0000000 | 0.192089 | |||||||
Heat Spreader | Copper Alloy | Copper and its compounds | Copper, metal | 7440-50-8 | 14014.112360 | 99.900000 | 68.922075 | |||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 14.028140 | 0.100000 | 0.068991 | ||||||
SubTotal | 14028.140500 | 100.0000000 | 68.991066 | |||||||
Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.220859 | 0.100000 | 0.001086 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 220.638641 | 99.900000 | 1.085111 | |||||
SubTotal | 220.859500 | 100.0000000 | 1.086198 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 193.705820 | 98.000000 | 0.952654 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 3.953180 | 2.000000 | 0.019442 | ||||||
SubTotal | 197.659000 | 100.0000000 | 0.972096 | |||||||
Solder Ball - SAC, Lead Free | Solder Ball - SAC, Lead Free | Copper and its compounds | Copper, metal | 7440-50-8 | 6.363899 | 0.500900 | 0.031298 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 38.183397 | 3.005400 | 0.187788 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 1225.945704 | 96.493700 | 6.029260 | |||||
SubTotal | 1270.493000 | 100.0000000 | 6.248346 | |||||||
Substrate | Copper Foil | Copper and its compounds | Copper, metal | 7440-50-8 | 1810.635918 | 99.990000 | 8.904794 | |||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.181082 | 0.010000 | 0.000891 | ||||||
SubTotal | 1810.817000 | 100.0000000 | 8.905685 | |||||||
Solder 1 | Copper and its compounds | Copper, metal | 7440-50-8 | 0.307565 | 0.500000 | 0.001513 | ||||
Silver and its compounds | Silver, metal | 7440-22-4 | 1.845390 | 3.000000 | 0.009076 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 59.360045 | 96.500000 | 0.291936 | |||||
SubTotal | 61.513000 | 100.0000000 | 0.302524 | |||||||
Solder 2 | Copper and its compounds | Copper, metal | 7440-50-8 | 0.088004 | 0.700000 | 0.000433 | ||||
Tin and its compounds | Tin, metal | 7440-31-5 | 12.483996 | 99.300000 | 0.061397 | |||||
SubTotal | 12.572000 | 100.0000000 | 0.061830 | |||||||
Solder Mask | Barium and its compounds | Barium sulfate | 7727-43-7 | 19.836820 | 23.500000 | 0.097558 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 13.083860 | 15.500000 | 0.064347 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 4.220600 | 5.000000 | 0.020757 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 47.270720 | 56.000000 | 0.232480 | ||||||
SubTotal | 84.412000 | 100.0000000 | 0.415142 | |||||||
Substrate Build Up | Epoxy Resins | 1,6-Bis(2,3-epoxypropoxy) naphthalene | 27610-48-6 | 22.943900 | 5.000000 | 0.112839 | ||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 298.270700 | 65.000000 | 1.466910 | |||||
Isocyanates | Proprietary Material-Other isocyanate compounds | 34.415850 | 7.500000 | 0.169259 | ||||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 11.471950 | 2.500000 | 0.056420 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 91.775600 | 20.000000 | 0.451357 | ||||||
SubTotal | 458.878000 | 100.0000000 | 2.256784 | |||||||
Substrate Core | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 804.105120 | 39.000000 | 3.954627 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 742.250880 | 36.000000 | 3.650425 | |||||
Polymers | Plastic: PI - Polyimide | 515.452000 | 25.000000 | 2.535018 | ||||||
SubTotal | 2061.808000 | 100.0000000 | 10.140071 | |||||||
Thermally Conductive Gel | Thermally Conductive Gel | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 32.511600 | 72.000000 | 0.159894 | |||
Organic Silicon compounds | Proprietary Material-Other siloxanes and silicones | 4.515500 | 10.000000 | 0.022207 | ||||||
Zinc and its compounds | Zinc oxide | 1314-13-2 | 8.127900 | 18.000000 | 0.039973 | |||||
SubTotal | 45.155000 | 100.0000000 | 0.222074 | |||||||
Underfill | Underfill | Aromatic amines and their salts | 6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine | 106264-79-3 | 0.879942 | 2.099800 | 0.004328 | |||
Epoxy Resins | 1,6-Bis(2,3-epoxypropoxy) naphthalene | 27610-48-6 | 1.466584 | 3.499700 | 0.007213 | |||||
Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 7.961344 | 18.998100 | 0.039154 | |||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 28.074170 | 66.993200 | 0.138070 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.033525 | 0.080000 | 0.000165 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.770987 | 1.839800 | 0.003792 | ||||||
Organic compounds | Other organic compounds. | 2.639827 | 6.299400 | 0.012983 | ||||||
Phosphorus compounds | Triphenyl phosphine | 603-35-0 | 0.079621 | 0.190000 | 0.000392 | |||||
SubTotal | 41.906000 | 100.0000000 | 0.206096 | |||||||
Total | 20333.271000 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |