NXP Semiconductors Product Content Declaration of MC06XS3517AFKR2 | Last Revision (GMT): Sunday, 11 December 2022, 10:50:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MC06XS3517AFKR2 | SOT1631 | HQFN24 | 927.420121 mg | Yes | No | Yes | Other | Cu alloy | e4 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9340 704 83528 | 2023-11-24 | 6 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | Tianjin, China |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Al | Bonding Wire - Al | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 0.027444 | 99.990000 | 0.002959 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000003 | 0.010000 | 0.000000 | ||||||
SubTotal | 0.027447 | 100.0000000 | 0.002959 | |||||||
Bonding Wire - Au | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 2.142460 | 99.990000 | 0.231013 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000214 | 0.010000 | 0.000023 | ||||||
SubTotal | 2.142674 | 100.0000000 | 0.231036 | |||||||
Copper Lead-Frame, Pre-Plated | Copper Lead-Frame, Pre-Plated | Copper and its compounds | Copper, metal | 7440-50-8 | 416.885363 | 97.221400 | 44.951080 | |||
Gold and its compounds | Gold, metal | 7440-57-5 | 0.038163 | 0.008900 | 0.004115 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.006432 | 0.001500 | 0.000693 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 7.015597 | 1.636100 | 0.756464 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.170234 | 0.039700 | 0.018356 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 4.258413 | 0.993100 | 0.459168 | |||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.425798 | 0.099300 | 0.045912 | |||||
SubTotal | 428.800000 | 100.0000000 | 46.235788 | |||||||
Die Encapsulant | Die Encapsulant | Aluminum and its compounds | Aluminum Hydroxide | 21645-51-2 | 14.016300 | 3.000000 | 1.511321 | |||
Epoxy Resins | Proprietary Material-Other Epoxy resins | 14.016300 | 3.000000 | 1.511321 | ||||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 352.743550 | 75.500000 | 38.034925 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 70.081500 | 15.000000 | 7.556608 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 2.336050 | 0.500000 | 0.251887 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 14.016300 | 3.000000 | 1.511321 | ||||||
SubTotal | 467.210000 | 100.0000000 | 50.377384 | |||||||
Epoxy Adhesive | Epoxy Adhesive | Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.142285 | 9.950000 | 0.015342 | ||||
Palladium and its compounds | Proprietary Material-Other palladium compounds | 0.000715 | 0.050000 | 0.000077 | ||||||
Polymers | Amines, C36-alkylenedi-, maleated | 682800-79-9 | 0.143000 | 10.000000 | 0.015419 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 1.144000 | 80.000000 | 0.123353 | |||||
SubTotal | 1.430000 | 100.0000000 | 0.154191 | |||||||
Semiconductor Die 1 | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 14.798000 | 98.000000 | 1.595609 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.302000 | 2.000000 | 0.032564 | ||||||
SubTotal | 15.100000 | 100.0000000 | 1.628173 | |||||||
Semiconductor Die 2 | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 9.114000 | 98.000000 | 0.982726 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.186000 | 2.000000 | 0.020056 | ||||||
SubTotal | 9.300000 | 100.0000000 | 1.002782 | |||||||
Solder Paste 1 | Solder Paste | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 2.229250 | 92.500000 | 0.240371 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.060250 | 2.500000 | 0.006496 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.120500 | 5.000000 | 0.012993 | |||||
SubTotal | 2.410000 | 100.0000000 | 0.259861 | |||||||
Solder Paste 2 | Solder Paste | Antimony and its compounds | Antimony, metal | 7440-36-0 | 0.000018 | 0.001800 | 0.000002 | |||
Arsenic and its compounds | Arsenic, metal | 7440-38-2 | 0.000010 | 0.001000 | 0.000001 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.880026 | 88.002600 | 0.094890 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.019991 | 1.999100 | 0.002155 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.099955 | 9.995500 | 0.010778 | |||||
SubTotal | 1.000000 | 100.0000000 | 0.107826 | |||||||
Total | 927.420121 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |