NXP Semiconductors Product Content Declaration of MC33PF3000A7ESR2 | Last Revision (GMT): Wednesday, 06 March 2024, 08:29:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MC33PF3000A7ESR2 | SOT619-23 | HVQFN48 | 143.217468 mg | Yes | Yes | Yes | Other | Cu alloy | e4 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 187 93528 | 2023-11-24 | 3 | 3 / 168 hours | 260 | 40 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | External manufacturing |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - CuPd | Bonding Wire - CuPd | Copper and its compounds | Copper, metal | 7440-50-8 | 0.567905 | 97.901500 | 0.396533 | |||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.012173 | 2.098500 | 0.008500 | |||||
SubTotal | 0.580078 | 100.0000000 | 0.405033 | |||||||
Copper Lead-Frame, Pre-Plated | Copper Lead-Frame, Pre-Plated | Copper and its compounds | Copper, metal | 7440-50-8 | 73.042054 | 97.001400 | 51.000800 | |||
Iron and its compounds | Iron, metal | 7439-89-6 | 1.956896 | 2.598800 | 1.366381 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.150525 | 0.199900 | 0.105102 | |||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.150525 | 0.199900 | 0.105102 | |||||
SubTotal | 75.300000 | 100.0000000 | 52.577385 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 1.592500 | 2.500000 | 1.111945 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 50.960000 | 80.000000 | 35.582252 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 6.051500 | 9.500000 | 4.225392 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.318500 | 0.500000 | 0.222389 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 4.777500 | 7.500000 | 3.335836 | ||||||
SubTotal | 63.700000 | 100.0000000 | 44.477815 | |||||||
Epoxy Adhesive | Epoxy Adhesive | Polymers | Plastic: ABAK - Acrylonitrile-butadiene-acrylate | 0.124476 | 15.180000 | 0.086914 | ||||
Polymers | Plastic: EP - Epoxide, Epoxy | 0.057072 | 6.960000 | 0.039850 | ||||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.638452 | 77.860000 | 0.445792 | |||||
SubTotal | 0.820000 | 100.0000000 | 0.572556 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 2.761042 | 98.000000 | 1.927867 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.056348 | 2.000000 | 0.039344 | ||||||
SubTotal | 2.817390 | 100.0000000 | 1.967211 | |||||||
Total | 143.217468 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |