NXP Semiconductors Product Content Declaration of MC7448HX1000ND | Last Revision (GMT): Tuesday, 26 December 2023, 05:09:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MC7448HX1000ND | SOT1603-2 | CBGA360 | 3591.073300 mg | No | No | No | Nickel/Gold (Ni/Au) | Other | e0 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 239 67157 | 2023-11-24 | 14 | Not Applicable | Not Applicable | Not Applicable | 1 / Unlimited | 260 | 40 sec. | 3 | Kuala Lumpur, Malaysia |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Capacitor | Capacitor | Barium and its compounds | Barium titanate | 12047-27-7 | 53.366400 | 65.400000 | 1.486085 | |||
Copper and its compounds | Copper, metal | 7440-50-8 | 11.260800 | 13.800000 | 0.313578 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 15.912000 | 19.500000 | 0.443099 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 1.060800 | 1.300000 | 0.029540 | |||||
SubTotal | 81.600000 | 100.0000000 | 2.272301 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 114.523170 | 89.100000 | 3.189107 | ||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 12.104881 | 9.417700 | 0.337083 | |||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 1.156800 | 0.900000 | 0.032213 | ||||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.106040 | 0.082500 | 0.002953 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.637011 | 0.495600 | 0.017739 | |||||
Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.005398 | 0.004200 | 0.000150 | |||||
SubTotal | 128.533300 | 100.0000000 | 3.579245 | |||||||
Solder Ball - High Lead | Solder Ball - High Lead | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 1297.690930 | 89.500000 | 36.136576 | |||
Tin and its compounds | Tin, metal | 7440-31-5 | 152.243070 | 10.500000 | 4.239487 | |||||
SubTotal | 1449.934000 | 100.0000000 | 40.376063 | |||||||
Solder Flux | Solder Flux | Copper and its compounds | Copper, metal | 7440-50-8 | 29.239500 | 96.500000 | 0.814227 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.909000 | 3.000000 | 0.025313 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.151500 | 0.500000 | 0.004219 | |||||
SubTotal | 30.300000 | 100.0000000 | 0.843759 | |||||||
Solder Paste | Solder Paste | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 4.662000 | 37.000000 | 0.129822 | |||
Tin and its compounds | Tin, metal | 7440-31-5 | 7.938000 | 63.000000 | 0.221048 | |||||
SubTotal | 12.600000 | 100.0000000 | 0.350870 | |||||||
Substrate, Pre-plated NiAu | Substrate, Pre-plated NiAu | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 45.263585 | 2.436400 | 1.260447 | |||
Barium and its compounds | Barium oxide | 1304-28-5 | 269.785014 | 14.521700 | 7.512657 | |||||
Barium and its compounds | Barium titanate | 12047-27-7 | 99.615558 | 5.362000 | 2.773977 | |||||
Boron and its compounds | Boron oxide | 1303-86-2 | 59.442361 | 3.199600 | 1.655281 | |||||
Calcium and its compounds | Calcium monoxide | 1305-78-8 | 32.879451 | 1.769800 | 0.915588 | |||||
Chromium and Chromium III compounds | Dichromium trioxide | 1308-38-9 | 5.742478 | 0.309100 | 0.159910 | |||||
Copper and its compounds | Copper, metal | 7440-50-8 | 265.134926 | 14.271400 | 7.383167 | |||||
Copper and its compounds | Cuprous oxide | 1317-39-1 | 1.436084 | 0.077300 | 0.039990 | |||||
Gold and its compounds | Gold, metal | 7440-57-5 | 1.690603 | 0.091000 | 0.047078 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 1002.652325 | 53.969700 | 27.920687 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.018578 | 0.001000 | 0.000517 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 22.880739 | 1.231600 | 0.637156 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.146767 | 0.007900 | 0.004087 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 1.162987 | 0.062600 | 0.032385 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.479314 | 0.025800 | 0.013347 | |||||
Strontium and its compounds | Strontium Oxide | 1314-11-0 | 3.589281 | 0.193200 | 0.099950 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 17.312894 | 0.931900 | 0.482109 | |||||
Zirconium and its compounds | Zirconium oxide | 1314-23-4 | 28.573056 | 1.538000 | 0.795669 | |||||
SubTotal | 1857.806000 | 100.0000000 | 51.734004 | |||||||
Underfill | Underfill | Aliphatic Amines | Proprietary Material-Other aliphatic amines | 0.909000 | 3.000000 | 0.025313 | ||||
Epoxy Resins | (Chloromethyl)oxirane,homopolymer | 61788-97-4 | 8.787000 | 29.000000 | 0.244690 | |||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 10.302000 | 34.000000 | 0.286878 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 10.302000 | 34.000000 | 0.286878 | |||||
SubTotal | 30.300000 | 100.0000000 | 0.843759 | |||||||
Total | 3591.073300 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |