NXP Semiconductors Product Content Declaration of MC8641DTVU1000GE | Last Revision (GMT): Thursday, 07 March 2024, 11:20:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MC8641DTVU1000GE | SOT1601-1 | CBGA1023 | 5410.438000 mg | Yes | No | Yes | Tin/Silver (Sn/Ag) | Other | e2 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 243 24557 | 2023-11-24 | 5 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 245 | 30 sec. | 3 | Kuala Lumpur, Malaysia |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Capacitor | Capacitor | Barium and its compounds | Barium titanate | 12047-27-7 | 95.614800 | 65.400000 | 1.767229 | |||
Copper and its compounds | Copper, metal | 7440-50-8 | 20.175600 | 13.800000 | 0.372901 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 28.509000 | 19.500000 | 0.526926 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 1.900600 | 1.300000 | 0.035128 | |||||
SubTotal | 146.200000 | 100.0000000 | 2.702184 | |||||||
Ceramic Substrate | Ceramic Substrate | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 106.696956 | 2.722000 | 1.972058 | |||
Barium and its compounds | Barium oxide | 1304-28-5 | 636.869505 | 16.247500 | 11.771127 | |||||
Boron and its compounds | Boron oxide | 1303-86-2 | 140.281802 | 3.578800 | 2.592799 | |||||
Calcium and its compounds | Calcium monoxide | 1305-78-8 | 77.525804 | 1.977800 | 1.432893 | |||||
Chromium and Chromium III compounds | Dichromium trioxide | 1308-38-9 | 13.582107 | 0.346500 | 0.251035 | |||||
Copper and its compounds | Copper, metal | 7440-50-8 | 496.231001 | 12.659600 | 9.171734 | |||||
Copper and its compounds | Cuprous oxide | 1317-39-1 | 3.135840 | 0.080000 | 0.057959 | |||||
Gold and its compounds | Gold, metal | 7440-57-5 | 2.297003 | 0.058600 | 0.042455 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 2347.015528 | 59.875900 | 43.379400 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.039198 | 0.001000 | 0.000724 | |||||
Magnesium and its compounds | Magnesium-oxide | 1309-48-4 | 3.135840 | 0.080000 | 0.057959 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 15.879110 | 0.405100 | 0.293490 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.195990 | 0.005000 | 0.003622 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 1.567920 | 0.040000 | 0.028979 | |||||
Strontium and its compounds | Strontium Oxide | 1314-11-0 | 8.372693 | 0.213600 | 0.154751 | |||||
Titanium and its compounds | Titanium (IV) Oxide | 13463-67-7 | 0.062717 | 0.001600 | 0.001159 | |||||
Zinc and its compounds | Zinc oxide | 1314-13-2 | 0.050957 | 0.001300 | 0.000942 | |||||
Zirconium and its compounds | Zirconium oxide | 1314-23-4 | 66.860029 | 1.705700 | 1.235760 | |||||
SubTotal | 3919.800000 | 100.0000000 | 72.448848 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 309.444300 | 89.100000 | 5.719395 | ||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 32.707672 | 9.417700 | 0.604529 | |||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 3.125700 | 0.900000 | 0.057772 | ||||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.286523 | 0.082500 | 0.005296 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 1.721219 | 0.495600 | 0.031813 | |||||
Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.014587 | 0.004200 | 0.000270 | |||||
SubTotal | 347.300000 | 100.0000000 | 6.419074 | |||||||
Solder Ball - Lead Free | Solder Ball - Lead Free | Silver and its compounds | Silver, metal | 7440-22-4 | 30.036930 | 3.500000 | 0.555166 | |||
Tin and its compounds | Tin, metal | 7440-31-5 | 828.161070 | 96.500000 | 15.306729 | |||||
SubTotal | 858.198000 | 100.0000000 | 15.861895 | |||||||
Solder Flux | Solder Flux | Copper and its compounds | Copper, metal | 7440-50-8 | 51.531000 | 96.500000 | 0.952437 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 1.602000 | 3.000000 | 0.029609 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.267000 | 0.500000 | 0.004935 | |||||
SubTotal | 53.400000 | 100.0000000 | 0.986981 | |||||||
Solder Paste | Solder Paste | Copper and its compounds | Copper, metal | 7440-50-8 | 0.598780 | 0.700000 | 0.011067 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 3.250520 | 3.800000 | 0.060079 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 81.690700 | 95.500000 | 1.509872 | |||||
SubTotal | 85.540000 | 100.0000000 | 1.581018 | |||||||
Total | 5410.438000 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |