NXP Semiconductors Product Content Declaration of MMA8453QR1 | Last Revision (GMT): Sunday, 30 July 2023, 05:52:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MMA8453QR1 | SOT1676-1 | VQFN16 | 33.949443 mg | Yes | No | Yes | Tin (Sn) | Cu alloy | e3 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 101 97167 | 2023-11-24 | 18 | Not Applicable | Not Applicable | Not Applicable | 1 / Unlimited | 260 | 40 sec. | 3 | External manufacturing |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - CuPdAu | Bonding Wire - CuPdAu | Copper and its compounds | Copper, metal | 7440-50-8 | 0.053410 | 96.542900 | 0.157323 | |||
Gold and its compounds | Gold, metal | 7440-57-5 | 0.000194 | 0.350700 | 0.000571 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.001719 | 3.106400 | 0.005062 | |||||
SubTotal | 0.055323 | 100.0000000 | 0.162957 | |||||||
Copper Lead-Frame | Copper Lead-Frame | Copper and its compounds | Copper, metal | 7440-50-8 | 13.732205 | 94.056200 | 40.448985 | |||
Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.105850 | 0.725000 | 0.311787 | |||||
Iron and its compounds | Iron, metal | 7439-89-6 | 0.018250 | 0.125000 | 0.053756 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.004570 | 0.031300 | 0.013461 | |||||
Magnesium and its compounds | Magnesium, metal | 7439-95-4 | 0.025550 | 0.175000 | 0.075259 | |||||
Manganese and its compounds | Manganese, metal | 7439-96-5 | 0.009125 | 0.062500 | 0.026878 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.467200 | 3.200000 | 1.376164 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.146000 | 1.000000 | 0.430051 | |||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.091250 | 0.625000 | 0.268782 | |||||
SubTotal | 14.600000 | 100.0000000 | 43.005124 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.342500 | 2.500000 | 1.008853 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 10.960000 | 80.000000 | 32.283298 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 1.301500 | 9.500000 | 3.833642 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.068500 | 0.500000 | 0.201771 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 1.027500 | 7.500000 | 3.026559 | ||||||
SubTotal | 13.700000 | 100.0000000 | 40.354123 | |||||||
Epoxy Adhesive | Epoxy Adhesive | Acrylonitrile compounds | Acrylonitrile/Butadiene copolymer, carboxyl terminated (26/74) | 68891-46-3 | 0.017500 | 2.500000 | 0.051547 | |||
Aromatic amines and their salts | 4,4'-Diaminodiphenylsulfone | 80-08-0 | 0.017500 | 2.500000 | 0.051547 | |||||
Epoxy Resins | Formaldehyde, cresol, epichlorohydrin polymer | 37382-79-9 | 0.175000 | 25.000000 | 0.515472 | |||||
Organic Silicon compounds | Dimethyl silicone polymer with silica | 67762-90-7 | 0.017500 | 2.500000 | 0.051547 | |||||
Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 0.017500 | 2.500000 | 0.051547 | |||||
Polymers | 2-Propenenitrile, polymer with 1,3-butadiene, carboxy-terminated, polymers with bisphenol A and epichlorohydrin | 68610-41-3 | 0.455000 | 65.000000 | 1.340228 | |||||
SubTotal | 0.700000 | 100.0000000 | 2.061889 | |||||||
Post-plating - Lead Free | Post-plating - Lead Free | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000320 | 0.020000 | 0.000943 | |||
Tin and its compounds | Tin, metal | 7440-31-5 | 1.599680 | 99.980000 | 4.711948 | |||||
SubTotal | 1.600000 | 100.0000000 | 4.712890 | |||||||
Semiconductor Die 1 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.490000 | 98.000000 | 1.443323 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.010000 | 2.000000 | 0.029456 | ||||||
SubTotal | 0.500000 | 100.0000000 | 1.472778 | |||||||
Semiconductor Die 2 | Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 2.724546 | 98.000000 | 8.025305 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.055603 | 2.000000 | 0.163782 | ||||||
SubTotal | 2.780149 | 100.0000000 | 8.189087 | |||||||
Glass | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.000140 | 1.000000 | 0.000411 | ||||
Boron and its compounds | Boron oxide | 1303-86-2 | 0.001118 | 8.000000 | 0.003292 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.000419 | 3.000000 | 0.001234 | |||||
Lead and its compounds | Lead monooxide | 1317-36-8 | 0.007474 | 53.500000 | 0.022016 | |||||
Lead and its compounds | Lead titanium oxide (PbTiO3) | 12060-00-3 | 0.004820 | 34.500000 | 0.014197 | |||||
SubTotal | 0.013971 | 100.0000000 | 0.041151 | |||||||
Total | 33.949443 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |