NXP Semiconductors Product Content Declaration of MMRF1305HR5 | Last Revision (GMT): Thursday, 24 August 2023, 02:08:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MMRF1305HR5 | SOT1827-1 | CFM4F | 6622.047179 mg | Yes | Yes | Yes | N/A | Not Applicable | e4 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 203 41178 | 2023-11-24 | 7 | NA / Not Available | 260 | 40 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | Kuala Lumpur, Malaysia |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Al | Bonding Wire - Al | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 16.042226 | 98.845000 | 0.242255 | |||
Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.186641 | 1.150000 | 0.002818 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.000812 | 0.005000 | 0.000012 | |||||
SubTotal | 16.229679 | 100.0000000 | 0.245086 | |||||||
Cap | Ceramic | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 748.984822 | 96.000000 | 11.310472 | |||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 23.405776 | 3.000000 | 0.353452 | |||||
Inorganic compounds | Other inorganic compounds | 7.801925 | 1.000000 | 0.117817 | ||||||
SubTotal | 780.192522 | 100.0000000 | 11.781742 | |||||||
Epoxy | Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 11.981240 | 45.000000 | 0.180929 | ||||
Phenols and Phenolic Resins | 2-[[4-[2-[4-[1,1-bis[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenyl]propan-2-yl]phenoxy]methyl]oxirane | 115254-47-2 | 14.643738 | 55.000000 | 0.221136 | |||||
SubTotal | 26.624977 | 100.0000000 | 0.402066 | |||||||
Header Assembly/Flange | Ceramic | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 239.010024 | 89.400000 | 3.609307 | |||
Chromium and Chromium III compounds | Dichromium trioxide | 1308-38-9 | 16.040941 | 6.000000 | 0.242235 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 8.020471 | 3.000000 | 0.121118 | |||||
Inorganic compounds | Other inorganic compounds | 4.277584 | 1.600000 | 0.064596 | ||||||
SubTotal | 267.349020 | 100.0000000 | 4.037256 | |||||||
Conductor | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 6.579851 | 18.400000 | 0.099363 | ||||
Inorganic compounds | Other inorganic compounds | 0.500641 | 1.400000 | 0.007560 | ||||||
Molybdenum and its compounds | Molybdenum, metal | 7439-98-7 | 0.894002 | 2.500000 | 0.013500 | |||||
Tungsten and its compounds | Tungsten, metal | 7440-33-7 | 27.785567 | 77.700000 | 0.419592 | |||||
SubTotal | 35.760060 | 100.0000000 | 0.540015 | |||||||
Flange | Copper and its compounds | Copper, metal | 7440-50-8 | 2631.543082 | 51.800000 | 39.739117 | ||||
Molybdenum and its compounds | Molybdenum, metal | 7439-98-7 | 2448.655918 | 48.200000 | 36.977325 | |||||
SubTotal | 5080.199000 | 100.0000000 | 76.716442 | |||||||
Gold Plating | Gold and its compounds | Gold, metal | 7440-57-5 | 9.081829 | 99.999000 | 0.137145 | ||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000091 | 0.001000 | 0.000001 | |||||
SubTotal | 9.081920 | 100.0000000 | 0.137147 | |||||||
Iron Alloy | Iron and its compounds | Iron, metal | 7439-89-6 | 105.679492 | 58.000000 | 1.595873 | ||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 76.526528 | 42.000000 | 1.155633 | |||||
SubTotal | 182.206020 | 100.0000000 | 2.751506 | |||||||
Metal Braze | Copper and its compounds | Copper, metal | 7440-50-8 | 6.516278 | 28.000000 | 0.098403 | ||||
Silver and its compounds | Silver, metal | 7440-22-4 | 16.756142 | 72.000000 | 0.253036 | |||||
SubTotal | 23.272420 | 100.0000000 | 0.351438 | |||||||
Nickel Cobalt Plating | Cobalt and its compounds | Cobalt, metal | 7440-48-4 | 22.137180 | 30.000000 | 0.334295 | ||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 51.653420 | 70.000000 | 0.780022 | |||||
SubTotal | 73.790600 | 100.0000000 | 1.114317 | |||||||
Palladium Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.004541 | 0.100000 | 0.000069 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 4.536419 | 99.900000 | 0.068505 | |||||
SubTotal | 4.540960 | 100.0000000 | 0.068573 | |||||||
Semiconductor Die | Semiconductor Die | Gold and its compounds | Gold, metal | 7440-57-5 | 1.252560 | 1.020000 | 0.018915 | |||
Inorganic Silicon compounds | Silicon, doped | 119.116491 | 97.000400 | 1.798787 | ||||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 2.430949 | 1.979600 | 0.036710 | ||||||
SubTotal | 122.800000 | 100.0000000 | 1.854411 | |||||||
Total | 6622.047179 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |