NXP Semiconductors Product Content Declaration of MPC8314CVRAFDA | Last Revision (GMT): Monday, 11 September 2023, 10:43:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MPC8314CVRAFDA | SOT1627-1 | HBGA620 | 4269.141408 mg | Yes | Yes | Yes | Nickel/Gold (Ni/Au) | Other | e2 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 228 38557 | 2023-11-24 | 8 | 3 / 168 hours | 260 | 40 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | Kuala Lumpur, Malaysia |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Cu | Bonding Wire - Cu | Copper and its compounds | Copper, metal | 7440-50-8 | 7.683766 | 97.000000 | 0.179984 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.237642 | 3.000000 | 0.005567 | ||||||
SubTotal | 7.921408 | 100.0000000 | 0.185550 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 57.335000 | 5.000000 | 1.343010 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 768.289000 | 67.000000 | 17.996335 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 286.675000 | 25.000000 | 6.715051 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 5.733500 | 0.500000 | 0.134301 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 28.667500 | 2.500000 | 0.671505 | ||||||
SubTotal | 1146.700000 | 100.0000000 | 26.860202 | |||||||
Epoxy Adhesive 1 | Epoxy Adhesive | Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 1.116000 | 12.000000 | 0.026141 | |||
Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.651000 | 7.000000 | 0.015249 | ||||||
Silver and its compounds | Silver, metal | 7440-22-4 | 7.533000 | 81.000000 | 0.176452 | |||||
SubTotal | 9.300000 | 100.0000000 | 0.217842 | |||||||
Epoxy Adhesive 2 | Epoxy Adhesive | Inorganic Silicon compounds | Proprietary Material-Other silica compounds | 1.255632 | 21.281900 | 0.029412 | ||||
Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.047271 | 0.801200 | 0.001107 | |||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 1.255632 | 21.281900 | 0.029412 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.047271 | 0.801200 | 0.001107 | |||||
Organic Silicon compounds | Dimethyl silicone polymer with silica | 67762-90-7 | 0.590885 | 10.015000 | 0.013841 | |||||
Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.339757 | 5.758600 | 0.007958 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 2.363552 | 40.060200 | 0.055364 | |||||
SubTotal | 5.900000 | 100.0000000 | 0.138201 | |||||||
Heat Spreader | Heat Spreader | Copper and its compounds | Copper, metal | 7440-50-8 | 1083.930660 | 96.970000 | 25.389898 | |||
Copper and its compounds | Cupric oxide | 1317-38-0 | 1.117800 | 0.100000 | 0.026183 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 3.912300 | 0.350000 | 0.091641 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.335340 | 0.030000 | 0.007855 | |||||
Polymers | Acrylonitrile-methyl-methacrylate-vinylidene chloride copolymer | 25036-25-3 | 28.503900 | 2.550000 | 0.667673 | |||||
SubTotal | 1117.800000 | 100.0000000 | 26.183251 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 29.400000 | 98.000000 | 0.688663 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.600000 | 2.000000 | 0.014054 | ||||||
SubTotal | 30.000000 | 100.0000000 | 0.702717 | |||||||
Solder Ball - Lead Free | Solder Ball - Lead Free | Silver and its compounds | Silver, metal | 7440-22-4 | 18.204200 | 3.500000 | 0.426414 | |||
Tin and its compounds | Tin, metal | 7440-31-5 | 501.915800 | 96.500000 | 11.756832 | |||||
SubTotal | 520.120000 | 100.0000000 | 12.183246 | |||||||
Substrate, Pre-plated NiAu | Substrate, Pre-plated NiAu | Acrylates | Other acrylates | 17.934011 | 1.252900 | 0.420085 | ||||
Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 93.298652 | 6.518000 | 2.185420 | |||||
Barium and its compounds | Barium | 7440-39-3 | 16.120427 | 1.126200 | 0.377603 | |||||
Copper and its compounds | Copper, metal | 7440-50-8 | 876.230079 | 61.214900 | 20.524738 | |||||
Epoxy Resins | Bisphenol A diglycidyl ether | 1675-54-3 | 1.754896 | 0.122600 | 0.041106 | |||||
Epoxy Resins | Other Non-halogenated Epoxy resins | 78.900199 | 5.512100 | 1.848151 | ||||||
Gold and its compounds | Gold, metal | 7440-57-5 | 2.270200 | 0.158600 | 0.053177 | |||||
Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 201.041561 | 14.045100 | 4.709180 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 114.769652 | 8.018000 | 2.688354 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 15.137055 | 1.057500 | 0.354569 | ||||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 13.453729 | 0.939900 | 0.315139 | |||||
Organic Silicon compounds | Other organic Silicon Compounds | 0.489539 | 0.034200 | 0.011467 | ||||||
SubTotal | 1431.400000 | 100.0000000 | 33.528990 | |||||||
Total | 4269.141408 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |