NXP Semiconductors Product Content Declaration of MPC8347ZQADDB | Last Revision (GMT): Thursday, 30 November 2023, 11:32:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MPC8347ZQADDB | SOT1627-1 | HBGA620 | 4367.477408 mg | No | No | No | Tin/Lead (Sn63/Pb37) | Other | e0 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 191 71557 | 2023-11-24 | 9 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | Kuala Lumpur, Malaysia |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Cu | Bonding Wire - Cu | Copper and its compounds | Copper, metal | 7440-50-8 | 7.683766 | 97.000000 | 0.175931 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.237642 | 3.000000 | 0.005441 | ||||||
SubTotal | 7.921408 | 100.0000000 | 0.181373 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 57.335000 | 5.000000 | 1.312771 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 768.289000 | 67.000000 | 17.591138 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 286.675000 | 25.000000 | 6.563858 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 5.733500 | 0.500000 | 0.131277 | |||||
Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 28.667500 | 2.500000 | 0.656386 | ||||||
SubTotal | 1146.700000 | 100.0000000 | 26.255431 | |||||||
Epoxy Adhesive 1 | Epoxy Adhesive | Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 1.116000 | 12.000000 | 0.025552 | |||
Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.651000 | 7.000000 | 0.014906 | ||||||
Silver and its compounds | Silver, metal | 7440-22-4 | 7.533000 | 81.000000 | 0.172479 | |||||
SubTotal | 9.300000 | 100.0000000 | 0.212938 | |||||||
Epoxy Adhesive 2 | Epoxy Adhesive | Inorganic Silicon compounds | Proprietary Material-Other silica compounds | 1.255632 | 21.281900 | 0.028750 | ||||
Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.047271 | 0.801200 | 0.001082 | |||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 1.255632 | 21.281900 | 0.028750 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.047271 | 0.801200 | 0.001082 | |||||
Organic Silicon compounds | Dimethyl silicone polymer with silica | 67762-90-7 | 0.590885 | 10.015000 | 0.013529 | |||||
Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.339757 | 5.758600 | 0.007779 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 2.363552 | 40.060200 | 0.054117 | |||||
SubTotal | 5.900000 | 100.0000000 | 0.135089 | |||||||
Heat Spreader | Heat Spreader | Copper and its compounds | Copper, metal | 7440-50-8 | 1083.930660 | 96.970000 | 24.818232 | |||
Copper and its compounds | Cupric oxide | 1317-38-0 | 1.117800 | 0.100000 | 0.025594 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 3.912300 | 0.350000 | 0.089578 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.335340 | 0.030000 | 0.007678 | |||||
Polymers | Acrylonitrile-methyl-methacrylate-vinylidene chloride copolymer | 25036-25-3 | 28.503900 | 2.550000 | 0.652640 | |||||
SubTotal | 1117.800000 | 100.0000000 | 25.593721 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 29.400000 | 98.000000 | 0.673157 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.600000 | 2.000000 | 0.013738 | ||||||
SubTotal | 30.000000 | 100.0000000 | 0.686895 | |||||||
Solder Ball - Low Lead | Solder Ball - Low Lead | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 222.644160 | 36.000000 | 5.097775 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 12.369120 | 2.000000 | 0.283210 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 383.442720 | 62.000000 | 8.779501 | |||||
SubTotal | 618.456000 | 100.0000000 | 14.160485 | |||||||
Substrate | Copper Core | Copper and its compounds | Copper, metal | 7440-50-8 | 277.520705 | 99.990000 | 6.354256 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.027755 | 0.010000 | 0.000635 | ||||||
SubTotal | 277.548460 | 100.0000000 | 6.354892 | |||||||
Copper Plating | Copper and its compounds | Copper, metal | 7440-50-8 | 441.784805 | 99.980000 | 10.115331 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.088375 | 0.020000 | 0.002024 | ||||||
SubTotal | 441.873180 | 100.0000000 | 10.117355 | |||||||
Gold Plating | Gold and its compounds | Gold, metal | 7440-57-5 | 1.574383 | 99.990000 | 0.036048 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000158 | 0.010000 | 0.000004 | ||||||
SubTotal | 1.574540 | 100.0000000 | 0.036052 | |||||||
Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.002877 | 0.030000 | 0.000066 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 9.587503 | 99.970000 | 0.219520 | |||||
SubTotal | 9.590380 | 100.0000000 | 0.219586 | |||||||
Solder Mask | Barium and its compounds | Barium sulfate | 7727-43-7 | 19.910488 | 29.100000 | 0.455881 | ||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.410525 | 0.600000 | 0.009400 | |||||
Magnesium and its compounds | Talc | 14807-96-6 | 2.052628 | 3.000000 | 0.046998 | |||||
Organic compounds | Other organic compounds. | 2.463153 | 3.600000 | 0.056398 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 13.410500 | 19.600000 | 0.307054 | ||||||
Polymers | Plastic: PAK | 30.173626 | 44.100000 | 0.690871 | ||||||
SubTotal | 68.420920 | 100.0000000 | 1.566600 | |||||||
Substrate Core | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 89.089391 | 47.620000 | 2.039836 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 8.905197 | 4.760000 | 0.203898 | |||||
Polymers | Plastic: PI - Polyimide | 89.089391 | 47.620000 | 2.039836 | ||||||
SubTotal | 187.083980 | 100.0000000 | 4.283571 | |||||||
Substrate Prepreg | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 142.498733 | 32.000000 | 3.262724 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 26.718512 | 6.000000 | 0.611761 | |||||
Polymers | Plastic: PI - Polyimide | 276.091295 | 62.000000 | 6.321528 | ||||||
SubTotal | 445.308540 | 100.0000000 | 10.196012 | |||||||
Total | 4367.477408 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |