NXP Semiconductors Product Content Declaration of MPC8533VTALFA | Last Revision (GMT): Wednesday, 06 March 2024, 07:25:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MPC8533VTALFA | SOT1622-4 | BGA783 | 3569.242000 mg | Yes | No | Yes | Tin/Silver (Sn/Ag) | Other | e2 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 215 47557 | 2024-02-06 | 6 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | Kuala Lumpur, Malaysia |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Capacitor | Capacitor | Barium and its compounds | Barium titanate | 12047-27-7 | 51.142800 | 65.400000 | 1.432876 | |||
Copper and its compounds | Copper, metal | 7440-50-8 | 10.791600 | 13.800000 | 0.302350 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 15.249000 | 19.500000 | 0.427234 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 1.016600 | 1.300000 | 0.028482 | |||||
SubTotal | 78.200000 | 100.0000000 | 2.190941 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 114.404400 | 89.100000 | 3.205286 | ||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 12.092327 | 9.417700 | 0.338793 | |||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 1.155600 | 0.900000 | 0.032377 | ||||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.105930 | 0.082500 | 0.002968 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.636350 | 0.495600 | 0.017829 | |||||
Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.005393 | 0.004200 | 0.000151 | |||||
SubTotal | 128.400000 | 100.0000000 | 3.597402 | |||||||
Solder Ball - Lead Free | Solder Ball - Lead Free | Silver and its compounds | Silver, metal | 7440-22-4 | 22.990170 | 3.500000 | 0.644119 | |||
Tin and its compounds | Tin, metal | 7440-31-5 | 633.871830 | 96.500000 | 17.759284 | |||||
SubTotal | 656.862000 | 100.0000000 | 18.403403 | |||||||
Solder Flux | Solder Flux | Copper and its compounds | Copper, metal | 7440-50-8 | 44.631250 | 96.500000 | 1.250441 | |||
Silver and its compounds | Silver, metal | 7440-22-4 | 1.387500 | 3.000000 | 0.038874 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.231250 | 0.500000 | 0.006479 | |||||
SubTotal | 46.250000 | 100.0000000 | 1.295793 | |||||||
Substrate | Copper Foil | Copper and its compounds | Copper, metal | 7440-50-8 | 325.980119 | 99.870000 | 9.133035 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.424326 | 0.130000 | 0.011888 | ||||||
SubTotal | 326.404445 | 100.0000000 | 9.144923 | |||||||
Copper Plating | Copper and its compounds | Copper, metal | 7440-50-8 | 905.472070 | 99.750000 | 25.368750 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 2.269354 | 0.250000 | 0.063581 | ||||||
SubTotal | 907.741424 | 100.0000000 | 25.432330 | |||||||
Insulation | Epoxy Resins | Bisphenol A diglycidyl ether | 1675-54-3 | 24.285466 | 10.450000 | 0.680410 | ||||
Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 24.285466 | 10.450000 | 0.680410 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 97.258061 | 41.850000 | 2.724894 | |||||
Polymers | Plastic: EP - Epoxide, Epoxy | 86.567808 | 37.250000 | 2.425384 | ||||||
SubTotal | 232.396801 | 100.0000000 | 6.511097 | |||||||
Solder Ball 1 | Copper and its compounds | Copper, metal | 7440-50-8 | 0.160193 | 0.500000 | 0.004488 | ||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.961158 | 3.000000 | 0.026929 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 30.917260 | 96.500000 | 0.866214 | |||||
SubTotal | 32.038611 | 100.0000000 | 0.897631 | |||||||
Solder Ball 2 | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 1.398425 | 37.000000 | 0.039180 | ||||
Tin and its compounds | Tin, metal | 7440-31-5 | 2.381102 | 63.000000 | 0.066712 | |||||
SubTotal | 3.779527 | 100.0000000 | 0.105892 | |||||||
Solder Mask | Barium and its compounds | Barium sulfate | 7727-43-7 | 13.593369 | 31.100000 | 0.380848 | ||||
Copper and its compounds | Copper phthalocyanine | 147-14-8 | 0.087417 | 0.200000 | 0.002449 | |||||
Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.218543 | 0.500000 | 0.006123 | |||||
Magnesium and its compounds | Talc | 14807-96-6 | 1.573509 | 3.600000 | 0.044085 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.480794 | 1.100000 | 0.013470 | ||||||
Organic compounds | Proprietary Material-Other organic compounds. | 0.043709 | 0.100000 | 0.001225 | ||||||
Polymers | Plastic: EP - Epoxide, Epoxy | 27.711240 | 63.400000 | 0.776390 | ||||||
SubTotal | 43.708581 | 100.0000000 | 1.224590 | |||||||
Substrate Core | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 330.756505 | 32.000000 | 9.266856 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 62.016845 | 6.000000 | 1.737535 | |||||
Polymers | Plastic: PI - Polyimide | 640.840729 | 62.000000 | 17.954533 | ||||||
SubTotal | 1033.614079 | 100.0000000 | 28.958924 | |||||||
Via Plugging | Calcium and its compounds | Calcium-carbonate | 471-34-1 | 25.712333 | 50.400000 | 0.720386 | ||||
Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 4.387422 | 8.600000 | 0.122923 | |||||
Epoxy Resins | Proprietary Material-Other Epoxy resins | 7.652480 | 15.000000 | 0.214401 | ||||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.510165 | 1.000000 | 0.014293 | ||||||
Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 12.754133 | 25.000000 | 0.357334 | |||||
SubTotal | 51.016534 | 100.0000000 | 1.429338 | |||||||
Underfill | Underfill | Aromatic amines and their salts | 4,4'-Methylenebis(2-ethylbenzenamine) | 19900-65-3 | 3.171300 | 11.000000 | 0.088851 | |||
Bismuth and its compounds | Bismuth nitrate | 10361-44-1 | 0.028830 | 0.100000 | 0.000808 | |||||
Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.230640 | 0.800000 | 0.006462 | |||||
Epoxy Resins | 1,6-Bis(2,3-epoxypropoxy) naphthalene | 27610-48-6 | 4.036200 | 14.000000 | 0.113083 | |||||
Epoxy Resins | Other Epoxy resins | 1.153200 | 4.000000 | 0.032309 | ||||||
Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 2.883000 | 10.000000 | 0.080773 | |||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 17.298000 | 60.000000 | 0.484641 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.028830 | 0.100000 | 0.000808 | |||||
SubTotal | 28.830000 | 100.0000000 | 0.807735 | |||||||
Total | 3569.242000 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |