NXP Semiconductors Product Content Declaration of MPXV2102GP | Last Revision (GMT): Thursday, 07 March 2024, 11:38:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
MPXV2102GP | SOT1693-3 | SO8 | 1925.234553 mg | Yes | Yes | Yes | Other | Cu alloy | e4 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 253 37117 | 2023-11-24 | 6 | NA / Not Available | 245 | 30 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | External manufacturing |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Au | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 185.272724 | 99.990000 | 9.623385 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.018529 | 0.010000 | 0.000962 | ||||||
SubTotal | 185.291253 | 100.0000000 | 9.624347 | |||||||
Cap | Cap | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 22.125400 | 11.300000 | 1.149231 | |||
Copper and its compounds | Copper, metal | 7440-50-8 | 1.468500 | 0.750000 | 0.076276 | |||||
Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.979000 | 0.500000 | 0.050851 | |||||
Inorganic compounds | Carbon | 7440-44-0 | 0.019580 | 0.010000 | 0.001017 | |||||
Inorganic compounds | Sulfur | 7704-34-9 | 0.009790 | 0.005000 | 0.000508 | |||||
Iron and its compounds | Iron, metal | 7439-89-6 | 169.680280 | 86.660000 | 8.813486 | |||||
Manganese and its compounds | Manganese, metal | 7439-96-5 | 0.489500 | 0.250000 | 0.025426 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.293700 | 0.150000 | 0.015255 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.342650 | 0.175000 | 0.017798 | |||||
Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.391600 | 0.200000 | 0.020340 | |||||
SubTotal | 195.800000 | 100.0000000 | 10.170189 | |||||||
Copper Lead-Frame, Pre-Plated | Copper Alloy | Copper and its compounds | Copper, metal | 7440-50-8 | 418.856402 | 97.600000 | 21.756123 | |||
Iron and its compounds | Iron, metal | 7439-89-6 | 10.299748 | 2.400000 | 0.534987 | |||||
SubTotal | 429.156150 | 100.0000000 | 22.291110 | |||||||
Gold Plating | Gold and its compounds | Gold, metal | 7440-57-5 | 0.237390 | 99.900000 | 0.012330 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000238 | 0.100000 | 0.000012 | ||||||
SubTotal | 0.237628 | 100.0000000 | 0.012343 | |||||||
Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.003010 | 0.100000 | 0.000156 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 3.006944 | 99.900000 | 0.156186 | |||||
SubTotal | 3.009955 | 100.0000000 | 0.156342 | |||||||
Palladium Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000396 | 0.100000 | 0.000021 | |||||
Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.395651 | 99.900000 | 0.020551 | |||||
SubTotal | 0.396047 | 100.0000000 | 0.020571 | |||||||
Polyimide Coating | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 197.611436 | 55.000000 | 10.264278 | ||||
Polymers | Polyphenylene Sulfide (PPS) | 26125-40-6 | 161.682084 | 45.000000 | 8.398046 | |||||
SubTotal | 359.293521 | 100.0000000 | 18.662325 | |||||||
Die Encapsulant | Die Encapsulant | Organic Silicon compounds | Dimethyl Cyclosiloxanes | 70900-21-9 | 0.112645 | 0.306100 | 0.005851 | |||
Organic Silicon compounds | Dimethyl Siloxane | 69430-24-6 | 1.689782 | 4.591800 | 0.087770 | |||||
Organic Silicon compounds | Proprietary Material-Other siloxanes and silicones | 34.997573 | 95.102100 | 1.817834 | ||||||
SubTotal | 36.800000 | 100.0000000 | 1.911455 | |||||||
Epoxy Adhesive 1 | Epoxy Adhesive | Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.060000 | 3.000000 | 0.003116 | |||
Organic Silicon compounds | Silanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica | 68937-51-9 | 0.500000 | 25.000000 | 0.025971 | |||||
Organic Silicon compounds | Siloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated | 68083-18-1 | 0.500000 | 25.000000 | 0.025971 | |||||
Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 0.940000 | 47.000000 | 0.048825 | |||||
SubTotal | 2.000000 | 100.0000000 | 0.103884 | |||||||
Epoxy Adhesive 2 | Epoxy Adhesive | Aluminum and its compounds | Proprietary Material-Other aluminum compounds | 9.315000 | 45.000000 | 0.483837 | ||||
Guanidine compounds | Other guanidine compounds | 0.517500 | 2.500000 | 0.026880 | ||||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.517500 | 2.500000 | 0.026880 | |||||
Phenols and Phenolic Resins | Other phenolic resins | 10.350000 | 50.000000 | 0.537597 | ||||||
SubTotal | 20.700000 | 100.0000000 | 1.075194 | |||||||
Port | Port | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 275.280000 | 40.000000 | 14.298518 | |||
Inorganic compounds | Carbon Black | 1333-86-4 | 3.441000 | 0.500000 | 0.178731 | |||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 6.882000 | 1.000000 | 0.357463 | ||||||
Polymers | Polyphenylene Sulfide (PPS) | 26125-40-6 | 402.597000 | 58.500000 | 20.911582 | |||||
SubTotal | 688.200000 | 100.0000000 | 35.746294 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 4.263000 | 98.000000 | 0.221428 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.087000 | 2.000000 | 0.004519 | ||||||
SubTotal | 4.350000 | 100.0000000 | 0.225946 | |||||||
Total | 1925.234553 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |