NXP Semiconductors Product Content Declaration of S9S08SL16F1CTJ | Last Revision (GMT): Thursday, 28 December 2023, 08:31:00 AM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
S9S08SL16F1CTJ | SOT360-2 | TSSOP20 | 78.450028 mg | Yes | Yes | Yes | Tin (Sn) | Cu alloy | e3 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 214 84574 | 2023-11-24 | 7 | 3 / 168 hours | 260 | 40 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | External manufacturing |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Bonding Wire - Au | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 0.399988 | 99.990000 | 0.509863 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000040 | 0.010000 | 0.000051 | ||||||
SubTotal | 0.400028 | 100.0000000 | 0.509914 | |||||||
Copper Lead-Frame | Copper Alloy | Copper and its compounds | Copper, metal | 7440-50-8 | 35.059785 | 97.291000 | 44.690596 | |||
Iron and its compounds | Iron, metal | 7439-89-6 | 0.854053 | 2.370000 | 1.088659 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.006126 | 0.017000 | 0.007809 | |||||
Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.059820 | 0.166000 | 0.076252 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 0.010811 | 0.030000 | 0.013780 | |||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.045405 | 0.126000 | 0.057878 | |||||
SubTotal | 36.036000 | 100.0000000 | 45.934974 | |||||||
Silver Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000036 | 0.010000 | 0.000046 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.363964 | 99.990000 | 0.463943 | |||||
SubTotal | 0.364000 | 100.0000000 | 0.463990 | |||||||
Die Encapsulant | Die Encapsulant | Epoxy Resins | Other Epoxy resins | 3.078000 | 9.000000 | 3.923517 | ||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 28.728000 | 84.000000 | 36.619490 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.171000 | 0.500000 | 0.217973 | |||||
Phenols and Phenolic Resins | Phenolic resin, Formaldehyde polymer with 1,1'-biphenyl and phenol | 628290-34-6 | 2.223000 | 6.500000 | 2.833651 | |||||
SubTotal | 34.200000 | 100.0000000 | 43.594631 | |||||||
Epoxy Adhesive | Epoxy Adhesive | Aliphatic Amines | Diaminopolypropylene glycol | 9046-10-0 | 0.017500 | 1.750000 | 0.022307 | |||
Copper and its compounds | Cupric oxide | 1317-38-0 | 0.017500 | 1.750000 | 0.022307 | |||||
Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 0.062500 | 6.250000 | 0.079669 | |||||
Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.055000 | 5.500000 | 0.070108 | ||||||
Polymers | Fatty acids, C18-unsatd., dimers, polymers with epichlorohydrin | 68475-94-5 | 0.062500 | 6.250000 | 0.079669 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 0.785000 | 78.500000 | 1.000637 | |||||
SubTotal | 1.000000 | 100.0000000 | 1.274697 | |||||||
Post-plating - Lead Free | Post-plating - Lead Free | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000560 | 0.020000 | 0.000714 | |||
Tin and its compounds | Tin, metal | 7440-31-5 | 2.799440 | 99.980000 | 3.568437 | |||||
SubTotal | 2.800000 | 100.0000000 | 3.569151 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 3.577000 | 98.000000 | 4.559590 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.073000 | 2.000000 | 0.093053 | ||||||
SubTotal | 3.650000 | 100.0000000 | 4.652643 | |||||||
Total | 78.450028 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |