NXP Semiconductors Product Content Declaration of SL3S5002N0FUD/04AZ | Last Revision (GMT): Sunday, 05 February 2023, 06:15:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
SL3S5002N0FUD/04AZ | NAU000 | UNCASED | 0.105500 mg | Yes | Yes | Yes | Not Applicable | Not Applicable | Not Applicable | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 310 68003 | 2021-08-24 | 4 | NA / Not Available | Not Applicable | Not Applicable | NA / Not Available | Not Applicable | Not Applicable | Not Applicable | NA |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Semiconductor Die | Die | Copper and its compounds | Copper, metal | 7440-50-8 | 0.002110 | 2.000000 | 2.000000 | |||
Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.103390 | 98.000000 | 98.000000 | |||||
SubTotal | 0.105500 | 100.0000000 | 100.000000 | |||||||
Total | 0.105500 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |