NXP Semiconductors Product Content Declaration of XPC8260CZUIFBC | Last Revision (GMT): Wednesday, 06 March 2024, 07:20:00 PM | |||||||||
Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | More information | |||
Halogen Free (Cl + Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
XPC8260CZUIFBC | SOT1752-1 | LBGA480 | 10297.743376 mg | No | No | No | Nickel/Gold (Ni/Au) | Other | e0 | contact us |
Manufacuturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
---|---|---|---|---|---|---|---|---|---|---|
Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak package temperature | Max time at peak temperature | |||||
9353 212 56557 | 2023-11-24 | 9 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 220 | 30 sec. | 3 | Kuala Lumpur, Malaysia |
Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | ||||
---|---|---|---|---|---|---|---|---|---|---|
Category | Description | |||||||||
Solder Ball - Low Lead | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 21.795017 | 36.000000 | 0.211648 | ||||
Silver and its compounds | Silver, metal | 7440-22-4 | 1.210834 | 2.000000 | 0.011758 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 37.535863 | 62.000000 | 0.364506 | |||||
SubTotal | 60.541715 | 100.0000000 | 0.587912 | |||||||
Bonding Wire - Au | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 39.071753 | 99.990000 | 0.379420 | |||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.003908 | 0.010000 | 0.000038 | ||||||
SubTotal | 39.075661 | 100.0000000 | 0.379458 | |||||||
Die Encapsulant 1 | Die Encapsulant | Anhydrides | Methylhexahydrophthalic anhydride | 25550-51-0 | 1.567660 | 6.372600 | 0.015223 | |||
Anhydrides | Substituted phthalic anhydride | 34090-76-1 | 1.567660 | 6.372600 | 0.015223 | |||||
Epoxy Resins | 3,4-Epoxycyclohexanecarboxylic acid (3,4-epoxycyclohexylmethyl) ester | 2386-87-0 | 1.431253 | 5.818100 | 0.013899 | |||||
Epoxy Resins | Bisphenol A diglycidyl ether | 1675-54-3 | 1.431253 | 5.818100 | 0.013899 | |||||
Inorganic Silicon compounds | Quartz | 14808-60-7 | 17.870793 | 72.645500 | 0.173541 | |||||
Inorganic compounds | Carbon Black | 1333-86-4 | 0.103566 | 0.421000 | 0.001006 | |||||
Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 0.530622 | 2.157000 | 0.005153 | |||||
Small Mineral and Ceramic Fibers | Cristobalite | 14464-46-1 | 0.097195 | 0.395100 | 0.000944 | |||||
SubTotal | 24.600000 | 100.0000000 | 0.238887 | |||||||
Die Encapsulant 2 | Die Encapsulant | Anhydrides | Methylhexahydrophthalic anhydride | 25550-51-0 | 40.643814 | 14.241000 | 0.394687 | |||
Antimony Oxides | Antimony(V) oxide | 1314-60-9 | 0.433523 | 0.151900 | 0.004210 | |||||
Bismuth and its compounds | Bismuth, metal | 7440-69-9 | 0.460636 | 0.161400 | 0.004473 | |||||
Epoxy Resins | 1,6-Bis(2,3-epoxypropoxy) naphthalene | 27610-48-6 | 40.643814 | 14.241000 | 0.394687 | |||||
Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 203.218214 | 71.204700 | 1.973425 | |||||
SubTotal | 285.400000 | 100.0000000 | 2.771481 | |||||||
Epoxy Adhesive | Epoxy Adhesive | Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 3.480000 | 12.000000 | 0.033794 | |||
Epoxy Resins | Proprietary Material-Other Epoxy resins | 2.030000 | 7.000000 | 0.019713 | ||||||
Silver and its compounds | Silver, metal | 7440-22-4 | 23.490000 | 81.000000 | 0.228108 | |||||
SubTotal | 29.000000 | 100.0000000 | 0.281615 | |||||||
Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 58.849000 | 98.000000 | 0.571475 | ||||
Miscellaneous substances | Other miscellaneous substances (less than 10%). | 1.201000 | 2.000000 | 0.011663 | ||||||
SubTotal | 60.050000 | 100.0000000 | 0.583137 | |||||||
Solder Ball - Low Lead | Solder Ball - Low Lead | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 0.009808 | 0.001000 | 0.000095 | |||
Antimony and its compounds | Antimony, metal | 7440-36-0 | 0.009808 | 0.001000 | 0.000095 | |||||
Arsenic and its compounds | Arsenic, metal | 7440-38-2 | 0.019616 | 0.002000 | 0.000190 | |||||
Bismuth and its compounds | Bismuth, metal | 7440-69-9 | 0.010788 | 0.001100 | 0.000105 | |||||
Copper and its compounds | Copper, metal | 7440-50-8 | 0.009808 | 0.001000 | 0.000095 | |||||
Iron and its compounds | Iron, metal | 7439-89-6 | 0.016673 | 0.001700 | 0.000162 | |||||
Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 353.094072 | 36.001500 | 3.428849 | |||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.036289 | 0.003700 | 0.000352 | |||||
Silver and its compounds | Silver, metal | 7440-22-4 | 19.535096 | 1.991800 | 0.189703 | |||||
Tin and its compounds | Tin, metal | 7440-31-5 | 608.024235 | 61.994200 | 5.904441 | |||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.009808 | 0.001000 | 0.000095 | |||||
SubTotal | 980.776000 | 100.0000000 | 9.524184 | |||||||
Substrate, Pre-plated NiAu | Substrate, Pre-plated NiAu | Barium and its compounds | Barium | 7440-39-3 | 3.121678 | 0.035400 | 0.030314 | |||
Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 0.088183 | 0.001000 | 0.000856 | |||||
Copper and its compounds | Copper, metal | 7440-50-8 | 8389.042793 | 95.132200 | 81.464866 | |||||
Copper and its compounds | Cupric oxide | 1317-38-0 | 239.681394 | 2.718000 | 2.327514 | |||||
Epoxy Resins | Other Non-halogenated Epoxy resins | 21.745928 | 0.246600 | 0.211172 | ||||||
Gold and its compounds | Gold, metal | 7440-57-5 | 2.733673 | 0.031000 | 0.026546 | |||||
Inorganic compounds | Other inorganic compounds | 0.123456 | 0.001400 | 0.001199 | ||||||
Nickel and its compounds | Nickel, metal | 7440-02-0 | 17.319141 | 0.196400 | 0.168184 | |||||
Organic compounds | Other organic compounds. | 30.749412 | 0.348700 | 0.298603 | ||||||
Polymers | Formaldehyde, polymer with 4,4'-(1-methylethylidene)bis[phenol] | 25085-75-0 | 6.604907 | 0.074900 | 0.064139 | |||||
Polymers | Other non-halogenated polymers | 103.712026 | 1.176100 | 1.007133 | ||||||
Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.088183 | 0.001000 | 0.000856 | |||||
Zirconium and its compounds | Zirconium, metal | 7440-67-7 | 3.289226 | 0.037300 | 0.031941 | |||||
SubTotal | 8818.300000 | 100.0000000 | 85.633324 | |||||||
Total | 10297.743376 | 100.0000000 | 100.0000000 |
Note(s): | ||||||||||
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available. |
Disclaimer | ||||||||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |