NXP Semiconductors Compliance Documentation of BAP65-02,135 | Last Revision (GMT): Tuesday, 08 June 2021, 11:00:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 19 Apr 2021 | Test Report 19 Apr 2021 | Test Report 19 Apr 2021 | Test Report 19 Apr 2021 | |
Copper Lead-Frame, Pre-Plated Ag | Not Available | Not Available | Not Available | Not Available | |
Die Encapsulant | Test Report 24 Feb 2020 | Test Report 24 Feb 2020 | Test Report 24 Feb 2020 | Test Report 24 Feb 2020 | |
Post-plating - Lead Free | Test Report 6 Dec 2019 | Test Report 6 Dec 2019 | Test Report 31 May 2019 | Test Report 6 Dec 2019 | |
Semiconductor Die | Not Available | Not Available | Not Available | Not Available |
For More Information : | contact us |
Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |