NXP Semiconductors Compliance Documentation of FXTH8709126T1 | Last Revision (GMT): Tuesday, 18 October 2022, 03:39:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au 1 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | |
Bonding Wire - Au 2 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | |
Copper Lead-Frame, Pre-Plated | Test Report 14 Jan 2019 | Test Report 14 Jan 2019 | Test Report 14 Jan 2019 | Test Report 14 Jan 2019 | |
Die Encapsulant | Test Report 14 Nov 2023 | Test Report 14 Nov 2023 | Test Report 14 Nov 2023 | Test Report 14 Nov 2023 | |
Epoxy Adhesive 1 | Test Report 13 Oct 2023 | Test Report 13 Oct 2023 | Test Report 13 Oct 2023 | Test Report 13 Oct 2023 | |
Epoxy Adhesive 2 | Test Report 29 Dec 2023 | Test Report 29 Dec 2023 | Test Report 29 Dec 2023 | Test Report 29 Dec 2023 | |
Epoxy Adhesive 3 | Test Report 22 Nov 2023 | Test Report 22 Nov 2023 | Test Report 22 Nov 2023 | Not Available | |
Epoxy Adhesive 4 | Test Report 12 Dec 2023 | Test Report 12 Dec 2023 | Test Report 12 Dec 2023 | Test Report 12 Dec 2023 | |
Lid | Test Report 30 Apr 2021 | Test Report 30 Apr 2021 | Test Report 30 Apr 2021 | Test Report 30 Apr 2021 | |
Semiconductor Die 1 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | |
Semiconductor Die 2 | CAP DIE | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 |
LEAD GLASS FRIT DIE | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Semiconductor Die 3 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Thermally Conductive Gel 1 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 | |
Thermally Conductive Gel 2 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |