NXP Semiconductors Compliance Documentation of LPC11C22FBD48/301, | Last Revision (GMT): Saturday, 01 July 2023, 09:48:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | |
Copper Lead-Frame, Pre-Plated Ag | AG PLATING | Test Report 7 Nov 2023 | Test Report 7 Nov 2023 | Test Report 7 Nov 2023 | Test Report 7 Nov 2023 |
C7025 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | |
Die Encapsulant | Test Report 19 Oct 2023 | Test Report 19 Oct 2023 | Test Report 19 Oct 2023 | Test Report 19 Oct 2023 | |
Epoxy Adhesive | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | |
Post-plating - Lead Free | Test Report 19 Jan 2024 | Test Report 19 Jan 2024 | Test Report 19 Jan 2024 | Test Report 19 Jan 2024 | |
Pre-plating - Precious metal - Ag | Test Report 29 Dec 2022 | Test Report 29 Dec 2022 | Test Report 29 Dec 2022 | Test Report 29 Dec 2022 | |
Semiconductor Die 1 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | |
Semiconductor Die 2 | Not Available | Not Available | Not Available | Not Available |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |