NXP Semiconductors Compliance Documentation of LS1012ASN7HKA | Last Revision (GMT): Saturday, 16 September 2023, 05:38:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Die Encapsulant | Test Report 30 Nov 2023 | Test Report 30 Nov 2023 | Test Report 30 Nov 2023 | Test Report 30 Nov 2023 | |
Semiconductor Die | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | |
Solder Paste | Test Report 25 Jul 2022 | Test Report 25 Jul 2022 | Test Report 25 Jul 2022 | Test Report 25 Jul 2022 | |
Substrate | CU PLATING | Test Report 14 Jan 2022Test Report 3 Feb 2021 | Test Report 14 Jan 2022Test Report 3 Feb 2021 | Test Report 14 Jan 2022Test Report 3 Feb 2021 | Test Report 14 Jan 2022Test Report 3 Feb 2021 |
PREPREG | Test Report 11 Mar 2022 | Test Report 11 Mar 2022 | Test Report 11 Mar 2022 | Test Report 11 Mar 2022 | |
SOLDER MASK | Test Report 4 May 2022 | Test Report 4 May 2022 | Test Report 4 May 2022 | Test Report 4 May 2022 |
For More Information : | contact us |
Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |