NXP Semiconductors Compliance Documentation of LS1043ABE9MQB | Last Revision (GMT): Tuesday, 26 December 2023, 11:30:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Epoxy Adhesive | Test Report 27 Feb 2024 | Test Report 27 Feb 2024 | Test Report 27 Feb 2024 | Test Report 27 Feb 2024 | |
Heat Spreader | C1100 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 |
NI PLATING | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | |
Semiconductor Die | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | |
Solder Ball - SAC, Lead Free | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | |
Substrate | COPPER | Test Report 21 Dec 2021 | Test Report 21 Dec 2021 | Test Report 21 Dec 2021 | Test Report 21 Dec 2021 |
E700GR | Test Report 21 Dec 2021 | Test Report 21 Dec 2021 | Test Report 21 Dec 2021 | Test Report 21 Dec 2021 | |
GX-13 | Test Report 20 Jul 2022 | Test Report 20 Jul 2022 | Test Report 20 Jul 2022 | Test Report 20 Jul 2022 | |
PHP-900 IR-6 | Test Report 17 Feb 2022 | Test Report 19 Aug 2021 | Test Report 18 Jun 2021 | Test Report 16 Jul 2020 | |
SR7300 SERIES | Test Report 24 Feb 2022 | Test Report 24 Feb 2022 | Test Report 24 Feb 2022 | Test Report 24 Feb 2022 | |
Thermally Conductive Gel | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | |
Underfill | Test Report 12 Oct 2023 | Test Report 12 Oct 2023 | Test Report 12 Oct 2023 | Test Report 12 Oct 2023 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |