NXP Semiconductors Compliance Documentation of MC10XS3435DHFKR2 | Last Revision (GMT): Thursday, 26 October 2023, 08:35:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Al | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | |
Bonding Wire - CuPd | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | |
Copper Lead-Frame, Pre-Plated | AU PLATING | Test Report 16 Sep 2021 | Test Report 16 Sep 2021 | Test Report 16 Sep 2021 | Test Report 16 Sep 2021 |
NI PLATING | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | |
PD PLATING | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | |
Die Encapsulant | Test Report 19 Jul 2023 | Test Report 19 Jul 2023 | Test Report 19 Jul 2023 | Test Report 19 Jul 2023 | |
Epoxy Adhesive | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | |
Semiconductor Die 1 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Semiconductor Die 2 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Solder Paste 1 | Not Available | Not Available | Not Available | Not Available | |
Solder Paste 2 | Test Report 26 Jul 2021 | Test Report 26 Jul 2021 | Test Report 26 Jul 2021 | Test Report 26 Jul 2021 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |