NXP Semiconductors Compliance Documentation of MC7448HX1267ND | Last Revision (GMT): Tuesday, 26 December 2023, 05:09:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Capacitor | CERAMIC | Test Report 27 Nov 2023 | Test Report 27 Nov 2023 | Test Report 27 Nov 2023 | Test Report 27 Nov 2023 |
INNER ELECTRODE | Test Report 29 Sep 2023 | Test Report 29 Sep 2023 | Test Report 29 Sep 2023 | Test Report 29 Sep 2023 | |
NI PLATING | Test Report 27 Apr 2023 | Test Report 27 Apr 2023 | Test Report 27 Apr 2023 | Test Report 25 Jun 2021 | |
OUTER ELECTRODE | Test Report 21 Sep 2023 | Test Report 21 Sep 2023 | Test Report 21 Sep 2023 | Test Report 21 Sep 2023 | |
SN PLATING | Test Report 27 Apr 2023 | Test Report 27 Apr 2023 | Test Report 4 Jun 2021 | Test Report 4 Jun 2021 | |
Semiconductor Die | Test Report 18 Jul 2022 | Test Report 18 Jul 2022 | Test Report 18 Jul 2022 | Test Report 18 Jul 2022 | |
Solder Ball - High Lead | Not Available | Not Available | Not Available | Not Available | |
Solder Flux | Test Report 11 Aug 2021 | Test Report 11 Aug 2021 | Test Report 11 Aug 2021 | Test Report 11 Aug 2021 | |
Solder Paste | Not Available | Not Available | Not Available | Not Available | |
Substrate, Pre-plated NiAu | COPPER FOIL | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 |
E679FG SERIES | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Not Available | Not Available | |
E679FGB SERIES | Not Available | Not Available | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | |
Underfill | Not Available | Not Available | Not Available | Not Available |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |