NXP Semiconductors Compliance Documentation of MCF54452VP266R | Last Revision (GMT): Tuesday, 03 October 2023, 07:15:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | |
Die Encapsulant | Test Report 30 Jan 2024 | Test Report 30 Jan 2024 | Test Report 30 Jan 2024 | Test Report 30 Jan 2024 | |
Epoxy Adhesive | Test Report 29 Jun 2023 | Test Report 29 Jun 2023 | Test Report 29 Jun 2023 | Not Available | |
Semiconductor Die | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Solder Ball - Lead Free | Test Report 31 Aug 2023 | Test Report 31 Aug 2023 | Test Report 31 Aug 2023 | Test Report 31 Aug 2023 | |
Substrate | AU PLATING | Test Report 15 Mar 2021 | Test Report 15 Mar 2021 | Test Report 15 Mar 2021 | Test Report 15 Mar 2021 |
AUS 308 | Test Report 26 Aug 2022 | Test Report 26 Aug 2022 | Test Report 26 Aug 2022 | Test Report 26 Aug 2022 | |
CU FOIL | Test Report 8 Feb 2023 | Test Report 8 Feb 2023 | Test Report 1 Mar 2022 | Test Report 8 Feb 2023 | |
HL-832NXA | Not Available | Not Available | Test Report 22 Mar 2021 | Not Available | |
HL832NXA | Test Report 8 Feb 2023 | Test Report 8 Feb 2023 | Not Available | Not Available | |
NI PLATING | Test Report 15 Mar 2021 | Test Report 15 Mar 2021 | Test Report 15 Mar 2021 | Test Report 15 Mar 2021 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |