NXP Semiconductors Compliance Documentation of MCIMX6Q6AVT10AC | Last Revision (GMT): Thursday, 21 March 2024, 07:41:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Cap | C1100 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 |
NI PLATING | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | |
Epoxy Adhesive | Test Report 26 Feb 2024 | Test Report 26 Feb 2024 | Test Report 26 Feb 2024 | Not Available | |
Semiconductor Die | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | |
Solder Ball - SAC, Lead Free | Test Report 31 May 2023 | Test Report 31 May 2023 | Test Report 31 May 2023 | Test Report 31 May 2023 | |
Substrate | AUS 703 | Test Report 11 Oct 2023 | Test Report 11 Oct 2023 | Test Report 11 Oct 2023 | Test Report 11 Oct 2023 |
COPPER | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | |
E679FG | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | |
GX-13 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | |
PHP-900 IR-6 | Test Report 20 Apr 2023 | Test Report 18 Jun 2023 | Test Report 20 Apr 2023 | Test Report 16 Jul 2020 | |
Thermally Conductive Gel | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | |
Underfill | Test Report 12 Oct 2023 | Test Report 12 Oct 2023 | Test Report 12 Oct 2023 | Test Report 12 Oct 2023 |
For More Information : | contact us |
Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |