NXP Semiconductors Compliance Documentation of MF1SEP1001DA4/03J | Last Revision (GMT): Wednesday, 28 February 2024, 01:48:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | |
Copper Lead-Frame, Pre-Plated Ag | AG PLATING | Test Report 5 Jan 2023 | Test Report 5 Jan 2023 | Test Report 5 Jan 2023 | Test Report 5 Jan 2023 |
C5191 | Test Report 5 Jan 2023 | Test Report 5 Jan 2023 | Test Report 5 Jan 2023 | Test Report 5 Jan 2023 | |
Die Encapsulant | Test Report 10 Apr 2023 | Test Report 10 Apr 2023 | Test Report 10 Apr 2023 | Not Available | |
Epoxy Adhesive | Test Report 30 Aug 2023 | Test Report 30 Aug 2023 | Test Report 30 Aug 2023 | Test Report 30 Aug 2023 | |
Pre-plating - Precious metal - Ag | Test Report 29 Dec 2022 | Test Report 29 Dec 2022 | Test Report 29 Dec 2022 | Test Report 29 Dec 2022 | |
Semiconductor Die | AU BUMP | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 |
AU UBM | Test Report 16 Dec 2022 | Test Report 16 Dec 2022 | Test Report 16 Dec 2022 | Test Report 16 Dec 2022 | |
DIE | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | |
TIW UBM | Test Report 13 Apr 2023 | Test Report 13 Apr 2023 | Test Report 13 Apr 2023 | Test Report 13 Apr 2023 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |