NXP Semiconductors Compliance Documentation of MIMX8ML8DVNLZAB | Last Revision (GMT): Friday, 08 March 2024, 02:38:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Semiconductor Die | AG PLATING | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 |
CU PLATING | Test Report 9 Feb 2023 | Test Report 9 Feb 2023 | Test Report 9 Feb 2023 | Test Report 9 Feb 2023 | |
DIE | Test Report 2 Feb 2023 | Test Report 2 Feb 2023 | Test Report 2 Feb 2023 | Test Report 2 Feb 2023 | |
POLYIMIDE | Test Report 14 Apr 2023 | Test Report 14 Apr 2023 | Test Report 14 Apr 2023 | Test Report 14 Apr 2023 | |
SN PLATING | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 | |
UBM CU | Test Report 24 Feb 2023 | Test Report 24 Feb 2023 | Test Report 24 Feb 2023 | Test Report 24 Feb 2023 | |
UBM TI | Test Report 31 Jan 2023 | Test Report 31 Jan 2023 | Test Report 31 Jan 2023 | Test Report 31 Jan 2023 | |
Solder Ball - Lead Free with Bismuth | Test Report 6 Oct 2023 | Test Report 6 Oct 2023 | Test Report 6 Oct 2023 | Test Report 6 Oct 2023 | |
Substrate | CU FOIL | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 |
E705G | Test Report 16 Mar 2023 | Test Report 16 Mar 2023 | Test Report 16 Mar 2023 | Test Report 16 Mar 2023 | |
GX-13 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | |
SAC305 | Test Report 3 Feb 2023 | Test Report 3 Feb 2023 | Test Report 3 Feb 2023 | Test Report 3 Feb 2023 | |
SR7300GRB | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 7 Feb 2023 | Test Report 7 Feb 2023 | |
Underfill | Test Report 3 Feb 2023 | Test Report 3 Feb 2023 | Test Report 3 Feb 2023 | Test Report 3 Feb 2023 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |