NXP Semiconductors Compliance Documentation of MK81FN256VDC15R | Last Revision (GMT): Monday, 04 March 2024, 10:07:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - CuPd | Test Report 25 Dec 2023 | Test Report 25 Dec 2023 | Test Report 25 Dec 2023 | Test Report 25 Dec 2023 | |
Die Encapsulant | Test Report 6 Feb 2024 | Test Report 6 Feb 2024 | Test Report 6 Feb 2024 | Test Report 6 Feb 2024 | |
Epoxy Adhesive | Not Available | Not Available | Not Available | Not Available | |
Semiconductor Die | Test Report 28 Mar 2023 | Test Report 28 Mar 2023 | Test Report 28 Mar 2023 | Test Report 28 Mar 2023 | |
Solder Ball - SAC, Lead Free | Test Report 2 Oct 2023 | Test Report 2 Oct 2023 | Test Report 2 Oct 2023 | Test Report 2 Oct 2023 | |
Substrate, Pre-plated NiAu | AU PLATING | Test Report 6 Mar 2020 | Test Report 6 Mar 2020 | Test Report 6 Mar 2020 | Test Report 6 Mar 2020 |
AUS308 | Test Report 18 Oct 2021 | Test Report 18 Oct 2021 | Test Report 18 Oct 2021 | Test Report 18 Oct 2021 | |
COPPER | Test Report 24 Jul 2020 | Test Report 24 Jul 2020 | Test Report 24 Jul 2020 | Test Report 30 Jul 2020 | |
COPPER FOIL | Test Report 1 Mar 2022 | Test Report 1 Mar 2022 | Test Report 1 Mar 2022 | Test Report 1 Mar 2022 | |
HL832NXA | Test Report 11 Mar 2022 | Test Report 11 Mar 2022 | Test Report 11 Mar 2022 | Test Report 11 Mar 2022 | |
NI PLATING | Test Report 12 Jun 2020 | Test Report 12 Jun 2020 | Test Report 12 Jun 2020 | Test Report 12 Jun 2020 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |