NXP Semiconductors Compliance Documentation of MMA1250KEGR2 | Last Revision (GMT): Tuesday, 05 March 2024, 01:10:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au 1 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | |
Bonding Wire - Au 2 | Not Available | Not Available | Not Available | Not Available | |
Copper Lead-Frame | Not Available | Not Available | Not Available | Not Available | |
Die Encapsulant | Not Available | Not Available | Not Available | Not Available | |
Epoxy Adhesive 1 | Test Report 17 Jun 2019 | Test Report 17 Jun 2019 | Test Report 17 Jun 2019 | Test Report 17 Jun 2019 | |
Epoxy Adhesive 2 | Test Report 22 Mar 2023 | Test Report 22 Mar 2023 | Test Report 22 Mar 2023 | Test Report 22 Mar 2023 | |
Post-plating - Lead Free | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | |
Semiconductor Die 1 | CAP DIE | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 |
LEAD GLASS FRIT DIE | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Semiconductor Die 2 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Semiconductor Die Coating | Test Report 18 Jun 2020 | Test Report 18 Jun 2020 | Test Report 18 Jun 2020 | Test Report 18 Jun 2020 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |