NXP Semiconductors Compliance Documentation of MPL115A1T1 | Last Revision (GMT): Thursday, 07 March 2024, 06:30:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | |
Cap | Test Report 23 Sep 2022 | Test Report 23 Sep 2022 | Test Report 23 Sep 2022 | Test Report 23 Sep 2022 | |
Die Encapsulant | Test Report 8 Aug 2023 | Test Report 8 Aug 2023 | Test Report 8 Aug 2023 | Test Report 8 Aug 2023 | |
Epoxy Adhesive 1 | Test Report 19 Feb 2024 | Test Report 19 Feb 2024 | Test Report 19 Feb 2024 | Test Report 19 Feb 2024 | |
Epoxy Adhesive 2 | Test Report 13 Oct 2023 | Test Report 13 Oct 2023 | Test Report 13 Oct 2023 | Test Report 13 Oct 2023 | |
Semiconductor Die 1 | CAP DIE | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 |
LEAD GLASS FRIT DIE | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
Semiconductor Die 2 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | |
Substrate, Pre-plated NiAu | COPPER FOIL | Test Report 4 Jan 2024 | Test Report 4 Jan 2024 | Test Report 4 Jan 2024 | Test Report 4 Jan 2024 |
HL832 | Test Report 16 Apr 2019 | Test Report 16 Apr 2019 | Test Report 16 Apr 2019 | Test Report 16 Apr 2019 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |