NXP Semiconductors Compliance Documentation of MRF24G300HR5 | Last Revision (GMT): Thursday, 24 August 2023, 08:43:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | Test Report 23 Mar 2023 | |
Cap | CERAMIC | Test Report 30 Jun 2021 | Test Report 30 Jun 2021 | Test Report 30 Jun 2021 | Test Report 30 Jun 2021 |
WHITE RESIN | Test Report 30 Jun 2021 | Test Report 30 Jun 2021 | Test Report 30 Jun 2021 | Not Available | |
Epoxy Adhesive | Test Report 28 Jul 2023 | Test Report 28 Jul 2023 | Test Report 28 Jul 2023 | Test Report 28 Jul 2023 | |
Header Assembly/Flange | ALLOY 42 | Test Report 7 Jun 2021 | Test Report 7 Jun 2021 | Test Report 7 Jun 2021 | Test Report 7 Jun 2021 |
AU PLATING | Test Report 2 Aug 2021 | Not Available | Not Available | Not Available | |
FLANGE | Test Report 18 Mar 2021 | Test Report 18 Mar 2021 | Test Report 18 Mar 2021 | Not Available | |
NICO PLATING | Test Report 21 Sep 2021 | Test Report 21 Sep 2021 | Test Report 21 Sep 2021 | Test Report 21 Sep 2021 | |
PD PLATING | Test Report 18 Jan 2021 | Test Report 18 Jan 2021 | Not Available | Not Available | |
Semiconductor Die 1 | Test Report 9 Sep 2021 | Test Report 9 Sep 2021 | Test Report 9 Sep 2021 | Test Report 9 Sep 2021 | |
Semiconductor Die 2 | AU BUMPING | Not Available | Not Available | Not Available | Not Available |
DIE | Not Available | Not Available | Not Available | Not Available |
For More Information : | contact us |
Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |