NXP Semiconductors Compliance Documentation of P5040NSE12QB | Last Revision (GMT): Wednesday, 06 March 2024, 05:47:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Epoxy Adhesive | Test Report 2 Mar 2023 | Test Report 2 Mar 2023 | Test Report 2 Mar 2023 | Test Report 2 Mar 2023 | |
Heat Spreader | C1100 | Test Report 27 Oct 2021 | Test Report 27 Oct 2021 | Test Report 27 Oct 2021 | Test Report 27 Oct 2021 |
NI PLATING | Test Report 16 Jun 2021 | Test Report 16 Jun 2021 | Test Report 16 Jun 2021 | Test Report 16 Jun 2021 | |
Semiconductor Die | Test Report 28 Mar 2023 | Test Report 28 Mar 2023 | Test Report 28 Mar 2023 | Test Report 28 Mar 2023 | |
Solder Ball - SAC, Lead Free | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | |
Substrate | AUS 703 | Test Report 10 Nov 2022 | Test Report 10 Nov 2022 | Test Report 10 Nov 2022 | Test Report 10 Nov 2022 |
COPPER | Test Report 14 Dec 2022 | Test Report 14 Dec 2022 | Test Report 14 Dec 2022 | Test Report 14 Dec 2022 | |
E679FG SERIES | Test Report 14 Dec 2022 | Test Report 14 Dec 2022 | Test Report 14 Dec 2022 | Test Report 21 Dec 2021 | |
GX-13 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | Test Report 28 Apr 2023 | |
PHP-900 IR-6 | Test Report 31 Jan 2023 | Test Report 31 Jan 2023 | Test Report 31 Jan 2023 | Test Report 16 Jul 2020 | |
Thermally Conductive Gel | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | Test Report 1 Aug 2023 | |
Underfill | Test Report 6 Dec 2022 | Test Report 6 Dec 2022 | Test Report 6 Dec 2022 | Test Report 17 Jan 2022 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |