NXP Semiconductors Compliance Documentation of PCF8562TT/2,118 | Last Revision (GMT): Thursday, 07 April 2022, 08:33:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 4 Aug 2021 | Test Report 4 Aug 2021 | Test Report 4 Aug 2021 | Test Report 4 Aug 2021 | |
Copper Lead-Frame, Pre-Plated NiPdAu | AU PLATING | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 |
C7025 | Test Report 2 Jun 2021 | Test Report 2 Jun 2021 | Test Report 2 Jun 2021 | Test Report 2 Jun 2021 | |
NI PLATING | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | |
PD PLATING | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | Test Report 7 Jan 2022 | |
Die Encapsulant | Test Report 11 Jan 2022 | Test Report 11 Jan 2022 | Test Report 11 Jan 2022 | Test Report 11 Jan 2022 | |
Epoxy Adhesive | Test Report 11 Jan 2022 | Test Report 11 Jan 2022 | Test Report 11 Jan 2022 | Test Report 11 Jan 2022 | |
Pre-plating - Precious metal - NiPdAu | Not Available | Not Available | Not Available | Not Available | |
Semiconductor Die | Test Report 28 Jan 2022 | Test Report 28 Jan 2022 | Test Report 28 Jan 2022 | Test Report 28 Jan 2022 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |