NXP Semiconductors Compliance Documentation of PPC5777M2K0MVU8B | Last Revision (GMT): Tuesday, 26 December 2023, 07:47:00 PM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - Au | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | Test Report 5 Jun 2023 | |
Die Encapsulant | Test Report 30 Jan 2024 | Test Report 30 Jan 2024 | Test Report 30 Jan 2024 | Test Report 30 Jan 2024 | |
Epoxy Adhesive | Test Report 29 Jun 2023 | Test Report 29 Jun 2023 | Test Report 29 Jun 2023 | Not Available | |
Semiconductor Die 1 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | |
Semiconductor Die 2 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | Test Report 20 Dec 2022 | |
Solder Ball - SAC, Lead Free | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | Test Report 26 Jan 2024 | |
Substrate, Pre-plated NiAu | AUS308 | Test Report 10 Jul 2023 | Test Report 10 Jul 2023 | Test Report 10 Jul 2023 | Test Report 10 Jul 2023 |
COPPER FOIL | Test Report 7 Jan 2021 | Test Report 16 Mar 2020 | Not Available | Test Report 16 Mar 2020 | |
Underfill | Not Available | Not Available | Not Available | Not Available |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |