NXP Semiconductors Compliance Documentation of SPC5604BF2VLL4 | Last Revision (GMT): Sunday, 24 December 2023, 08:59:00 AM | ||||||
Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
---|---|---|---|---|---|
RoHS | Phthalates * | Halogens * | Antimony * | ||
Bonding Wire - CuPdAu | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | |
Copper Lead-Frame | AG SPOT PLATING | Test Report 31 Oct 2023 | Test Report 31 Oct 2023 | Test Report 31 Oct 2023 | Test Report 31 Oct 2023 |
CDA 194 | Test Report 31 Oct 2023 | Test Report 31 Oct 2023 | Test Report 31 Oct 2023 | Test Report 31 Oct 2023 | |
Die Encapsulant | Test Report 14 Nov 2023 | Test Report 14 Nov 2023 | Test Report 14 Nov 2023 | Test Report 14 Nov 2023 | |
Epoxy Adhesive | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | |
Post-plating - Lead Free | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | Test Report 19 Jun 2023 | |
Semiconductor Die | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 |
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Note(s): | |||||
* NXP does not commit to providing this report for all product materials! |
Disclaimer | |||||
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |