Intrinsyc Technologies Corporation is a product development company providing hardware, software, and services that enable next-generation intelligent connected products. Our solutions span the entire development life cycle from concept to production and help device makers and technology suppliers create compelling differentiated products with faster time-to-market.
Intrinsyc delivers tailored technology solutions based upon our family of embedded computing modules for the most demanding embedded and IoT device applications. In addition to our comprehensive experience in ARM hardware and software development, Intrinsyc has in-house capabilities in wireless design, telephony, imaging, mechanical engineering, thermal design and production management.
Our values and performance enable us to partner with the world’s leading OEMs to create award winning products including: smartphones and tablets; robotics, wearables, automotive, medical, digital signage, smart cameras, and many more.
The Open-X™ 8M is an ultra-compact (55mmx35mm) production-ready SOM including HDMI 2.0a, two USB 3.0, one PCIe, Gigabit Ethernet, and pre-certified dual-band 2x2 MU-MIMO WLAN.
Number Of Cores:4
Intrinsyc can complete all aspects of IoT product development, including: mechanical and RF design, electrical engineering, BSP SW development, middleware and applications, rapid prototyping, certification, and mass production. Operating System:Android / Linux,QNX-Neutrino,Microsoft,Linux,Linux-NXP,Yocto,Android
Our team is very experienced with embedded systems software having created countless board support packages and drivers for Android, Linux, Window and QNX. We can help you with your software needs whether it is on Intrinsyc HW or on your own HW. Operating System:Android / Linux,QNX-Neutrino,Microsoft,Linux,Linux-NXP,Yocto,Android
Intrinsyc's hardware engineering team, with average 18 years experience, can develop semi-custom designs based on our embedded computing modules or do fully custom designs tailored to our client’s specifications.
Intrinsyc Technologies’ mechanical engineering team has extensive experience in the development and commercialization of mobile and IoT products, including high density device packaging, ruggedized products, and thermal design.