Find mechanical outline drawings and related information.
Package Version | Package Name | Package Description | Reference Codes | Issue Date |
---|---|---|---|---|
0590B | CDIP40 | ceramic dual in-line package (600 mil); 40 leads; F: no window; FA: with window | 2011-01-17 | |
NAU000 | NAU000 | Uncased | 2009-07-16 | |
OL-74AUP1T97UK | WLCSP | wafer level chip-scale package; 6 bumps; 0.65 x 0.44 x 0.27 mm | 2015-05-06 | |
OL-BGU8004 | WLCSP | wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm | 2013-11-04 | |
OL-BGU8006 | WLCSP | wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm | 2012-07-25 | |
OL-BGU8H1UK | WLCSP | wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm | 2014-08-25 | |
OL-BGU8L1UK | WLCSP | wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm | 2014-08-25 | |
OL-BGU8M1UK | WLCSP | wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm | 2014-08-25 | |
OL-IP3047CX6 | WLCSP | Wafer level chip-size package; 6 bumps (3 x 2) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3048CX5 | WLCSP | Wafer level chip-size package; 5 bumps (2-1-2) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3053CX10 | WLCSP | Wafer level chip-size package; 10 bumps (4-2-4) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3053CX15 | WLCSP | Wafer level chip-size package; 15 bumps (6-3-6) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3053CX20 | WLCSP | Wafer level chip-size package; 20 bumps (8-4-8) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3053CX5 | WLCSP | Wafer level chip-size package; 5 bumps (2-1-2) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3088CX10 | WLCSP | Wafer level chip-size package; 10 bumps (4-2-4) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3088CX15 | WLCSP | Wafer level chip-size package; 15 bumps (6-3-6) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3088CX20 | WLCSP | Wafer level chip-size package; 20 bumps (8-4-8) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3088CX5 | WLCSP | Wafer level chip-size package; 5 bumps (2-1-2) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3319CX6 | WLCSP | Wafer level chip-size package; 6 bumps (2 x 3) | 2013-06-11 | |
OL-IP3337CX18 | WLCSP | Wafer level chip-size package; 18 bumps | 2011-07-06 | |
OL-IP3338CX24 | WLCSP | Wafer level chip-size package; 24 bumps | 2011-07-06 | |
OL-IP3348CX10 | WLCSP | Wafer level chip-size package; 10 bumps (4-2-4) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-06 |
OL-IP3348CX15 | WLCSP | Wafer level chip-size package; 15 bumps (6-3-6) | ---(EIAJ);---(JEDEC);---(IEC | 2011-07-06 |
OL-IP3348CX20 | WLCSP | Wafer level chip-size package; 20 bumps (8-4-8) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-07 |
OL-IP3348CX5 | WLCSP | Wafer level chip-size package; 5 bumps (2-1-2) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-07 |
OL-IP4035CX24 | WLCSP | Wafer level chip-size package; 24 bumps (5 x 5 - A1) | ---(EIAJ);---(JEDEC);---(IEC | 2011-05-26 |
OL-IP4041CX25 | WLCSP | Wafer level chip-size package; 25 bumps (5 x 5) | ---(EIAJ);---(JEDEC);---(IEC | 2011-05-26 |
OL-IP4051CX11 | WLCSP | Wafer level chip-size package; 11 bumps; 1.96 x 1.44 x 0.70 mm | 2005-08-26 | |
OL-IP4052CX20 | WLCSP | Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm | 2008-11-11 | |
OL-IP4060CX16 | WLCSP | wafer level chip-size package; 16 bumps | 2009-03-12 | |
OL-IP4064CX8 | WLCSP | Wafer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm | 2010-11-02 | |
OL-IP4067CX9 | WLCSP | Wafer level chip-size package; 5 bumps; 1.46 x 1.52 x 0.70 mm | 2011-04-28 | |
OL-IP4080CX20 | WLCSP | Wafer level chip-size package; 20 bumps; 2.51 x 2.01 x 0.70 mm | 2008-11-11 | |
OL-IP4085CX4 | WLCSP | Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm | 2011-06-06 | |
OL-IP4302CX2 | WLCSP | Wafer level chip-size package; 2 bumps; 0.52 x 0.72 x 0.42 mm | 2008-05-20 | |
OL-IP4309CX9 | WLCSP | Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm | 2008-09-24 | |
OL-IP4332CX5 | WLCSP | Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm | 2011-04-28 | |
OL-IP4337CX18 | WLCSP | WLCSP18: wafer level chip-size package; 18 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-05-26 |
OL-IP4338CX24 | WLCSP | WLCSP24: wafer level chip-size package; 24 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-05-26 |
OL-IP4342CX5 | WLCSP | Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm | 2008-08-15 | |
OL-IP4343CX5_LF | WLCSP | Wafer level chip-size package; 5 bumps; 0.93 x 0.93 x 0.66 mm | 2011-07-18 | |
OL-IP4350CX24 | WLCSP | Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm | 2011-06-06 | |
OL-IP4352CX24 | WLCSP | Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm | 2009-07-06 | |
OL-IP4358CX6 | WLCSP | Wafer level chip-size package; 6 bumps; 1.16 x 0.76 x 0.68 mm | 2008-10-10 | |
OL-IP4359CX4 | WLCSP | Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm | 2011-06-06 | |
OL-IP4365CX11 | WLCSP | Wafer level chip-size package; 11 bumps | 2011-07-06 | |
OL-IP4366CX8 | WLCSP | Wafer level chip-size package; 8 bumps (3 x 3 - A1) | 2011-07-06 | |
OL-IP4385CX4 | WLCSP | Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm | 2007-09-03 | |
OL-IP4386CX4 | WLCSP | Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm | 2011-06-06 | |
OL-IP4387CX4 | WLCSP | Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm | 2011-06-06 | |
OL-IP4852CX25 | WLCSP | Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm | 2006-09-23 | |
OL-IP4855CX25 | WLCSP | Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm | 2013-04-15 | |
OL-LD6938 | WLCSP | Wafer level chip-size package; 6 bumps (2 x 3) | 2013-06-11 | |
OL-LPC1102UK | WLCSP | Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm | - - -(EIAJ);- - -(JEDEC);- - -(IEC | 2010-10-18 |
OL-LPC1768UK | WLCSP | WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm | ---(EIAJ);---(JEDEC);---(IEC | 2013-11-04 |
OL-LPC5410 | WLCSP | wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) | 2014-11-03 | |
OL-NCX8200UK | WLCSP | wafer chip-scale package; 9 bumps; 1.22 x 1.22 x 0.5 mm | 2014-12-16 | |
OL-NTB0104UK | WLCSP | wafer level chip-size package, 12 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-16 |
OL-NTS0104UK | WLCSP | wafer level chip-size package, 12 bumps | 2011-07-28 | |
OL-NVT4555UK | WLCSP | wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm | ---(EIAJ);---(JEDEC);---(IEC | 2013-02-26 |
OL-NVT4556UK | WLCSP | wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.205 mm x 1.605 mm x 0.272 mm body | 2014-04-22 | |
OL-NVT4857 | WLCSP | wafer level chip-scale package; 20 bumps; 2.1 x 1.7 x 0.49 mm (Backside coating included) | 2015-07-21 | |
OL-NX18P3001UK | WLCSP | wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) | 2013-05-23 | |
OL-NX1A4WP | WLCSP | wafer level chip-scale package; 42 bumps; 3.56 x 3.41 x 0.57 mm (backside coating included) | 2015-01-19 | |
OL-NX20P3000UK | WLCSP | wafer level chip-size package; 16 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-11-04 |
OL-NX3DV1066 | WLCSP | wafer level chip-size package; 16 bumps | 2012-01-10 | |
OL-NX3P1107 | WLCSP | wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) | ---(EIAJ);---(JEDEC);---(IEC | 2012-07-02 |
OL-NX3P1107UK | WLCSP | wafer level chip-size package; 4 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2012-07-02 |
OL-NX3P1108 | WLCSP | wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) | ---(EIAJ);---(JEDEC);---(IEC | 2012-07-02 |
OL-NX3P1108UK | WLCSP | wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) | ---(EIAJ);---(JEDEC);---(IEC | 2012-07-02 |
OL-NX3P190 | WLCSP | wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-09 |
OL-NX3P190UK | WLCSP | wafer level chip-size package; 4 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2012-07-02 |
OL-NX3P191 | WLCSP | Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-10 |
OL-NX3P191UK | WLCSP | wafer level chip-size package; 4 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2012-07-02 |
OL-NX3P2902B | WLCSP | wafer level chip-scale package; 4 bumps; 0.77 x 0.77 x 0.51 mm (Backside coating included) | ---(EIAJ);---(JEDEC);---(IEC | 2013-04-02 |
OL-NX5P1000 | WLCSP | WLCSP12: wafer level chip-scale package; 12 bumps | 2013-03-29 | |
OL-NX5P1100 | WLCSP | WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) | 2013-12-20 | |
OL-NX5P2090UK | WLCSP | Wafer level chip-size package; 9 bumps | 2013-03-27 | |
OL-NX5P2190 | WLCSP | wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included) | 2014-02-14 | |
OL-NX5P2924B | WLCSP | wafer level chip-scale package; 6 bumps; 0.87 x 1.37 x 0.50 mm | 2014-01-21 | |
OL-NX5P2924C | WLCSP | wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm | 2015-04-21 | |
OL-NX5P2924C_NX5P2924D_NX5P2925C | WLCSP | wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm | 2014-10-16 | |
OL-NX5P2925C | WLCSP | wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm | 2015-04-21 | |
OL-NX5P3001 | WLCSP | wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) | 2013-05-23 | |
OL-NXH5104UK | WLCSP | wafer level chip-scale package; 13 bumps; 2.74 x 2.80 x 0.38 mm | 2015-10-05 | |
OL-OP567 | UC | Wire bond die ; 5.47 x 4.47 x 0.24 mm | 2008-08-08 | |
OL-OP629_ABD | UC | Wire bond die; 5 bonding pads; 4.47 x 5.47 x 0.24 mm | 2009-08-07 | |
OL-PCA85132U | UC | Bare die; 197 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCA85133 | UC | Bare die; 110 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCA85232U | UC | Bare die; 197 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-09-06 |
OL-PCA85233 | UC | Bare die; 110 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-09-06 |
OL-PCA8533-1 | UC | Bare die; 99 bumps | 2011-12-05 | |
OL-PCA8538U | UC | Bare die; 247 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2013-01-07 |
OL-PCA8576DU_2DA | UC | Bare die; 59 bumps | 2011-12-07 | |
OL-PCA9410 | WLCSP | wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) | 2015-07-23 | |
OL-PCA9411 | WLCSP | wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) | 2015-09-29 | |
OL-PCA9620U | UC | Bare die; 80 bonding pads | ---(EIAJ);---(JEDEC);---(IEC | 2011-11-23 |
OL-PCE85133 | UC | Bare die; 110 bumps | 2012-02-29 | |
OL-PCF2003DUS | WLCSP | wafer level chip-scale package; 8 bumps; 1.16 x 0.86 x 0.48 mm | 2015-08-17 | |
OL-PCF2119X | UC | Bare die: 168 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-11-01 |
OL-PCF85132U | UC | Bare die; 197 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF85133 | UC | Bare die; 110 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8523U | UC | Bare die; 12 bumps (6-6); 1.58 x 2.15 x 0.22 mm | 2010-09-27 | |
OL-PCF8531U | UC | Wire bond die; 248 bonding pads | 2011-12-14 | |
OL-PCF8532U | UC | Bare die; 197 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8533-2 | UC | Bare die; 99 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8534AU | UC | Wire bond die; 76 bonding pads | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8538U | UC | Bare die; 247 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2013-01-07 |
OL-PCF8566U | UC | Wire bond die; 40 bonding pads | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8576CU | UC | Wire bond die; 56 bonding pads | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8576DU_2DA | UC | Bare die; 59 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8576DU_DA | UC | Wire bond die; 59 bonding pads | ---(EIAJ);---(JEDEC);---(IEC | 2011-10-26 |
OL-PCF8577CU | UC | Wire bond die; 40 bonding pads | ---(EIAJ);---(JEDEC);---(IEC | 2011-11-02 |
OL-PCF8811MU | UC | Wire bond die; 248 bonding pads | 2011-12-14 | |
OL-PCF8811U | UC | Wire bond die; 248 bonding pads | 2011-12-14 | |
OL-PCT2202 | WLCSP | wafer level chip-scale package; 6 bumps; 0.69 x 1.09 x 0.38 mm (Backside coating included) | 2014-11-19 | |
OL-PEMI4CSP_RT | WLCSP | Wafer level chip-size package; 10 bumps (4-2-4) | 2011-07-06 | |
OL-PEMI4CSP_RW | WLCSP | Wafer level chip-size package; 10 bumps (4-2-4) | 2011-07-06 | |
OL-PEMI6CSP_RT | WLCSP | Wafer level chip-size package; 15 bumps (6-3-6) | 2011-07-06 | |
OL-PEMI6CSP_RW | WLCSP | Wafer level chip-size package; 15 bumps (6-3-6) | 2011-07-06 | |
OL-PEMI8CSP_RT_P | WLCSP | Wafer level chip-size package; 20 bumps (8-4-8) | 2011-07-06 | |
OL-PEMI8CSP_RW_P | WLCSP | Wafer level chip-size package; 20 bumps (8-4-8) | 2011-07-06 | |
OL-PMCM4401UPE | WLCSP | WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) | 2016-06-28 | |
OL-PMCM440VNE | WLCSP | WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) | 2014-07-02 | |
OL-PMCM440VPE | WLCSP | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2014-07-03 | |
OL-PMCM6501VNE | WLCSP | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2015-07-07 | |
OL-PMCM6501VPE | WLCSP | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2015-07-20 | |
OL-PMCM650VNE | WLCSP | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2015-03-25 | |
OL-PN548 | WLCSP | wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) | 2015-08-06 | |
OL-PN549 | WLCSP | wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) | 2015-08-06 | |
OL-PN550 | WLCSP | wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) | 2015-08-06 | |
OL-SA58635UK | WLCSP | Wafer level chip-size package; 16 balls; 1.7 x 1.7 x 0.56 mm | 2010-01-19 | |
OL-SA58671UK | WLCSP | Wafer level chip-size package; 16 balls; 2.06 x 2.11 x 0.6 mm | 2007-10-17 | |
OL-SA58672UK | WLCSP | Wafer level chip-size package; 9 bumps; 1.66 X 1.71 X 0.6 mm | 2008-06-12 | |
OL-TA150KGD | UC | Bare die; 7.5mm x 4.6 mm | 2012-11-21 | |
OL-TA151KGD | UC | Bare die; 6.2mm x 3.7 mm | 2012-11-02 | |
OL-TDA1308AUK | WLCSP | Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm | 2006-12-15 | |
OL-TDA19988AU | UC | Bare die; 84 bond pads | 2011-04-13 | |
OL-TDA19988BU | UC | Bare die; 84 bond pads | ---(EIAJ);---(JEDEC);---(IEC | 2011-06-10 |
OL-TFA9860 | WLCSP | wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm | ---(EIAJ);---(JEDEC);---(IEC | 2013-03-07 |
OL-TFA9881UK | WLCSP | Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm | 2010-10-06 | |
OL-TFA9882UK | WLCSP | WLCSP9: wafer level chip-size package; 9 bumps | ---(EIAJ);---(JEDEC);---(IEC | 2011-05-26 |
OL-TFA9897 | WLCSP | wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm | 2014-10-09 | |
OL-TFA9897A | WLCSP | wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm | 2015-04-17 | |
OL-TFA9897B | WLCSP | wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included) | 2015-03-13 | |
OL-TFA9897C | WLCSP | wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating include) | 2015-05-07 | |
OL-TFA9981UK | WLCSP | Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm | 2010-10-25 | |
PCA9412 | WLCSP9 | wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) | 2016-08-04 | |
PN80V | UFLGA64 | plastic ultra thin fine-pitch land grid array package; 64 lands | 2016-04-21 | |
SOD106 | SMA; PMOS | transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors | DO-214AC(JEDEC | 2006-03-16 |
SOD107A | ALF2 | hermetically sealed plastic package; axial leaded; 2 leads | 1998-08-04 | |
SOD107B | ALF2 | hermetically sealed plastic package; axial leaded; 2 leads | 1998-08-05 | |
SOD110 | SOD2 | ceramic, very small ceramic rectangular surface-mounted package; 2 terminals; 2 mm x 1.25 mm x 1.6 mm body | 2006-03-16 | |
SOD113 | TO-220F | plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 "full pack" | 2-lead TO-220F(JEDEC | 2015-07-28 |
SOD113A | TO-220F | plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220F "full pack" | 2 LEADS TO220F(JEDEC | 2014-01-14 |
SOD118A | ALF2 | hermetically sealed plastic package; axial leaded; 2 leads | 1998-05-28 | |
SOD118B | ALF2 | hermetically sealed plastic package; axial leaded; 2 leads | 1998-05-28 | |
SOD119AB | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1998-12-04 | |
SOD119AC | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1999-06-24 | |
SOD119AD | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1999-06-24 | |
SOD123 | SOD123 | plastic, surface-mounted package; 2 leads; 2.675 mm x 1.6 mm x 1.15 mm body | 2016-08-31 | |
SOD123F | SOD123F | plastic, surface-mounted package; 2 leads; 2.6 mm x 1.6 mm x 1.1 mm body | 2006-03-16 | |
SOD123W | SOD123W | plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body | 2008-11-06 | |
SOD124 | SOD2 | transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors | DO-214AC(JEDEC | 2006-03-16 |
SOD125A | ALF2 | hermetically sealed plastic package; axial leaded; 2 leads | 2000-03-06 | |
SOD128 | SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | 2007-09-12 | |
SOD132 | SOD132 | Hermetically sealed plastic package; SMB; 2 leads | SMB. DO-214AA(JEDEC | 2013-03-20 |
SOD141 | DO-201AD | Hermetically sealed plastic package; axial leaded; 2 leads | DO-201AD(JEDEC | 2010-05-18 |
SOD142 | SOD142 | Plastic Single-ended through-hole package; Heatsink mounted; 1 mounting hole; 2-lead TO-247 | TO-247(JEDEC | 2012-11-27 |
SOD1608 | DFN1608D-2 | plastic, leadless ultra small plastic package; 2 terminals; 0.94 mm pitch; 1.6 mm x 0.8 mm x 0.37 mm body | 2011-11-29 | |
SOD27 | ALF2 | glass, hermetically sealed glass package; axial leaded; 2 leads; 4.25 mm x 1.85 mm body | SC-40(EIAJ);DO-34(JEDEC);A24(IEC | 2014-02-26 |
SOD323 | SOD323 | plastic, surface-mounted package; 2 leads; 1.3 mm pitch; 1.7 mm x 1.25 mm x 0.95 mm body | SC-76(EIAJ | 2006-03-16 |
SOD323F | SOD323F | plastic, surface-mounted package; 2 leads; 1.7 mm x 1.25 mm x 0.7 mm body | SC-90(EIAJ | 2006-03-16 |
SOD523 | SOD523 | plastic, surface-mounted package; 2 leads; 1.2 mm x 0.8 mm x 0.6 mm body | SC-79(EIAJ | 2006-03-16 |
SOD523V | SC-79 | plastic surface-mounted package; 2 leads | SC-79(EIAJ | 2006-03-16 |
SOD57 | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-10-14 | |
SOD59 | TO-220AC | plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC | 2-lead TO-220AC(JEDEC | 2012-11-27 |
SOD59A | TO-220AC | Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC | 2015-03-30 | |
SOD64 | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-10-14 | |
SOD66 | DO-41 | glass, hermetically sealed glass package; 2 leads; 4.8 mm x 2.6 mm body | DO-41(JEDEC | 1997-06-20 |
SOD68 | DO-34 | glass, hermetically sealed glass package; 2 leads; 3.04 mm x 1.6 mm body | DO-34(JEDEC | 1997-06-09 |
SOD70 | PBCYT2 | plastic near cylindrical single-ended package; 2 in-line leads | 2006-09-15 | |
SOD723 | SOD2 | plastic surface mounted package; 2 leads | 2006-03-16 | |
SOD80C | LLDS; MiniMelf | glass, hermetically sealed glass surface-mounted package; 2 connectors; 3.5 mm x 1.5 mm body | 100H01(IEC | 2006-03-16 |
SOD81 | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-20 | |
SOD83A | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-11 | |
SOD83B | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-27 | |
SOD87 | MELF | glass, hermetically sealed glass surface mounted package; 2 terminals; 3.5 mm x 2.1 mm body | 100H03(IEC | 2006-03-16 |
SOD882 | DFN1006-2 | plastic, leadless ultra small package; 2 terminals; 0,65 mm pitch; 1 mm x 0.6 mm x 0.48 mm body | 2014-08-26 | |
SOD882D | DFN1006D-2 | plastic, leadless ultra small plastic package; 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.4 mm body | 2010-09-27 | |
SOD882T | SOD2 | leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.4 mm | 2006-04-12 | |
SOD88A | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-20 | |
SOD88B | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-20 | |
SOD89A | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-20 | |
SOD89B | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-20 | |
SOD91 | GALF2 | hermetically sealed glass package; axial leaded; 2 leads | 1997-06-09 | |
SOD923 | SOD2 | Microlead ultra small surface-mounted plastic package; 2 leads | ---(EIAJ);---(JEDEC);---(IEC | 2011-04-12 |
SOD95 | TO-220 | plastic single-ended package; low-profile 2-lead TO-220 | 2-lead TO-220(JEDEC | 1999-09-13 |
SOD962 | DSN0603-2 | DSN0603-2: leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm | 2010-07-23 | |
SOD962-2 | SOD2 | silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body | 2013-07-17 | |
SOD963 | DSN1608-2 | silicon, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.25 mm body | 2015-08-06 | |
SOD964 | DSN1608-2 | plastic, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.29 mm body | 2015-05-15 | |
SOD972 | DFN0603-2 | plastic, ultra small and leadless full encapsulated package; 2 terminals; 0.4 mm pitch; 0.63 mm x 0.33 mm x 0.2 mm body | 2016-10-10 | |
SOD992 | DSN0402-2 | silicon, leadless tiny package; 2 terminals; 0.25 mm pitch; 0.4 mm x 0.2 mm x 0.1 mm body | 2015-08-25 | |
SOD993 | DSN1006-2 | silicon, leadless ultra small package; 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.27 mm body | 2014-10-24 | |
SOD995 | DSN1006U-2 | silicon, leadless ultra small package; 2 terminals; 0.325 mm pitch; 1 mm x 0.6 mm x 0.27 mm body | 2014-12-09 | |
SOP022-1 | LGA274 | land grid array package; 274 lands | 2013-04-16 | |
SOP022-2 | LGA350 | land grid array package; 350 lands | 2013-08-02 | |
SOT1000-1 | HVQFN36R | plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm | 2008-03-14 | |
SOT1001-1 | HVQFN36R | plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 5.5 x 4.5 x 0.85 mm | 2007-11-14 | |
SOT1003-1 | HVQFN | plastic thermal enhanced very thin quad flat package; no leads; 25 terminals; body 5 x 5 x 0.85 mm | 2016-05-19 | |
SOT1008-1 | HUQFN60U | plastic thermal enhanced ultra thin quad flat package; no leads; 60 terminals; UTLP based; body 5 x 5 x 0.55 mm | 2008-04-10 | |
SOT100A | CRDB4 | hermetic ceramic surface mounted package; 4 leads | 2006-03-16 | |
SOT101-1 | DIP24 | plastic, dual in-line package; 24 leads; 2.54 mm pitch; 31.7 mm x 13.8 mm x 5.1 mm body | SC-509-24(EIAJ);MO-015(JEDEC);051G02(IEC | 2003-02-13 |
SOT1011-1 | HLQFN48R | plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; body 7 x 7 x 1.28 mm | 2007-11-14 | |
SOT1012-1 | TFBGA100 | plastic thin fine-pitch ball grid array package; 100 balls | MO-195(JEDEC | 2007-06-05 |
SOT1016-1 | TFBGA160 | plastic thin fine-pitch ball grid array package; 160 balls | 2007-07-27 | |
SOT1017-1 | LQFP176 | plastic low profile quad flat package; 176 leads; body 20 x 20 x 1.4 mm | MS-026(JEDEC | 2007-08-20 |
SOT1018-1 | BGA256 | plastic ball grid array package; 256 balls, 1 mm pitch, 17 mm x 17 mm x 1.45 mm body | 2007-08-20 | |
SOT1019-1 | LFBGA208 | plastic low profile fine-pitch ball grid array package; 208 balls, 0.8 mm pitch, 14 mm x 14 mm x 1.35 mm body | 2007-08-20 | |
SOT102-1 | DIP18 | plastic dual in-line package; 18 leads (300 mil) | MS-001(JEDEC | 2003-02-13 |
SOT102-2 | DIP18 | plastic dual in-line package; 18 leads (300 mil); slim corner leads | MS-011(JEDEC | 2003-02-13 |
SOT102-4 | DIP18 | plastic dual in-line package; 18 leads (300 mil); long body | MS-001(JEDEC | 2003-03-12 |
SOT1020-1 | LFBGA256 | plastic low profile fine-pitch ball grid array package; 256 balls, 0.8 mm pitch, 14 mm x 14 mm x 1.35 mm body | 2007-08-20 | |
SOT1020-2 | LFBGA256 | LFBGA256, low profile fine-pitch ball grid array; 256 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.6 mm body | 2017-03-13 | |
SOT1020-3 | LFBGA256 | LFBGA256, plastic low profile fine-pitch ball grid array; 256 terminals | 2021-08-03 | |
SOT1021-1 | LFBGA324 | plastic low profile fine-pitch ball grid array package; 324 balls | 2007-08-20 | |
SOT1022-1 | LFBGA477 | plastic low profile fine-pitch ball grid array package; 477 balls | 2007-07-27 | |
SOT1023 | LFPAK56; Power-SO8 | plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body | 2013-03-05 | |
SOT1024-1 | LFBGA169 | plastic low profile fine-pitch ball grid array package; 169 balls | 2007-08-21 | |
SOT1024-2 | LFBGA169 | plastic low profile fine-pitch ball grid array package; 169 balls | 2008-08-07 | |
SOT1025-1 | HUQFN60U | plastic thermal enhanced ultra thin quad flat package; no leads; 60 terminals; UTLP based, 0.5 mm pitch, 4 mm x 6 mm x 0.55 mm body | 2007-11-14 | |
SOT1026-1 | HWQFN28 | plastic thermal enhanced very very thin quad flat package; no leads; 28 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.75 mm body | 2007-08-23 | |
SOT1027-1 | BGA596 | plastic ball grid array package; 596 balls | 2007-11-06 | |
SOT1028-1 | LFBGA296 | plastic low profile fine-pitch ball grid array package; 296 balls | 2007-09-28 | |
SOT1029-1 | LFBGA161 | plastic low profile fine-pitch ball grid array package; 161 balls | 2007-09-28 | |
SOT1031-1 | HWQFN48R | plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm | 2007-12-01 | |
SOT1031-2 | HWQFN48R | plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm | 2008-03-26 | |
SOT1032-1 | HVQFN108U | plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; UTLP based; body 8 x 8 x 0.9 mm | 2008-10-17 | |
SOT1032-2 | HVQFN108U | plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm | 2008-10-16 | |
SOT1032-3 | HVQFN108U | plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm | 2008-10-17 | |
SOT1033-1 | HWQFN56R | plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 11 x 5 x 0.7 mm | 2007-12-01 | |
SOT1033-2 | HWFLGA56 | HWFLGA56, thermal enhanced very very thin fine-pitch land grid array package, 56 terminals, 0.5 mm pitch, 5 mm x 11 mm x 0.71 mm body | 2018-05-25 | |
SOT1034-1 | BGA736 | plastic ball grid array package; 736 balls | 2007-09-28 | |
SOT1035-1 | HBGA736 | plastic thermal enhanced ball grid array package; 736 balls; heatsink | 2009-08-14 | |
SOT1036-1 | HUQFN76U | plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm | 2007-12-01 | |
SOT1039-1 | HXQFN16U | plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.5 mm | 2007-12-01 | |
SOT1039-2 | HXQFN16(U) | HXQFN16 (U) plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals, 0.5 mm pitch, 3 mm x 3 mm x 0.5 mm body | 2011-03-30 | |
SOT1040-1 | FCS2 | plastic flip chip strap package; 2 leads; 9 mm wide tape | 2007-10-18 | |
SOT1041-1 | FCS2 | plastic flip chip strap package; 2 leads; 12 mm wide tape | 2007-10-18 | |
SOT1042 | FCS2 | polymer strap package; 2 leads; 14 mm wide tape | 2011-04-21 | |
SOT1042-1 | FCS2 | plastic flip chip strap package; 2 leads; 14 mm wide tape | 2007-10-18 | |
SOT1045-1 | DHXQFN20U | plastic dual in-line compatible thermal enhanced extremely thin quad flat package; no leads; 20 terminals; UTLP based | 2009-08-04 | |
SOT1045-2 | DHXQFN20 | plastic, dual in-line compatible thermal enhanced extremely thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 0.5 mm body | 2011-08-18 | |
SOT1046-1 | HXQFN16U | plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based | 2007-12-01 | |
SOT1046-2 | HXQFN16 | plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals | 2011-03-30 | |
SOT1047-1 | BGA485 | plastic ball grid array package; 485 balls | MS-034(JEDEC);144E(IEC | 2007-11-14 |
SOT1048-1 | TFBGA296 | plastic thin fine-pitch ball grid array package; 296 balls | MO-216(JEDEC | 2007-11-02 |
SOT1049-1 | XQFN10U | plastic extremely thin quad flat pack package; no leads; 10 terminals; UTLP based | MO-255(JEDEC | 2010-02-05 |
SOT1049-2 | XQFN10U | plastic extremely thin quad flat pack package; no leads; 10 terminals; UTLP based | MO-255(JEDEC | 2010-02-05 |
SOT1049-3 | XQFN10 | plastic, extremely thin quad flat package; 10 terminals; 0.5 mm pitch; 1.55 mm x 2 mm x 0.5 mm body | MO255(JEDEC | 2011-03-30 |
SOT1050 | USON6 | plastic ultra thin small outline package; no leads; 6 terminals | 2008-06-03 | |
SOT1051-1 | TFBGA273 | plastic thin fine-pitch ball grid array package; 273 balls | MO-195(JEDEC | 2007-11-14 |
SOT1052-1 | HXSON8 | plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm | MO-229(JEDEC | 2008-03-11 |
SOT1052-2 | HXSON8 | HXSON8: thermal enhanced extremely thin small outline package; no leads; 8 terminals, 0.5 mm pitch, 3 mm x 2 mm x 0.5 mm body | 2022-01-06 | |
SOT1054-1 | HVSON14 | plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm | 2008-03-06 | |
SOT1055-1 | HVQFN41 | plastic thermal enhanced very thin quad flat package; no leads; 41 terminals; body 7 x 7 x 0.85 mm | 2008-01-23 | |
SOT1056-1 | HVQFN38R | plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm | 2007-11-30 | |
SOT1058-1 | LFBGA136 | plastic low profile fine-pitch ball grid array package; 136 balls | 2008-01-03 | |
SOT1059-1 | XSON10U | plastic, extremely thin small outline package; no leads; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body | 2008-01-18 | |
SOT1061 | DFN2020-3 | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | 2008-10-07 | |
SOT1061D | DFN2020D-3 | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | 2015-01-09 | |
SOT1062-1 | LFBGA286 | plastic low profile fine-pitch ball grid array package; 286 balls | MO-205(JEDEC | 2008-01-28 |
SOT1063-1 | VFBGA48 | plastic very thin fine-pitch ball grid array package; 48 balls | 2008-03-17 | |
SOT1064-1 | LFBGA84 | plastic low profile fine-pitch ball grid array package; 84 balls | 2008-04-02 | |
SOT1065-1 | TFBGA54 | plastic thin fine-pitch ball grid array package; 54 balls | 2008-03-27 | |
SOT1068-1 | HUQFN16U | plastic thermal enhanced ultra thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.55 mm | 2008-02-26 | |
SOT1069-2 | HWSON8 | HWSON8: plastic thermal enhanced very very thin small outline package, no leads; 8 terminals; | MO-229(JEDEC | 2009-05-25 |
SOT1070-1 | LFBGA296 | plastic low profile fine-pitch ball grid array package; 296 balls | 2008-02-11 | |
SOT1071-1 | VFBGA81 | plastic very thin fine-pitch ball grid array package; 81 balls | 2008-02-08 | |
SOT1072-1 | LFBGA169 | plastic low profile fine-pitch ball grid array package; 169 balls | MO-275(JEDEC | 2008-04-02 |
SOT1073-1 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls | 2008-03-14 | |
SOT1074-1 | HWQFN48 | plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.65 mm | 2008-03-14 | |
SOT1075-1 | LFBGA49 | plastic low profile fine-pitch ball grid array package; 49 balls | 2008-03-17 | |
SOT1077-1 | LFBGA487 | plastic low profile fine-pitch ball grid array package; 487 balls | 2008-03-19 | |
SOT1077-2 | LFBGA487 | plastic low profile fine-pitch ball grid array package; 487 balls | 2009-02-19 | |
SOT1078-1 | VFBGA144 | plastic very thin fine-pitch ball grid array package; 144 balls | 2008-04-07 | |
SOT1079-1 | LFBGA141 | plastic low profile fine-pitch ball grid array package; 141 balls | 2008-04-10 | |
SOT108-1 | SO14 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | MS-012(JEDEC);076E06(IEC | 2003-02-19 |
SOT108-2 | SO14 | plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm | MS-012(JEDEC | 2003-02-19 |
SOT108-4 | SO14 | SO14, plastic, small outline package; 14 terminals; 1.27 mm pitch; 3.9 mm x 8.65 mm x 1.5 mm body | 2017-06-11 | |
SOT1080-1 | HUQFN24U | plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm | 2008-04-17 | |
SOT1081-1 | XSON10U | plastic, extremely thin small outline package; 10 terminals; 0.35 mm pitch; 1.7 mm x 1 mm x 0.35 mm body | 2008-04-18 | |
SOT1081-2 | XSON10 | plastic, extremely thin small outline package; 10 terminals; 0.35 mm pitch; 1.7 mm x 1 mm x 0.5 mm body | 2011-03-30 | |
SOT1082-1 | VSON6U | plastic very thin small outline package; no leads; 6 terminals; UTLP based | 2009-06-17 | |
SOT1085-1 | LFBGA273 | plastic low profile fine-pitch ball grid array package; 273 balls | MO-195(JEDEC | 2008-04-29 |
SOT1086-1 | HVSON14 | plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm | MO-229(JEDEC | 2008-07-03 |
SOT1086-2 | HVSON14 | plastic, thermal enhanced very thin small outline package; no leads; 14 terminals, 0.65 mm pitch, 4.5 mm x 3 mm x 0.85 mm body | MO-229(JEDEC | 2010-07-15 |
SOT1086-3 | HVSON14 | plastic, thermal enhanced very thin small outline package; no leads; 14 terminals | MO-229(JEDEC | 2011-08-30 |
SOT1087-1 | VFBGA100 | plastic very thin fine-pitch ball grid array package; 100 balls | 2008-05-27 | |
SOT1087-2 | VFBGA100 | VFBGA100, plastic, very thin fine-pitch ball grid array; 100 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.66 mm body | 2017-06-11 | |
SOT1088-1 | HBGA520 | plastic thermal enhanced ball grid array package; 520 balls; heatsink | MS-034(JEDEC);144E(IEC | 2008-06-03 |
SOT1089 | XSON8 | plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | MO-252(JEDEC | 2010-04-12 |
SOT1089-1 | XSON8 | plastic, extremely thin small outline package; no leads; 8 terminals, 0.35 mm pitch, 1.35 mm x 1 mm x 0.5 mm body | 2010-06-30 | |
SOT109-1 | SO16 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | MS-012(JEDEC);076E07(IEC | 2003-02-19 |
SOT109-2 | SO16 | plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height | MS-012(JEDEC);076E07(IEC | 2003-02-19 |
SOT109-3 | SO16 | plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm | MS-012AC(JEDEC | 2003-02-19 |
SOT109-5 | SO16 | SO16, plastic, small outline; leaded package; 16 terminals; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | 2017-03-24 | |
SOT1090-1 | BGA426 | plastic ball grid array package; 426 balls | MS-034(JEDEC);144E(IEC | 2008-06-19 |
SOT1091-1 | TFBGA49 | plastic thin fine-pitch ball grid array package; 49 balls | 2008-06-23 | |
SOT1092-1 | HVQFN36 | plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2008-11-12 |
SOT1092-2 | HVQFN36 | plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 mm x 6 mm x 0.85 mm | 2009-02-24 | |
SOT1092-2(D) | HVQFN36 | plastic thermal enhanced very thin quad flat package; no leads; 0.1 dimple wettable flank; 36 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2018-03-08 | |
SOT1092-2(DD) | HVQFN36 | plastic thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 36 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2018-01-09 | |
SOT1092-3 | HVQFN36 | plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.85 mm body | MO-220(JEDEC | 2012-01-10 |
SOT1092-4 | HVQFN36 | plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 mm x 6 mm x 0.85 mm | 2016-10-03 | |
SOT1092-5 | HVQFN36 | HVQFN36, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks, 36 terminals; body 6 mm x 6 mm x 0.85 mm | 2017-09-09 | |
SOT1092-6(DD) | HVQFN36 | HVQFN36, plastic thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 36 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2018-05-29 | |
SOT1093-1 | TQFP80 | TQFP80: plastic thin quad flat package; 80 leads; body 14 x 14 x 1.1 mm | MS-026(JEDEC);136E19(IEC | 2008-11-14 |
SOT1094-1 | BGA376 | plastic ball grid array package; 376 balls | MS-034(JEDEC);144E(IEC | 2008-11-14 |
SOT1095-1 | HBGA624 | plastic thermal enhanced ball grid array package; 624 balls; heatsink, 1 mm pitch, 35 mm x 35 mm x1.75 mm body | 2008-11-17 | |
SOT1096-1 | BGA452 | plastic ball grid array package; 452 balls | MS-034(JEDEC);144E(IEC | 2008-11-14 |
SOT1097-1 | LBGA228 | plastic low profile ball grid array package; 228 balls | 2008-11-17 | |
SOT1097-2 | LBGA228 | plastic low profile ball grid array package; 228 balls, 1 mm pitch, 17 mm x 17 mm x 1.01 mm body | 2009-12-01 | |
SOT1098-1 | LFBGA268 | plastic low profile fine-pitch ball grid array package; 268 balls | 2008-11-17 | |
SOT1099-1 | LQFP256 | plastic low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm | MS-026(JEDEC);136E31(IEC | 2009-04-08 |
SOT110-1 | SIL9MPF | plastic single in-line medium power package with fin; 9 leads | 2003-03-12 | |
SOT1102-1 | BGA456 | BGA456: plastic ball grid array package; 456 balls | MS-034(JEDEC);144E(IEC | 2008-11-19 |
SOT1103-2 | QFP80 | QFP80, plastic, quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.2 mm body | PQFP-G80(JEDEC | 2017-06-11 |
SOT1103-3 | HQFP80 | plastic, thermal enhanced quad; flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.3 mm body | 2016-06-06 | |
SOT1104-1 | LFBGA135 | plastic low profile fine-pitch ball grid array package; 135 balls | 2008-08-06 | |
SOT1107-1 | TFBGA296 | plastic thin fine-pitch ball grid array package; 296 balls | 2008-08-07 | |
SOT1108-1 | MTSSN4R | metal thin special-shape package; no leads; 4 terminals; resin based; body 4 mm x 3 mm x 1 mm | 2008-08-20 | |
SOT111-1 | DBS9MPF | plastic DIL-bent-SIL medium power package with fin; 9 leads | 2003-03-12 | |
SOT1113-1 | HVQFN44 | plastic thermal enhanced very thin quad flat package; no leads; 44 terminals | 2010-07-23 | |
SOT1113-2 | HVQFN44 | HVQFN44, plastic, thermal enhanced very thin quad flatpack; no leads; 44 terminals; 0.65 mm pitch; 9 mm x 9 mm x 1 mm body | H-PQFN-N44(JEDEC | 2017-06-11 |
SOT1113-3 | HVQFN44 | HVQFN44, plastic, thermal enhanced very thin quad flatpack; no leads; 44 terminals; 0.65 mm pitch; 9 mm x 9 mm x 1 mm body | 2019-04-05 | |
SOT1114-1 | HWQFN56R | plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm | 2008-10-07 | |
SOT1115 | XSON6 | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | 2010-04-07 | |
SOT1116 | XSON8 | plastic, extremely thin small outline package; 8 terminals; 0.55 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | 2010-04-07 | |
SOT1118 | HUSON6 | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | 2013-06-06 | |
SOT1118D | HUSON6 | plastic, thermally enhanced ultra thin and small outline package; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | 2014-07-16 | |
SOT1119-1 | HBGA432 | plastic thermal enhanced ball grid array package; 432 balls; heatsink | MS-034(JEDEC);144E(IEC | 2009-08-14 |
SOT1122 | XSON3 | plastic extremely thin small outline package; no leads; 3 terminals | MO-252(JEDEC | 2009-10-09 |
SOT1122-1 | XSON3 | plastic extremely thin small outline package; no leads; 3 terminals | 2013-07-11 | |
SOT1123-1 | HBGA324 | plastic thermal enhanced ball grid array package; 324 balls; heatsink | MS-034(JEDEC);144E(IEC | 2009-06-09 |
SOT1123-2 | HBGA324 | plastic thermal enhanced ball grid array package; 324 balls; heatsink | MS-034(JEDEC);144E(IEC | 2010-01-06 |
SOT1128-1 | HLQFP256 | plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; heatsink | MS-026(JEDEC | 2008-12-19 |
SOT1129-1 | BGA324 | plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm | MS-034(JEDEC);144E(IEC | 2009-02-05 |
SOT1129-2 | BGA324 | plastic ball grid array package; 324 balls | MS-034(JEDEC);144E(IEC | 2009-03-31 |
SOT1129-3 | BGA324 | BGA324, plastic, ball grid array; 324 balls; 1 mm pitch; 23 mm x 23 mm x 1.95 mm body | PBGA-B324(JEDEC | 2017-06-11 |
SOT1131-1 | HSOP44 | plastic, heatsink small outline package; 44 leads; low stand-off height, 0.65 mm pitch, 15.9 mm x 11.0 mm x 3.3 mm body | 2010-08-18 | |
SOT1133-1 | HXQFN60U | plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based, 0.5 mm pitch, 5 mm x 5 mm x 0.5 mm body | 2010-04-09 | |
SOT1133-2 | HXQFN60U | plastic compatible thermal enhanced extremely thin quad flat package; no leads; 60 terminals | 2011-08-22 | |
SOT1134-1 | HXQFN60U | plastic, thermal enhanced extremely thin quad flat package; 60 terminals; 0.5 mm pitch; 4 mm x 6 mm x 0.5 mm body | 2009-01-22 | |
SOT1134-2 | HXQFN60U | plastic, compatible thermal enhanced extremely thin quad flat package; 60 terminals; 0.5 mm pitch; 4 mm x 6 mm x 0.5 mm body | 2011-08-22 | |
SOT1136-1 | BGA420 | plastic ball grid array package; 420 balls | MS-034(JEDEC);144E(IEC | 2009-05-20 |
SOT1139-1 | BGA582 | plastic ball grid array package; 582 balls, 1 mm pitch, 27 mm x 27 mm x 1.87 mm body | MS-034 Compliant(JEDEC | 2009-05-26 |
SOT1140-1 | BGA806 | plastic ball grid array package; 806 balls | MS-034 Compliant(JEDEC | 2009-05-26 |
SOT1141-1 | LFBGA385 | plastic low profile fine-pitch ball grid array package; 385 balls | 2009-05-25 | |
SOT1142-1 | HBGA543 | plastic thermal enhanced ball grid array package; 543 balls; heatsink, 1 mm pitch, 27 mm x 27 mm x 1.73 mm body | 2009-08-03 | |
SOT1143-1 | LFBGA417 | plastic low profile fine-pitch ball grid array package; 417 balls | 2009-06-19 | |
SOT1144-1 | HVQFN42 | plastic thermal enhanced very thin quad flat package; no leads; 42 terminals | 2009-08-28 | |
SOT1145-1 | TFBGA385 | plastic thin fine-pitch ball grid array package; 385 balls, 0.5 mm pitch, 12 mm x 12 mm x 0.81 mm body | 2009-08-18 | |
SOT1147-1 | HXSON16U | plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals;UTLP based | 2009-10-02 | |
SOT1148-1 | HBGA404 | HBGA404, plastic thermal enhanced ball grid array; 404 balls; 1 mm pitch, 23 mm x 23 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2017-06-14 |
SOT1149-1 | BGA708 | plastic ball grid array package; 708 balls | MS-034D Compliant(EIAJ);MS-034D Compliant(JEDEC);MS-034D Compliant(IEC | 2010-10-19 |
SOT1151-1 | HBGA640 | plastic thermal enhanced ball grid array package; 640 balls; heatsink | MS-034D compliant(JEDEC | 2009-10-19 |
SOT1152-1 | HVQFN32R | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based | 2009-11-16 | |
SOT1153-1 | BGA456 | plastic ball grid array package; 456 balls | MS-034D compliant(JEDEC | 2009-11-16 |
SOT1154-1 | DBSMS27P | plastic dual bent surface mounted SIL power package; 27 leads | 2013-02-13 | |
SOT1155-1 | TFBGA48 | TFBAG48, plastic thin fine-pitch ball grid array package; 48 balls, 0.5 mm pitch, 4.5 mm x 4.5 mm x 0.8 mm body | 2009-11-27 | |
SOT1155-2 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls | 2013-06-19 | |
SOT1156-1 | DFN2521-12 | plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 2.1 mm x 0.5 mm body | 2010-09-17 | |
SOT1157-1 | DFN1712-8 | plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.2 mm x 0.5 mm body | 2009-12-17 | |
SOT1158-1 | DFN2512-12 | plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.2 mm x 0.5 mm body | 2009-12-17 | |
SOT1159_1 | DFN3312-16 | plastic, thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.2 mm x 0.5 mm body | 2009-12-17 | |
SOT115BA | SFM7 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC; 7 SN-plated in-line leads | 2005-11-11 | |
SOT115D | SFM9 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes;2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads | 2004-02-04 | |
SOT115J | SFM7 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads | 2004-02-04 | |
SOT115JA | SFM7 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads | 2012-09-14 | |
SOT115T | SFO8 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads | 2004-02-04 | |
SOT115W | SFO8 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads | 1999-04-13 | |
SOT115X | SFO8 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads | 2004-02-04 | |
SOT115Y | SFO8 | rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads | 2004-02-05 | |
SOT116-1 | DIP22 | DIP22, plastic dual in-line package; 22 leads, 2.54 mm pitch, 27.94 mm x 8.7 mm x 3.81 mm body | MS-010(JEDEC);060G07(IEC | 1999-12-27 |
SOT1160-1 | XQFN10 | XQFN10, plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | 2021-01-26 | |
SOT1160-2 | XQFN10 | plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.8 x 1.4 x 0.5 mm | 2014-03-10 | |
SOT1161-1 | XQFN16 | plastic, extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 1.8 mm x 2.6 mm x 0.5 mm body | 2009-12-29 | |
SOT1161-2 | XQFN16 | XQFN16, plastic, extremely thin quad flat package; no leads; 16 terminals; 0.4 mm pitch, 2.6 mm x 1.8 mm x 0.5 mm body | 2021-01-26 | |
SOT1162-1 | BGA582 | plastic ball grid array package; 582 balls | MS-034D Compliant(JEDEC | 2009-12-29 |
SOT1163-1 | HBGA360 | plastic, thermal enhanced ball grid array package; 360 balls; heatsink | MS-034(JEDEC);144E(IEC | 2010-01-22 |
SOT1164-1 | BGA360 | plastic ball grid array package; 360 balls | MS-034(JEDEC);144E(IEC | 2010-01-22 |
SOT1165-1 | DFN2510-10 | plastic, extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body | 2013-02-18 | |
SOT1166-1 | DFN1714-8 | plastic, thermal enhanced ultra thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.55 mm body | 2010-03-22 | |
SOT1167-1 | DFN2514-12 | plastic, thermal enhanced ultra thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.35 mm x 0.55 mm body | 2010-03-22 | |
SOT1168-1 | HUSON6 | plastic, thermal enhanced ultra thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.55 mm body | 2010-03-22 | |
SOT1169-1 | LFBGA256 | plastic low profile fine-pitch ball grid array package; 256 balls | 2010-03-01 | |
SOT117-1 | DIP28 | plastic, dual in-line package; 28 leads; 2.54 mm body; 35.7 mm x 13.8 mm x 5.1 mm body | SC-510-28(EIAJ);MO-015(JEDEC);051G05(IEC | 2003-02-13 |
SOT117-2 | DIP28 | plastic dual in-line package; 28 leads (600 mil); long body | SC-510-28(EIAJ);MS-011(JEDEC);051G06(IEC | 2003-03-12 |
SOT117-3 | DIP28 | plastic, dual in-line package; 2.54 mm pitch, 13.9 mm x 36.85 mm x 3.81 mm body | 2017-03-21 | |
SOT117-4 | DIP28 | DIP28, plastic, dual in-line package; 28 terminals; 2.54 mm pitch; 13.97 mm x 36.83 mm x 5.08 mm body | E-PDIP-T28(JEDEC | 2017-06-11 |
SOT1172-1 | HTSSOP28 | plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad | MO-153(JEDEC | 2010-03-31 |
SOT1172-2 | HTSSOP28 | plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad | MO-153(JEDEC | 2010-07-13 |
SOT1172-3 | HTSSOP28 | plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad | MO-153(JEDEC | 2013-09-12 |
SOT1172-4 | HTSSOP28 | HTSSOP28, plastic, thermal enhanced thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 1 mm body | TS-PDSO-G28(JEDEC | 2017-06-11 |
SOT1173-1 | HVQFN64R | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based | 2010-04-02 | |
SOT1174-1 | XQFN12 | plastic, extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 1.7 mm x 2 mm x 0.5 mm body | MO-288(JEDEC | 2010-04-21 |
SOT1175-1 | SO7 | plastic small outline package; 7 leads; body width 3.9 mm | 2010-04-21 | |
SOT1176-1 | DFN2510A-10 | plastic, extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body | 2010-06-22 | |
SOT1177-1 | XSON10 | plastic extremely thin small outline package; no leads; 10 terminals | 2010-11-08 | |
SOT1178-1 | DFN2110-9 | plastic, extremely thin small outline package; 9 terminals; 0.4 mm pitch; 2.1 mm x 1 mm x 0.5 mm body | 2010-06-03 | |
SOT1180-1 | HWQFN32 | plastic thermal enhanced very very thin quad flat package; no leads; 32 terminals | 2010-08-05 | |
SOT1181-1 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad | MS-026(JEDEC | 2010-08-04 |
SOT1181-2 | HTQFP48 | HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad | MS-026(JEDEC | 2012-10-23 |
SOT1182-1 | HXQFN16 | plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals | 2010-09-16 | |
SOT1183-1 | HXQFN16 | plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals | 2010-07-29 | |
SOT1184-1 | HSOP14 | plastic, heatsink small outline package; 14 leads | 2010-08-10 | |
SOT1185-1 | HVQFN32 | HVQFN32: plastic termal enhanced very thin quad flat package; no leads; 32 terminals | 2010-08-09 | |
SOT1186-1 | HSOP14F | plastic, heatsink small outline package; 14 leads (flat) | 2010-09-20 | |
SOT1187-1 | XSON8 | Plastic extremely thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2010-10-07 |
SOT1188-1 | SIL4 | plastic, single in-line package | 2010-10-04 | |
SOT1188-2 | SIL4 | SIL4, plastic single in-line package, 4 terminals, 1.8 mm pitch, 11 mm x 7.4 mm x 1.95 mm body | 2019-01-23 | |
SOT1188-3 | SIL4 | SIL4, plastic single in-line package, 4 terminals, 1.8 mm pitch, 11 mm x 7.4 mm x 1.95 mm body | 2021-12-14 | |
SOT1189-1 | HXSON6 | plastic, thermal enhanced extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | 2018-08-14 | |
SOT1190-1 | LFBGA144 | plastic low profile fine-pitch ball grid array package; 144 balls, 0.8 mm pitch, 10 mm x 10 mm x 1 mm body | MO-205(JEDEC | 2013-01-10 |
SOT1190-2 | LFBGA144 | plastic low profile fine-pitch ball grid array package; 144 balls | MO-205(JEDEC | 2010-12-30 |
SOT1191-1 | XQFN10 | plastic, extremely thin quad flat package; no leads; 10 terminals | MO255(JEDEC | 2010-12-06 |
SOT1192-1 | HXSON4 | plastic, thermal enhanced extremely thin small outline package; 4 terminals; 0.65 mm pitch; 1 mm x 1 mm x 0.5 mm body | 2011-01-20 | |
SOT1193-1 | XQFN8 | Plastic, extremely thin quad flat package; no leads; 8 terminals | MO-255(JEDEC | 2010-11-02 |
SOT1193-2 | XQFN8 | plastic, extremely thin quad flat package; no leads; 8 terminals | MO-255(JEDEC | 2011-01-17 |
SOT1194-1 | DFN1010C-4 | plastic, thermal enhanced ultra thin small outline package; 4 terminals; 0.65 mm pitch; 1 mm x 1 mm x 0.55 mm body | 2011-01-25 | |
SOT1196-1 | SO12 | SO12: plastic small outline package; 12 leads; body width 3.9 mm | MS-012 Compliant(JEDEC | 2011-02-16 |
SOT1197-1 | HXSON10 | plastic, thermal enhanced extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.6 mm x 2.6 mm x 0.5 mm body | 2011-01-20 | |
SOT1198-1 | HVQFN54R | plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based | 2011-01-20 | |
SOT1199-1 | VFBGA24 | plastic very thin fine-pitch ball grid array package; 24 balls | 2011-02-16 | |
SOT1202 | XSON6 | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1mm x 0.35 mm body | 2010-04-06 | |
SOT1202-2 | X2SON6 | X2SON6, plastic super thin small outline package; no leads; 6 terminals; 1.0 mm x 1.0 mm x 0.32 mm body | 2018-03-08 | |
SOT1203 | XSON8 | plastic, extremely thin small outline package; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | 2010-04-06 | |
SOT1205 | LFPAK56D | plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body | 2014-10-28 | |
SOT1209 | HXSON6 | plastic thermal enhanced super thin small outline package; no leads; 6 terminals; body 2 x 1.3 x 0.35 mm | 2014-10-10 | |
SOT120A | CRPM4 | studded ceramic package; 4 leads | 1999-03-29 | |
SOT1210 | LFPAK33 | Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body | 2016-08-09 | |
SOT1215 | DFN1010D-3 | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | 2013-03-06 | |
SOT1216 | DFN1010B-6 | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | 2013-03-06 | |
SOT1220 | DFN2020MD-6 | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | 2012-05-03 | |
SOT1222-1 | HSOP6 | plastic, heatsink small outline package; 6 leads | 2012-07-02 | |
SOT1222-2 | HSOP6 | plastic, heatsink small outline package; 6 leads | 2015-06-08 | |
SOT1225 | DFN1612-8 | plastic, extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.6 mm x 1.2 mm x 0.4 mm body | 2012-07-24 | |
SOT1226 | X2SON5 | plastic, thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | 2012-04-18 | |
SOT1226-2 | X2SON5 | plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals | 2012-04-05 | |
SOT1229 | XSON6 | plastic, extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1.2 mm x 1.2 mm x 0.4 mm body | 2013-06-26 | |
SOT122E | CRPM4 | studded ceramic package; 4 leads | 1999-03-29 | |
SOT122F | CRPM4 | studded ceramic package; 4 leads | 1999-03-29 | |
SOT1230 | XSON6 | plastic very thin small outline package; no leads; 6 terminals; body 1.1 x 0.9 x 0.47 mm | 2013-01-08 | |
SOT1232 | XSON6 | XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm | 2013-11-08 | |
SOT1232-1 | XSON6 | plastic flip-chip quad flat package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm | 2014-08-29 | |
SOT1233 | X2SON | plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body | 2016-04-21 | |
SOT1234 | HX2SON6 | plastic, thermal enhanced super thin small outline package; no leads; 6 terminals; 0.4 mm pitch, 1.4 mm x 1.2 mm x 0.32 mm body | 2017-09-01 | |
SOT1235 | LFPAK88 | Plastic, single-ended surface-mounted package (LFPAK88; Power-SO8); 4 leads | 2016-06-02 | |
SOT1236 | LFPAK88D | Plastic, single-ended surface-mounted package (LFPAK88D; Power-SO8); 4 leads | 2016-06-02 | |
SOT1249B | LDMOST | Earless flanged LDMOST ceramic package; 6 leads | 2015-03-03 | |
SOT1252 | DFM8 | Plastic earless flanged cavity package; 6 leads | 2013-05-24 | |
SOT1254 | DPAK | plastic, thermal enhanced small outline package (DFN56 AD); 8 Leads; 1.27 mm pitch; 6 mm x 5 mm x 0.9 mm body | 2014-11-06 | |
SOT1255 | X2SON | plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | 2015-07-22 | |
SOT1259 | TO3P | Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO3P | 2014-10-22 | |
SOT1260-1 | HX2SON | plastic, thermal enhanced super thin small outline package; no leads; 8 terminals; body 1.5 mm x 1.5 mm x 0.3 mm | 2014-06-11 | |
SOT1261-1 | SOT1261 | plastic, thermal enhanced super thin quad flat package; no leads; 12 terminals; body 2.0 x 2.0 x 0.3 mm | 2014-06-20 | |
SOT1263 | SOT1263 | Microlead ultra small surface-mounted plastic package; 3 leads | 2011-03-22 | |
SOT1268 | DFN1412-6 | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.5 mm pitch; 1.4 mm x 1.2 mm x 0.47 mm body | 2016-09-02 | |
SOT1288 | SIP3 | Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads | 2016-08-02 | |
SOT1288-2 | SIP3 | Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads | 2013-08-05 | |
SOT1288-3 | SIL3 | Plastic single-ended package; 6 interconnections; 3 in-line leads, 2.54 mm pitch | 2019-02-15 | |
SOT1289 | CFP15 | plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body | 2014-04-29 | |
SOT129-1 | DIP40 | plastic dual in-line package; 40 leads (600 mil) | SC-511-40(EIAJ);MO-015(JEDEC);051G08(IEC | 2003-02-13 |
SOT129-4 | DIP40 | DIP40, plastic, dual in-line package; 40 terminals; 2.54 mm pitch; 13.97 mm x 52.07 mm x 5.08 mm body | E-PDIP-T40(JEDEC | 2017-06-11 |
SOT1290 | SOT1290 | SMAN2, plastic single-ended multi-chip package; magnetized ferrite (2 mm x 3 mm x 1 mm); 2 in-line leads | 2019-06-14 | |
SOT1291 | SOT1291 | SMAN2, plastic single-ended multi-chip package; magnetized trenched ferrite (3.8 mm x 6.15 mm x 3.6 mm); 2 in-line leads | 2021-05-07 | |
SOT1301-1 | HLLGA16 | HLLGA16, thermal enhanced low profile land grid array package, 16 terminals, 1.42 mm pitch, 8 mm x 8 mm x 1.3 mm body | 2018-01-19 | |
SOT1302-1 | FBGA196 | plastic fine-pitch ball grid array package; 196 balls | MO-205(JEDEC | 2011-02-22 |
SOT1303-1 | HLQFN56R | plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based | 2011-03-16 | |
SOT1304-1 | HLQFP176 | plastic thermal enhanced low profile quad flat package, 176 terminals, 0.4 mm pitch, 20 mm x 20 mm x 1.4 mm body | MS-026(JEDEC | 2011-04-20 |
SOT1305-1 | HSOP44 | HSOP44: plastic, heatsink small outline package; 44 leads; low stand-off height | 2011-05-31 | |
SOT1305-2 | HSOP44 | HSOP44, plastic, thermal enhanced small outline package; 44 terminals; 0.65 mm pitch; 15.9 mm x 11 mm x 3 mm body | PDSO-G44(JEDEC | 2017-06-11 |
SOT1306-1 | VFBGA64 | Plastic very thin fine-pitch ball grid array package; 64 balls | 2011-06-10 | |
SOT1307-1 | VFBGA64 | plastic very thin fine-pitch ball grid array package; 64 balls; | 2011-06-16 | |
SOT1307-2 | VFBGA64 | VFBGA64, plastic very thin fine-pitch ball grid array package; 64 balls; 0.5 mm pitch, 4.5 mm x 4.5 mm x 0.80 mm body | 2018-12-10 | |
SOT1308-1 | HVSON16 | Plastic thermal enhanced very thin small outline package; no leads; 16 terminals | MO-229(JEDEC | 2011-07-04 |
SOT1308-2 | HVSON16 | HVSON16, plastic thermal enhanced very thin small outline package; no leads;16 terminals; 0.65 mm pitch, 3.5 mm x 5.5 mm x 0.85 mm body | MO-229(JEDEC | 2015-09-08 |
SOT1309-1 | XQFN8 | plastic, extremely thin quad flat package; no leads | MO-255(JEDEC | 2011-08-23 |
SOT131-2 | SIL9P | plastic single in-line power package; 9 leads | 2003-03-12 | |
SOT1310-1 | XQFN24 | plastic, extremely thin quad flat package; no leads; 0.4 mm pitch; 3.4 mm x 2.5 mm x 0.5 mm body | MO-288(JEDEC | 2011-08-22 |
SOT1311-1 | SO8 | Plastic small outline package; 8 leads | 2011-08-18 | |
SOT1311-2 | SO8 | SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 5.28 mm x 5.3 mm x 2.05 mm body | E-PDSO-G8(JEDEC | 2017-06-11 |
SOT1312-1 | HXSON4 | HXSON4: plastic thermal enhanced extremely thin small outline package; no leads; 4 terminals; body 2.0 mm x 1.5 mm x 0.5 mm | 2012-11-05 | |
SOT1313-1 | HLQFP208 | plastic thermal enhanced low profile quad flat package: 208 leads | MS-026(JEDEC | 2011-11-04 |
SOT1313-2 | HLQFP208 | HLQFP208, plastic, thermal enhanced low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body | 2017-06-11 | |
SOT1314-1 | VSON4 | plastic very thin small outline package; no leads; 4 terminals | 2011-11-04 | |
SOT1315-1 | LFBGA170 | plastic low profile fine-pitch ball grid array package; 170 balls | MO-205(JEDEC | 2011-11-04 |
SOT1316-1 | LQFP48 | plastic low profile quad flat package; 48 leads; body 10 x 10 x 1.4 mm | 2011-11-03 | |
SOT1317-1 | HTFLGA80 | HTFLGA80, plastic thermal enhanced thin fine-pitch land grid array package; 80 terminals; resin based; 12 mm x 12 mm x 1.1 mm body | 2021-06-28 | |
SOT1318-1 | HXQFN32 | plastic, thermal enhanced extremely thin quad flat package; no leads; 32 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.5 mm body | 2011-11-30 | |
SOT1320-1 | VFBGA49 | plastic very thin fine-pitch ball grid array package; 49 balls | 2012-01-05 | |
SOT1321-1 | TFBGA132 | plastic thin fine-pitch ball grid array package; 132 balls | MO-205(JEDEC | 2012-01-25 |
SOT1322-1 | LFBGA223 | plastic low profile fine-pitch ball grid array package; 223 balls, 0.65 mm pitch, 12 mm x 12 mm x 1.3 mm body | MO-205(JEDEC | 2012-01-25 |
SOT1323-1 | VSON4 | plastic very thin small outline package; no leads; 4 terminals | 2012-03-08 | |
SOT1324-1 | FBGA144 | plastic fine-pitch ball grid array package; 144 balls | MO-205(JEDEC | 2012-03-08 |
SOT1325-1 | HVSON10 | plastic thermal enhanced very thin small outline package; no leads; 10 terminals | MO-229(JEDEC | 2012-04-17 |
SOT1327-1 | HWSON8 | HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2012-04-17 |
SOT1328-1 | TFBGA80 | plastic thin fine-pitch ball grid array package; 80 balls | 2012-07-02 | |
SOT1329-1 | TFBGA100 | plastic thin fine-pitch ball grid array package; 100 balls | 2012-07-02 | |
SOT1330-1 | SO14 | plastic small outline package; 14 leads | 2012-07-13 | |
SOT1331-1 | HTSSOP38 | plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad | 2012-09-21 | |
SOT1332-1 | LFBGA267 | plastic low profile fine-pitch ball grid array package; 267 balls | 2012-09-20 | |
SOT1333-1 | DFN2520-9 | plastic, extremely thin small outline package; 9 terminals; 0.5 mm pitch; 2 mm x 2.5 mm x 0.5 mm body | MO-252(JEDEC | 2013-05-01 |
SOT1334-1 | DFN4020-14 | plastic, extremely thin small outline package; 14 terminals; 0.5 mm pitch; 2 mm x 4 mm x 0.5 mm body | MO-252(JEDEC | 2013-05-01 |
SOT1335-1 | HVQFN16 | plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm | 2012-09-21 | |
SOT1336-1 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls | 2012-09-25 | |
SOT1337-1 | XQFN10 | plastic, extremely thin small outline package; 10 terminals; 0.4 mm pitch; 1.3 mm x 1.6 mm x 0.5 mm body | MO-288(JEDEC | 2012-09-11 |
SOT1338-1 | HXSON6 | plastic extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm | 2012-09-20 | |
SOT1339-1 | LFBGA217 | plastic low profile fine-pitch ball grid array package; 217 balls | MO-205(JEDEC | 2012-09-20 |
SOT1341-1 | XSON16 | plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm | MO-252(JEDEC | 2013-02-13 |
SOT1342-1 | XFBGA24 | plastic, extremely thin fine-pitch ball grid array package; 24 balls | 2012-09-25 | |
SOT1343-1 | TFBGA484 | plastic thin fine-pitch ball grid array package; 484 balls, 0.65 mm pitch, 15 mm x 15 mm x 1.2 mm body | 2012-11-26 | |
SOT1344-1 | UFLGA53R | plastic fine-pitch land grid array package; 53 lands | 2012-11-28 | |
SOT1345-1 | TFBGA50 | plastic thin fine-pitch ball grid array package; 50 balls | MO-195(JEDEC | 2013-07-17 |
SOT1346-1 | XQFN20 | plastic extremely thin small outline package; no leads; 20 terminals; body 2.00 x 2.70 x 0.40 mm | 2013-05-16 | |
SOT1347-1 | DIP8 | plastic dual in-line package; 7 leads (300 mil) | MO-001(JEDEC);076E03(IEC | 2013-01-21 |
SOT1348-1 | HXSON6 | plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm | 2015-05-15 | |
SOT1349-1 | WFBGA32 | plastic very-very-thin profile fine-pitch ball grid array package; 32 balls | 2013-02-21 | |
SOT1350-1 | UFLGA49 | plastic ultra thin fine-pitch land grid array package; 49 lands | 2013-06-04 | |
SOT1353-1 | TSOP6 | plastic surface-mounted package (TSOP6); 6 leads | SC-74(EIAJ | 2013-04-18 |
SOT1354-1 | XFBGA16 | plastic, extremely thin fine-pitch ball grid array package; 16 balls | 2013-08-27 | |
SOT1355-1 | X2QFN | X2QFN12: plastic, super thin quad flat package; no leads; 12 terminals; body 1.6 x 1.6 x 0.35 mm | 2014-01-13 | |
SOT1356-1 | XFBGA28 | plastic, extremely thin fine-pitch ball grid array package, 28 terminals, 0.5 mm pitch, 2 mm x 4 mm x 0.5 mm body | 2009-03-19 | |
SOT1358-1 | XSON7 | plastic, extremely thin small outline package; 7 terminals; 0.5 mm pitch; 1.1 mm x 2.1 mm x 0.5 mm body | 2013-09-12 | |
SOT1359-1 | HVFLGA | Plastic thermal enhanced very thin profile fine pitch land grid array package; 36 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body | 2015-01-27 | |
SOT1359-2 | HVLGA | HVLGA36, plastic thermal enchanced very thin profile land grid array package; 36 terminals; 5 mm x 5 mm x 0.72 mm body | 2017-03-28 | |
SOT136-1 | SO28 | plastic, small outline package; 28 leads; 1.27 mm pitch; 17.9 mm x 7.5 mm x 2.65 mm body | MS-013(JEDEC);075E06(IEC | 2003-02-19 |
SOT136-3 | SO28 | SO28, plastic, small outline package; 28 terminals; 1.27 mm pitch; 7.5 mm x 17.93 mm x 2.35 mm body | E-PDSO-G28(JEDEC | 2017-06-11 |
SOT1360-1 | HVSON20 | plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 mm x 5.5 mm x 0.85 mm | 2015-07-06 | |
SOT1360-2 | HVSON | plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 x 5.5 x 0.85 mm | 2015-05-11 | |
SOT1361-1 | UFBGA24 | UFBGA24: plastic ultra thin fine-pitch ball grid array package; 24 balls | 2013-11-07 | |
SOT1362-1 | HWSON4 | HWSON4: plastic thermal enhanced very very thin small outline package; no leads; 4 terminals; body 2.0 x 2.0 x 0.75 mm | MO-229(JEDEC | 2013-11-20 |
SOT1363-1 | WFBGA171 | WFBGA171: plastic very-very-thin profile fine-pitch ball grid array package; 171 balls | 2014-04-01 | |
SOT1364-1 | LFBGA97 | plastic, low profile fine-pitch ball grid array package, 97 terminals, 0.65 mm pitch, 8 mm x 8 mm x 1.3 mm body | 2013-12-23 | |
SOT1365-1 | TFBGA48 | Plastic thin fine-pitch ball grid array package; 48 balls, 0.65 mm pitch, 3 mm x 8 mm x 1.05 mm body | 2014-08-12 | |
SOT1369-2 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 mm x 5 mm x 0.85 mm | 2015-01-08 | |
SOT1369-3 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 mm x 5 mm x 0.85 mm | 2016-05-18 | |
SOT1369-4 | HVQFN40 | HVQFN40, plastic, thermally enhanced very thin quad flat, non-leaded package; 40 terminals; 0.4 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2020-10-15 | |
SOT1369-5 | HVQFN40 | HVQFN40, plastic, thermally enhanced very thin quad flat, non-leaded package; 40 terminals; 0.4 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2019-09-20 | |
SOT137-1 | SO24 | plastic small outline package; 24 leads; body width 7.5 mm | MS-013(JEDEC);075E05(IEC | 2003-02-19 |
SOT137-2 | SO24 | SO24, plastic, small outline package; 24 terminals; 1.27 mm pitch; 7.5 mm x 15.4 mm x 2.35 mm body | E-PDSO-G24(JEDEC | 2017-06-11 |
SOT1372-1 | SOT1372 | plastic thermal enhanced very thin small package; no leads; 8 terminals; body 3 x 2 x 0.35 mm | 2014-05-20 | |
SOT1373-1 | SOT1373 | plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad | 2014-05-20 | |
SOT1375-4 | WLCSP4 | WLCSP4, wafer level chip-scale package, 4 terminals, 1.03 mm x 0.94 mm x 0.5 mm body | 2016-04-26 | |
SOT1375-5 | WLCSP4 | WLCSP4, wafer level chip-scale package, 4 terminals, 1.31 mm x 0.94 mm x 0.5 mm body | 2018-11-30 | |
SOT1375-6 | WLCSP4 | WLCSP4, wafer level chip-scale package, 4 terminals, 0.4 mm pitch, 0.91 mm x 0.855 mm x 0.455 mm body (backside coating included) | 2022-07-15 | |
SOT1376-2 | WLCSP4 | WLCSP4, wafer level chip-scale package; 4 bumps; 0.97 mm x 0.97 mm x 0.54 mm body (backside coating included) | 2017-08-22 | |
SOT1379-3 | WLCSP6 | WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.23 mm body | 2018-11-20 | |
SOT1379-4 | WLCSP6 | WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.28 mm body | 2019-06-24 | |
SOT1380-1 | WLCSP6 | wafer level chip-scale package; 6 bumps; 0.69 mm x 1.09 mm x 0.38 mm | 2016-11-24 | |
SOT1380-5 | WLCSP6 | WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.22 mm x 0.85 mm x 0.6 mm body | 2017-06-11 | |
SOT1380-6 | WLCSP6 | WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.18 mm x 0.84 mm x 0.455 mm body (backside coating included) | 2020-12-04 | |
SOT1381-2 | WLCSP6 | WLCSP6, wafer level chip-size package; 6 terminals; 0.5 mm pitch; 1.39 mm x 0.89 mm x 0.465 mm body | 2021-12-06 | |
SOT1384-4 | WLCSP9 | WLCSP9, wafer level chip-scale package; 9 bumps; 1.50 mm x 1.28 mm x 0.60 mm body | 2017-03-03 | |
SOT1384-5 | WLCSP9 | wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included) | 2018-08-08 | |
SOT1385-2 | WLCSP9 | WLCSP9, wafer level chip-scale package; 9 bumps; 0.5 mm pitch, 1.49 mm x 1.49 mm x 0.555 mm body (backside coating included) | 2018-03-06 | |
SOT1390-1 | WLCSP12 | WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.36 mm x 1.66 mm x 0.51 mm body (backside coating included) | 2017-09-09 | |
SOT1390-10 | WLCSP12 | WLCSP12, wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.97 mm x 1.42 mm x 0.525 mm body | 2018-06-19 | |
SOT1390-12 | WLCSP12 | WLCSP12, wafer level chip-size package, 12 terminals, 0.4 mm pitch, 1.62 mm x 1.19 mm x 0.56 mm body | 2022-07-04 | |
SOT1390-5 | WLCSP12 | wafer level chip-scale package, 12 bumps | 2016-03-02 | |
SOT1390-6 | WLCSP12 | WLCSP12, wafer level chip-scale package; 12 bumps; 1.62 mm x 1.43 mm x 0.525 mm (backside coating included) | 2017-01-11 | |
SOT1390-7 | WLCSP12 | WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm (backside coating included) | 2017-04-24 | |
SOT1390-8 | WLCSP12 | WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.65 mm x 1.25 mm x 0.525 mm body (backside coating included) | 2017-10-23 | |
SOT1392-1 | WLCSP | wafer level chip-scale package; 15 bumps; 2.56 x 1.54 x 0.555 mm (Backside coating included) | 2015-08-11 | |
SOT1393-2 | WLCSP16 | WLCSP16, wafer level chip-scale package; 16 bumps; 1.84 mm x 1.84 mm x 0.5 mm body | 2018-02-09 | |
SOT1394-2 | WLCSP16 | wafer level chip-scale package; 16 bumps; 2.05 x 2.05 x 0.555 mm (Backside coating included) | 2016-08-29 | |
SOT1394-3 | WLCSP16 | WLCSP16, wafer level chip-scale package, 16 bumps, 2.20 mm x 2.20 mm x 0.555 mm body (backside coating included) | 2018-03-12 | |
SOT1397-10 | WLCSP20 | WLCSP20, wafer level chip-size package, 20 terminals, 0.4 mm pitch, 2.1 mm x 1.7 mm x 0.49 mm body (backside coating included) | 2022-07-07 | |
SOT1397-2 | WLCSP20 | WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.56 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1397-3 | WLCSP20 | WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 1.94 mm x 1.99 mm x 0.6 mm body | 2017-06-11 | |
SOT1397-4 | WLCSP20 | wafer level chip-scale package, 20 bumps | 2016-04-26 | |
SOT1397-5 | WLCSP20 | WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.32 mm body | 2017-06-11 | |
SOT1397-6 | WLCSP20 | WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included) | 2017-01-19 | |
SOT1397-7 | WLCSP25 | WLCSP25, wafer level chip-scale package; 25 bumps; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body | 2017-12-04 | |
SOT1397-8 | WLCSP20 | WLCSP20, wafer level chip-scale package; 20 bumps; 0.4 mm pitch, 2.50 mm x 1.84 mm x 0.5 mm body | 2018-05-24 | |
SOT1399-1 | WLCSP24 | WLCSP24, wafer level chip-scale package; 24 bumps; 2.98 mm x 1.90 mm x 0.525 mm body (backside coating included) | 2017-06-22 | |
SOT1401-1 | WLCSP25 | wafer level chip-scale package, 25 balls; 2.51 mm x 2.51 mm x 0.5 mm body | 2015-10-05 | |
SOT1401-2 | WLCSP25 | WLCSP25, wafer level chip-scale package, 25 bumps, 2.27 mm x 2.17 mm x 0.62 mm | 2017-05-12 | |
SOT1401-3 | WLCSP25 | WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included) | 2017-05-12 | |
SOT1401-4 | WLCSP25 | wafer level chip-scale package, 25 balls; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body | 2018-08-03 | |
SOT1403-1 | WLCSP34 | wafer level chip-scale package, 34 bumps, 0.4 mm pitch, 2.45 mm x 2.87 mm x 0.38 mm body | 2016-08-08 | |
SOT1404-2 | WLCSP36 | WLCSP36, wafer level chip-size package; 36 terminals; 0.35 mm pitch; 2.46 mm x 2.37 mm x 0.56 mm body | 2017-06-11 | |
SOT1404-3 | WLCSP36 | wafer level chip-scale package; 36 bumps; 2.07 mm x 2.07 mm x 0.42 mm body | 2016-04-26 | |
SOT1408-1 | SOT1408 | plastic, super thin quad flat package; no leads; 12 terminals; body 2.10 x 1.25 x 0.35 mm | MO-255(JEDEC | 2015-01-19 |
SOT141-6 | DBS13P | plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) | 2003-03-12 | |
SOT141-8 | DBS13P | plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) | 2003-03-12 | |
SOT1411-1 | WLCSP12 | WLCSP12, wafer level chip scape package, 12 terminals, 1.58 mm x 2.15 mm x 0.22 mm body | 2010-09-27 | |
SOT142-1 | SIL9MP | plastic single in-line medium power package; 9 leads | 2003-03-12 | |
SOT1425-1 | WLCSP9 | WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.22 mm body | 2013-07-16 | |
SOT1425-2 | WLCSP9 | WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.17 mm body | 2013-07-16 | |
SOT1426-1 | HUQFN32 | plastic thermal enhanced ultra thin quad flat package; no leads; 32 terminals; body 5 mm x 5 mm x 0.56 mm | 2014-08-07 | |
SOT1426-2 | HUQFN32 | HUQFN32, plastic, thermal enhanced ultra thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.58 mm body | 2017-06-11 | |
SOT1427-1 | LFBGA159 | plastic low profile fine-pitch ball grid array package; 159 balls | 2014-07-26 | |
SOT1428-1 | HVQFN | plastic thermal enhanced very thin quad flat package; no leads; 27 terminals; body 5 x 5 x 0.85 mm | 2014-10-14 | |
SOT1429-1 | HSOP6F | plastic, heatsink small outline package; 6 leads(flat) | 2014-10-30 | |
SOT1430-1 | X2QFN | plastic extremely thin small outline package; no leads; 10 terminals; body 1.6 x 1.3 x 0.33 mm | 2015-02-10 | |
SOT1431-1 | HVFLGA44 | Plastic, thermal enhanced very thin profile fine pitch land grid array package; 44 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body | 2016-08-12 | |
SOT1432-1 | TFBGA | plastic thin fine-pitch ball grid array package; 321 balls | 2014-11-17 | |
SOT1435-1 | HX2QFN | plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; body 2.0 x 2.0 x 0.3 mm | 2015-03-05 | |
SOT1436-1 | HX2SON | plastic, thermal enhanced super thin small outline package; no leads; 10 terminals; 0.35 mm pitch, 2.0 mm x 1.7 mm x 0.3 mm body | 2015-05-21 | |
SOT1437-1 | SO10 | plastic small outline package; 10 leads; body width 3.9 mm; body thickness 1.35 mm | 2015-03-06 | |
SOT1438-1 | HVSON | plastic thermal enhanced extremely thin quad flat package; no leads; 28 terminals; body 3.5 x 7.5 x 0.85 | 2015-07-31 | |
SOT1439-1 | VFBGA40 | plastic very thin fine-pitch ball grid array package; 40 balls | 2015-04-02 | |
SOT143B | SOT143B | plastic, surface-mounted package; 4 leads; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | 2006-03-16 | |
SOT143R | SOT143R | plastic surface-mounted package; reverse pinning; 4 leads | SC-61AA(EIAJ | 2006-03-16 |
SOT144-1 | PMFP8 | plastic micro flat package; 8 leads (straight) | 2003-03-12 | |
SOT1440-2 | WLCSP49 | WLCSP49, wafer level chip-size package; 49 terminals; 0.054 mm pitch; 3.14 mm x 2.92 mm x 0.56 mm body | 2017-06-11 | |
SOT1442-1 | DHXQFN | plastic dual in-line compatible thermal enhanced super-thin quad flat package; no leads; 18 terminals; body 2.4 x 2.0 x 0.35 mm | 2016-02-15 | |
SOT1443-2 | WLCSP | wafer level chip-scale package; 30 bumps; 2.26 x 2.56 x 0.51 mm (backside coating included) | 2015-06-11 | |
SOT1443-3 | WLCSP | wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating included) | 2016-04-26 | |
SOT1443-6 | WLCSP30 | wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.5 mm body (backside coating included) | 2019-04-26 | |
SOT1443-7 | WLCSP30 | wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.525 mm body (backside coating included) | 2019-04-16 | |
SOT1444-10 | WLCSP | WLCSP49, wafer level chip-scale package; 49 bumps; 2.97 mm x 3.37 mm x 0.56 mm (backside coating included) | 2017-01-06 | |
SOT1444-11 | WLCSP49 | WLCSP49, wafer level chip-scale package; 49 bumps; 3.3 mm x 3.3 mm x 0.525 mm body (Backside coating included) | 2018-08-22 | |
SOT1444-12 | WLCSP49 | WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 2.915 mm x 3.142 mm x 0.564 mm body | 2018-04-20 | |
SOT1444-13 | WLCSP49 | WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 3 mm x 2.9 mm x 0.525 mm body (backside coating included) | 2021-12-23 | |
SOT1444-3 | WLCSP | wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm | 2015-07-21 | |
SOT1444-4 | WLCSP | wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm (Backside coating included) | 2015-07-21 | |
SOT1444-5 | WLCSP49 | WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included) | 2016-04-26 | |
SOT1444-6 | WLCSP | wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm | 2016-04-26 | |
SOT1444-7 | WLCSP | wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.525 mm | 2016-04-26 | |
SOT1444-8 | WLCSP49 | wafer level chip-scale package; 49 bumps; 3.13 x 3.63 x 0.5 mm | 2016-08-09 | |
SOT1444-9 | WLCSP | wafer level chip-scale package; 49 bumps; 3.19 mm x 3.19 mm x 0.49 mm | 2016-04-26 | |
SOT1445-1 | WLCSP | wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm | 2016-07-11 | |
SOT1445-2 | WLCSP | wafer level chip-scale package; 6 bumps; 0.69 mm x 0.44 mm x 0.29 mm | 2016-12-06 | |
SOT1445-3 | WLCSP6 | WLCSP6, wafer level chip scale package, 6 terminals, 0.25 mm pitch, 0.7 mm x 0.45 mm x 0.23 mm body | 2018-08-23 | |
SOT1446-1 | HVQFN | plastic thermal enhanced very thin quad flat package; no leads; 184 terminals; body 12 x 12 x 0.85 mm | 2015-07-29 | |
SOT1447-1 | WLCSP99 | wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.5 mm | 2015-06-26 | |
SOT1447-2 | WLCSP | wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.525 mm (Backside coating included) | 2015-10-09 | |
SOT1448-1 | WLCSP29 | WLCSP29, wafer level chip-size package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm body | 2017-06-14 | |
SOT1448-2 | WLCSP | WLCSP29, wafer level chip-scale package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm (backside coating included) | 2017-01-11 | |
SOT1450-2 | WLCSP100 | WLCSP100, wafer level chip-scale package; 100 bumps; 5.07 mm x 5.07 mm x 0.53 mm body | 2018-03-06 | |
SOT1452-1 | WLCSP11 | wafer level chip-scale package, 11 bumps | 2016-03-02 | |
SOT1453-1 | WLCSP8 | wafer level chip-scale package, 8 bumps | 2016-03-02 | |
SOT1454-1 | WLCSP6 | wafer level chip-scale package, 6 bumps | 2016-03-02 | |
SOT1455-1 | WLCSP8 | WLCSP8, wafer level chip-scale package; 8 bumps, 0.28 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body | 2015-08-17 | |
SOT1456-1 | WFBGA155 | plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body | 2016-04-06 | |
SOT1456-2 | WFBGA155 | plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.62 mm body | 2020-06-18 | |
SOT1457-1 | LFBGA364 | plastic low profile fine-pitch ball grid array package, 364 balls, 0.65 mm pitch, 15 mm x 15 mm x 1.3 mm body | 2016-03-02 | |
SOT1458-1 | DHX2QFN | plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm | 2015-11-10 | |
SOT1459-1 | WLCSP42 | wafer level chip-scale package; 42 bumps; 2.88 mm x 2.80 mm x 0.54 mm (Backside coating included) | 2016-09-01 | |
SOT1459-2 | WLCSP | wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.5 mm (backside coating included) | 2016-04-26 | |
SOT1459-3 | WLCSP | wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.525 mm | 2016-04-26 | |
SOT1459-6 | WLCSP | WLCSP42, wafer level chip-scale package; 42 bumps; 2.91 mm x 2.51 mm x 0.525 mm body (backside coating included) | 2017-07-28 | |
SOT1459-7 | WLCSP42 | WLCSP42, wafer level chip scale package, 42 terminals, 0.4 mm pitch, 2.86 mm x 2.46 mm x 0.525 mm body (backside coating included) | 2020-05-13 | |
SOT1459-8 | WLCSP42 | WLCSP42, wafer level chip scale package, 42 terminals, 0.4 mm pitch, 3.02 mm x 2.72 mm x 0.525 mm body (backside coating included) | 2020-12-03 | |
SOT146-1 | DIP20 | plastic, dual in-line package; 20 leads; 2.54 mm pitch; 26.1 mm x 6.35 mm x 4.2 mm body | SC-603(EIAJ);MS-001(JEDEC | 2003-02-13 |
SOT146-4 | DIP20 | DIP20, plastic, dual in-line package; 20 terminals; 2.54 mm pitch; 7.28 mm x 24.69 mm x 5.08 mm body | E-PDIP-T20(JEDEC | 2017-06-11 |
SOT146-5 | DIP20 | DIP20, plastic, dual in-line package; 20 terminals; 2.54 mm pitch; 25.9 mm x 6.6 mm x 3.9 mm body | 2018-08-08 | |
SOT1461-1 | WLCSP | WLCSP13, wafer level chip-size package; 13 bumps, 0.4 mm pitch, 2.74 mm x 2.80 mm x 0.38 mm body | 2016-08-08 | |
SOT1461-2 | WLCSP | WLCSP13, wafer level chip-scale package; 13 bumps; 1.19 mm x 1.99 mm x 0.5 mm body | 2017-02-23 | |
SOT1462-1 | HQFN | plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm | 2015-10-12 | |
SOT1462-2 | HQFN | plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm | 2015-10-13 | |
SOT1462-3 | HQFN | plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm | 2015-10-13 | |
SOT1463-1 | WLCSP | wafer level chip-scale package, 46 bumps | 2016-03-02 | |
SOT1464-1 | WLCSP6 | WLCSP6, wafer level chip-scale package, 6 bumps, 0.19 mm pitch, 0.57 mm x 0.43 mm x 0.28 mm body | 2016-04-25 | |
SOT1465-1 | WLCSP31 | wafer level chip-scale package, 31 bumps | 2016-04-26 | |
SOT1465-2 | WLCSP31 | wafer level chip-scale package, 31 bumps | 2016-03-02 | |
SOT1496-1 | TFBGA | plastic thin fine-pitch ball grid array package; 144 balls | 2016-04-21 | |
SOT1510-1 | HLQFP64 | HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad | MS-026 BCD(JEDEC | 2018-08-07 |
SOT1510-2 | HLQFP64 | HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body | MS-026 BCD(JEDEC | 2018-06-29 |
SOT1510-3 | HLQFP64 | HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body | FL-PQFP-G64(JEDEC | 2017-06-11 |
SOT1510-4 | HLQFP64 | plastic, thermal enhanced low profile quad flat package; 64 leads; body 10 x 10 x 1.5 mm | 2016-07-12 | |
SOT1511-1 | HQFP64 | HQFP64, plastic, thermal enhanced quad flatpack; no leads; 64 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.7 mm body | PQFP-G64(JEDEC | 2017-06-11 |
SOT1512-1 | LFBGA400 | LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.12 mm body | PBGA-B400(JEDEC | 2017-06-11 |
SOT1512-2 | LFBGA400 | LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.18 mm body | 2016-02-01 | |
SOT1513-1 | BGA208 | BGA208, plastic, ball grid array package; 208 balls; 1 mm pitch; 17 mm x 17 mm x 1.15 mm body | MO-151 AAF-1(JEDEC | 2016-03-08 |
SOT1514-1 | LFBGA404 | LFBGA404, plastic, low profile fine-pitch ball grid array; 404 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.02 mm body | T-PBGA-B404(JEDEC | 2017-06-11 |
SOT1514-2 | LFBGA404 | LFBGA404, plastic, low profile fine-pitch ball grid array; 404 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.32 mm body | 2018-03-15 | |
SOT1515-1 | LFBGA289 | LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.6 mm body | PBGA-B289(JEDEC | 2017-06-11 |
SOT1516-1 | LFBGA292 | LFBGA292, plastic, low profile fine-pitch ball grid array; 292 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.7 mm body | PBGA-B289(JEDEC | 2017-06-11 |
SOT1517-1 | LFBGA364 | LFBGA364, plastic, low profile fine-pitch ball grid array; 364 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.33 mm body | MO-275 -MMAC-1(JEDEC | 2016-01-08 |
SOT1517-2 | LFBGA364 | LFBGA364, plastic, low profile fine-pitch ball grid array; 363 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body | 2017-06-11 | |
SOT1517-3 | LFBGA364 | LFBGA364, plastic, low profile fine-pitch ball grid array; 364 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.45 mm body | 2017-06-11 | |
SOT1518-1 | LFBGA252 | LFBGA252, plastic, low profile fine-pitch ball grid array; 252 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body | 2017-06-11 | |
SOT1519-1 | LFBGA356 | LFBGA356; plastic, low profile fine-pitch ball grid array; 356 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body | 2019-06-25 | |
SOT1520-1 | LFBGA292 | LFBGA292, plastic, low profile fine-pitch ball grid array; 292 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.46 mm body | 2017-06-11 | |
SOT1521-1 | BGA208 | BGA208, plastic, ball grid array; 208 balls; 1 mm pitch; 17 mm x 17 mm x 1.57 mm body | 2017-06-11 | |
SOT1522-1 | HTQFP128 | HTQFP128, plastic, thermal enhanced thin quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G128(JEDEC | 2017-06-11 |
SOT1523-1 | LFBGA473 | LFBGA473, plastic, low profile fine-pitch ball grid array; 473 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.12 mm body | PBGA-B473(JEDEC | 2017-06-11 |
SOT1523-2 | LFBGA473 | LFBGA473, plastic, low profile fine-pitch ball grid array; 473 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.18 mm body | 2017-06-11 | |
SOT1524-1 | FBGA484 | FBGA484, plastic, fine-pitch ball grid array; 484 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.62 mm body | 2017-06-11 | |
SOT1525-1 | LFBGA541 | LFBGA541, plastic, low profile fine-pitch ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body | 2017-06-11 | |
SOT1526-1 | LFBGA529 | LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.37 mm body | 2017-06-11 | |
SOT1526-2 | LFBGA529 | LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.12 mm body | 2017-06-11 | |
SOT1526-4 | LFBGA529 | LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.25 mm body | MO-275 PPAC-1(JEDEC | 2018-07-13 |
SOT1527-1 | BGA516 | BGA516, plastic, ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 1.83 mm body | R-PDSO-G8(JEDEC | 2017-06-11 |
SOT1527-2 | BGA516 | BGA516, plastic, ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body | MS-034 AAL-1(JEDEC | 2016-02-01 |
SOT1528-1 | BGA416 | BGA416, plastic, ball grid array; 416 bumps; 1.0 mm pitch; 27 mm x 27 mm x 2.02 mm body | 2017-03-27 | |
SOT1529-1 | LFBGA624 | LFBGA624, plastic, low profile fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.6 mm body | 2016-01-08 | |
SOT1530-1 | LFBGA369 | LFBGA369, plastic, low profile fine-pitch ball grid array; 369 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body | 2017-06-11 | |
SOT1531-1 | LFBGA489 | LFBGA489, plastic, low profile fine-pitch ball grid array; 489 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body | 2017-06-11 | |
SOT1533-1 | LFBGA121 | LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.38 mm body | 2016-01-07 | |
SOT1533-2 | LFBGA121 | LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.3 mm body | 2016-01-08 | |
SOT1534-1 | LFBGA289 | LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body | 2016-01-07 | |
SOT1534-2 | LFBGA289 | LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.18 mm body | 2017-06-11 | |
SOT1534-4 | LFBGA289 | LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body | 2019-09-20 | |
SOT1535-1 | LBGA144 | LBGA144; plastic, low profile ball grid array; 144 balls; 1.0 mm pitch; 13 mm x 13 mm x 1.7 mm body | 2016-01-06 | |
SOT1535-2 | LBGA144 | LBGA144, plastic, low profile ball grid array; 144 balls; 1 mm pitch; 13 mm x 13 mm x 1.46 mm body | PBGA-B144(JEDEC | 2017-06-11 |
SOT1536-1 | LFBGA280 | LFBGA280, plastic, low profile fine-pitch ball grid array; 280 balls; 0.65 mm pitch; 13 mm x 13 mm x 1.02 mm body | 2016-01-29 | |
SOT1537-1 | LFBGA289 | LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.65 mm pitch; 14 mm x 14 mm x 1.18 mm body | PBGA-B289(JEDEC | 2017-06-11 |
SOT1538-1 | LFBGA496 | LFBGA496, plastic, low profile fine-pitch ball grid array; 496 balls; 0.5 mm pitch; 15 mm x 15 mm x 1.34 mm body | PBGA-B496(JEDEC | 2017-06-11 |
SOT1539-1 | LFBGA457 | LFBGA457, plastic, low profile fine-pitch ball grid array; 457 balls; 0.5 mm pitch; 14 mm x 14 mm x 0.96 mm body | PBGA-B457(JEDEC | 2017-06-11 |
SOT1540-1 | TFBGA452 | TFBGA452, plastic, thin fine-pitch ball grid array; 452 balls; 0.4 mm pitch; 11 mm x 11 mm x 1.2 mm body | PBGA-B452(JEDEC | 2017-06-11 |
SOT1542-1 | LFBGA169 | LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.8 mm pitch; 11 mm x 11 mm x 1.02 mm body | 2017-06-11 | |
SOT1543-1 | BGA160 | BGA160, plastic, ball grid array; 160 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body | PBGA-B160(JEDEC | 2017-06-11 |
SOT1544-1 | LFBGA104 | LFBGA104, plastic, low profile fine-pitch ball grid array; 104 balls; 0.8 mm pitch; 10 mm x 10 mm x 1.1 mm body | PBGA-B104(JEDEC | 2017-06-11 |
SOT1545-1 | LFBGA527 | LFBGA527, plastic, low profile fine-pitch ball grid array; 527 balls; 0.5 mm pitch; 13 mm x 13 mm x 0.96 mm body | 2017-06-11 | |
SOT1546-1 | LFBGA196 | LFBGA196, plastic, low profile fine-pitch ball grid array; 196 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.52 mm body | 2017-06-11 | |
SOT1546-2 | LFBGA196 | LFBGA196, plastic, low profile fine-pitch ball grid array; 196 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.3 mm body | 2017-06-01 | |
SOT1547-1 | LFBGA257 | LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body | MO-275A -JJAC-1(JEDEC | 2016-01-05 |
SOT1547-2 | LFBGA257 | LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.45 mm body | MO-275A -JJAC-1(JEDEC | 2019-07-18 |
SOT1547-3 | LFBGA257 | LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body | 2019-06-20 | |
SOT1548-1 | LFBGA416 | LFBGA416, plastic, low profile fine-pitch ball grid array; 416 balls; 0.5 mm pitch; 13 mm x 13 mm x 1.52 mm body | 2017-06-11 | |
SOT1549-1 | HVQFN48R | HVQFN48R, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.98 mm body | 2017-06-11 | |
SOT1550-1 | VFBGA520S | VFBGA520S, plastic, very thin fine-pitch ball grid array; 520 balls; 0.4 mm pitch; 12 mm x 12 mm x 1 mm body | 2017-06-11 | |
SOT1551-1 | LFBGA206 | LFBGA206, plastic, low profile fine-pitch ball grid array; 206 balls; 0.8 mm pitch; 13 mm x 13 mm x 1.6 mm body | 2017-06-11 | |
SOT1552-1 | VFLGA60 | VFLGA60, plastic, very thin fine-pitch land grid array package; 60 balls; 0.5 mm pitch; 8 mm x 8 mm x 0.91 mm body | 2017-06-11 | |
SOT1553-1 | LFBGA206 | LFBGA206, plastic, low profile fine-pitch ball grid array; 206 balls; 0.5 mm pitch; 8 mm x 8 mm x 1.25 mm body | 2017-06-11 | |
SOT1554-1 | LFBGA130 | LFBGA130, plastic, low profile fine-pitch ball grid array; 130 balls; 0.5 mm pitch; 8 mm x 8 mm x 1.25 mm body | 2017-06-11 | |
SOT1555-1 | LFBGA64 | LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm body | 2016-01-08 | |
SOT1556-1 | TFBGA432 | TFBGA432, plastic, thin fine-pitch ball grid array; 432 balls; 0.5 mm pitch; 13 mm x 13 mm x 1.1 mm body | 2017-06-11 | |
SOT1557-1 | XFBGA121 | XFBGA121, plastic, extremely thin fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 0.43 mm body | 2016-01-12 | |
SOT1558-1 | XFBGA36 | XFBGA36, plastic, extremely thin fine-pitch ball grid array; 36 balls; 0.5 mm pitch; 3.5 mm x 3.5 mm x 0.43 mm body | 2017-06-11 | |
SOT1559-1 | LFBGA400 | LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.65 mm pitch; 14 mm x 14 mm x 1.165 mm body | 2017-06-11 | |
SOT1560-1 | LFBGA121 | LFBGA121, plastic, low profile fine-pitch ball grid array; 121 balls; 0.8 mm pitch; 10 mm x 10 mm x 1.02 mm body | T-PBGA-B121(JEDEC | 2017-06-11 |
SOT1561-1 | TFBGA185 | TFBGA185, plastic, thin fine-pitch ball grid array; 185 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.92 mm body | 2017-06-11 | |
SOT1562-1 | TFBGA247 | TFBGA247, plastic, thin fine-pitch ball grid array; 247 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.92 mm body | T-PBGA-B247(JEDEC | 2017-06-11 |
SOT1563-1 | LBGA81 | LBGA81, plastic, low profile ball grid array; 81 balls; 1 mm pitch; 10 mm x 10 mm x 1.52 mm body | PBGA-B81(JEDEC | 2017-06-11 |
SOT1564-1 | TFBGA139 | TFBGA139, plastic, thin fine-pitch ball grid array; 139 balls; 0.5 mm pitch; 7 mm x 7 mm x 0.92 mm body | MO-195-AD(JEDEC | 2017-06-11 |
SOT1565-1 | TFBGA338 | TFBGA338, plastic, thin fine-pitch ball grid array; 338 balls; 0.706 mm pitch; 11 mm x 11 mm x 0.92 mm body | 2017-06-11 | |
SOT1566-1 | LFBGA225 | LFBGA225, plastic, low profile fine-pitch ball grid array; 225 balls; 0.8 mm pitch; 13 mm x 13 mm x 1.6 mm body | PBGA-B225(JEDEC | 2017-06-11 |
SOT1567-1 | BGA196 | BGA196, plastic, ball grid array; 196 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body | PBGA-B196(JEDEC | 2017-06-11 |
SOT1569-1 | LBGA100 | LBGA100, plastic, low profile ball grid array; 100 balls; 1 mm pitch; 11 mm x 11 mm x 1.27 mm body | PBGA-B100(JEDEC | 2017-06-11 |
SOT157-2 | DBS9P | plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) | 2003-03-12 | |
SOT157-4 | DBS9P | plastic DIL-bent-SIL power package; 9 leads (lead length 7.7 mm) | 2003-03-12 | |
SOT1570-1 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body | 2016-01-08 | |
SOT1570-2 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body | 2017-03-27 | |
SOT1570-3 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2018-03-02 | |
SOT1570-5 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2021-12-14 | |
SOT1570-6 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2023-09-07 | |
SOT1571-1 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026-BBC(JEDEC | 2017-12-14 |
SOT1571-2 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2017-06-11 |
SOT1571-3 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2017-06-11 |
SOT1571-4 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | 2017-06-11 | |
SOT1571-5 | HLQFP48 | plastic, thermal enhanced low profile quad flat package; 48 leads; body 7 x 7 x 1.5 mm | 2016-07-14 | |
SOT1571-6 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.5 mm body; 4.4 mm x 4.4 mm exposed pad | 2022-03-30 | |
SOT1571-7 | HLQFP48 | plastic, thermal enhanced low profile quad flat package; 48 leads; 0.5 mm pitch, 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2017-08-28 |
SOT1571-8 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2018-03-01 |
SOT1572-1 | HLQFP80 | HLQFP80, plastic, thermal enhanced, low profile quad; flat leaded package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1.4 mm body | 2017-03-27 | |
SOT1573-1 | HQFN16 | HQFN16, plastic, thermal enhanced quad flat package; no leads; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.98 mm body | 2020-06-19 | |
SOT1573-2(SC) | HQFN16 | HQFN16, thermal enhanced quad flat package, no leads, 16 terminals, step-cut wettable flank, 0.8 mm pitch, 4 mm x 4 mm x 1.98 mm body | 2021-02-05 | |
SOT1574-1 | HQFN16 | plastic, thermally enhanced quad flat non-leaded package; 16 terminals; 1.0 mm pitch; 6 mm x 6 mm x 1.98 mm body | 2016-01-06 | |
SOT1574-2 | HQFN16 | HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 1 mm pitch; 6 mm x 6 mm x 1.98 mm body | H-PQFP-N16(JEDEC | 2017-06-11 |
SOT1574-3 | HQFN16 | plastic, thermally enhanced quad flat non-leaded package; 16 terminals; 1.0 mm pitch; 6 mm x 6 mm x 1.98 mm body | 2017-07-26 | |
SOT1575-1 | HQFN24 | plastic thermally enhanced quad flat non-leaded package; 24 terminals; 1.0 mm pitch; 7 mm x 7 mm x 2.2 mm body | 2016-01-08 | |
SOT1576-1 | HQFN32 | HQFN32, plastic, thermally enhanced quad; flat non-leaded package; 32 terminals; 0.65 mm pitch; 9 mm x 9 mm x 2.5 mm body | 2017-03-22 | |
SOT1577-1 | HSOP30 | HSOP30, plastic, thermal enhanced small outline package; 30 terminals; 0.8 mm pitch; 11 mm x 15.9 mm x 3 mm body | PDSO-G30(JEDEC | 2017-06-11 |
SOT1578-1 | HSOP36 | HSOP36, plastic, thermal enhanced small outline package; 36 terminals; 0.65 mm pitch; 11 mm x 15.9 mm x 3.6 mm body | HS-PDSO-G36(JEDEC | 2017-06-11 |
SOT1579-1 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | H-PQFP-N32(JEDEC | 2017-06-11 |
SOT158-1 | VSO40 | plastic very small outline package; 40 leads | 2003-02-19 | |
SOT158-2 | VSO40 | plastic very small outline package; 40 leads; face down | 2003-02-19 | |
SOT1580-1 | HTQFP216 | HTQFP216, plastic, thermal enhanced thin quad flat package; 216 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1 mm body | 2017-06-11 | |
SOT1581-1 | HUQFN16 | HUQFN16, plastic, thermal enhanced ultra thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.65 mm body | NON-JEDAC(JEDEC | 2017-06-11 |
SOT1581-2 | HUQFN16 | HUQFN16, plastic, thermal enhanced ultra thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.65 mm body | 2017-06-11 | |
SOT1581-3 | HUQFN16 | HUQFN16, plastic, thermal enhanced ultra thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.58 mm body | 2017-06-11 | |
SOT1582-1 | HUQFN20 | HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.65 mm body | 2017-06-11 | |
SOT1582-2 | HUQFN20 | HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.58 mm body | 2017-06-11 | |
SOT1583-1 | HUQFN20 | HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.5 mm pitch; 4 mm x 3 mm x 0.65 mm body | 2017-06-11 | |
SOT1583-2 | HUQFN20 | HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.5 mm pitch; 4 mm x 3 mm x 0.65 mm body | 2018-07-16 | |
SOT1585-1 | HUQFN24 | HUQFN24, plastic, thermally enhanced; ultra thin quad; flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.65 mm body | 2017-03-27 | |
SOT1585-2 | HUQFN24 | HUQFN24, plastic, thermal enhanced ultra thin quad flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.65 mm body | 2018-07-12 | |
SOT1586-1 | HUQFN48 | HUQFN48, plastic, thermal enhanced ultra thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.58 mm body | 2017-06-11 | |
SOT1587-1 | HUSON12 | HUSON12, plastic, thermal enhanced ultra thin small outline; no leads; 12 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body | HF-PDSO-N12(JEDEC | 2017-06-11 |
SOT1588-1 | HUSON6 | HUSON6, plastic, thermal enhanced ultra thin small outline; no leads; 6 terminals; 0.5 mm pitch; 2 mm x 1.5 mm x 0.6 mm body | NON JEDEC(JEDEC | 2017-06-11 |
SOT1589-1 | HUSON8 | HUSON8, plastic, thermal enhanced ultra thin small outline; no leads; 8 terminals; 0.5 mm pitch; 2 mm x 2 mm x 0.6 mm body | NON JEDEC(JEDEC | 2017-06-11 |
SOT1590-1 | HUSON8 | HUSON8, plastic, thermal enhanced ultra thin small outline; no leads; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.65 mm body | HF-PDSO-N(JEDEC | 2017-06-11 |
SOT1590-2 | HUSON8 | HUSON8, plastic, thermal enhanced ultra thin small outline; no leads; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.65 mm body | 2017-08-29 | |
SOT1591-1 | HVQFN16 | HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1 mm body | H-PQFP-N16(JEDEC | 2017-06-11 |
SOT1591-3 | HVQFN16 | HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.85 mm body | 2018-08-01 | |
SOT1592-1 | HVQFN16 | HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.65 mm pitch; 4 mm x 4 mm x 0.9 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1593-1 | HVQFN16 | HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 5 mm x 5 mm x 0.9 mm body | 2017-06-11 | |
SOT1594-1 | HVQFN24 | HVQFN24, plastic, thermal enhanced very thin quad flat package; no leads; 24 terminals; 0.65 mm pitch; 5 mm x 5 mm x 0.9 mm body | 2016-01-12 | |
SOT1595-1 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.9 mm body | 2017-06-11 | |
SOT1595-2 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body | 2017-06-11 | |
SOT1596-1 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.9 mm body | 2017-06-11 | |
SOT1596-2 | HVQFN32 | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 4 x 4 x 0.85 mm | 2016-03-04 | |
SOT1597-1 | LFBGA169 | LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.65 mm pitch; 9 mm x 9 mm x 1.15 mm body | 2017-06-11 | |
SOT1597-2 | LFBGA169 | LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.65 mm pitch; 9 mm x 9 mm x 1.11 mm body | 2017-06-11 | |
SOT1598-1 | LFBGA272 | LFBGA272, plastic, low profile fine-pitch ball grid array; 272 balls; 0.5 mm pitch; 9 mm x 9 mm x 1.11 mm body | 2017-06-11 | |
SOT1599-1 | USON8 | USON8, plastic, ultra thin small outline package; no leads; 8 terminals; 0.5 mm pitch; 2 mm x 2 mm x 0.65 mm body | MO-252(JEDEC | 2017-06-11 |
SOT1600-1 | HVSON8 | HVSON8, plastic, thermal enhanced very thin small outline; no leads; 8 terminals; 0.65 mm pitch; 3 mm x 3 mm x 0.9 mm body | 2017-06-11 | |
SOT1601-1 | CBGA1023 | CBGA1023, ceramic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.77 mm body | CBGA-B1023(JEDEC | 2017-06-11 |
SOT1601-2 | CBGA1023 | CBGA1023, ceramic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.97 mm body | CBGA-B1023(JEDEC | 2017-06-11 |
SOT1602-1 | CBGA255 | CBGA255, ceramic, ball grid array; 255 balls; 1.27 mm pitch; 21 mm x 21 mm x 3 mm body | CBGA-B255(JEDEC | 2017-06-11 |
SOT1603-1 | CBGA360 | CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 3.2 mm body | CBGA-B360(JEDEC | 2017-06-11 |
SOT1603-2 | CBGA360 | CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body | CBGA-B360(JEDEC | 2017-06-11 |
SOT1603-3 | CBGA360 | CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.4 mm body | CBGA-B360(JEDEC | 2017-06-11 |
SOT1603-4 | CBGA360 | CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body | CBGA-B360(JEDEC | 2017-06-11 |
SOT1603-5 | CBGA360 | CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body | CBGA-B360(JEDEC | 2017-06-11 |
SOT1603-6 | CBGA360 | CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 3.2 mm body | CBGA-B360(JEDEC | 2017-06-11 |
SOT1604-1 | CBGA483 | CBGA483, ceramic, ball grid array; 483 balls; 1.27 mm pitch; 29 mm x 29 mm x 3.2 mm body | E-CBGA-B483(JEDEC | 2017-06-11 |
SOT1605-1 | CBGA783 | CBGA783, ceramic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.38 mm body | PBGA-B783(JEDEC | 2017-06-11 |
SOT1608-1 | CFBGA483 | CFBGA483, ceramic, fine-pitch ball grid array; 483 balls; 1.27 mm pitch; 29 mm x 29 mm x 3.1 mm body | E-CBGA-B483(JEDEC | 2017-06-11 |
SOT1609-1 | CFBGA994 | CFBGA994, ceramic, fine-pitch ball grid array; 994 balls; 1 mm pitch; 33 mm x 33 mm x 2.77 mm body | CBGA-B994(JEDEC | 2017-06-11 |
SOT1609-2 | CFBGA994 | CFBGA994, ceramic, fine-pitch ball grid array; 994 balls; 1 mm pitch; 33 mm x 33 mm x 2.97 mm body | CBGA-B994(JEDEC | 2017-06-11 |
SOT1610-1 | CLGA360 | CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.2 mm body | CBGA-N360(JEDEC | 2017-06-11 |
SOT1610-2 | CLGA360 | CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.2 mm body | CBGA-N360(JEDEC | 2017-06-11 |
SOT1610-3 | CLGA360 | CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 1.8 mm body | CBGA-N360(JEDEC | 2017-06-11 |
SOT1611-1 | CLGA483 | CLGA483, ceramic, land grid array; 483 lands; 1.27 mm pitch; 29 mm x 29 mm x 2.2 mm body | 2017-06-11 | |
SOT1612-1 | CQFP144 | CQFP144, ceramic, quad flat package; 144 terminals; 0.65 mm pitch; 26.75 mm x 26.75 mm x 3.5 mm body | CQFP-G144(JEDEC | 2017-06-11 |
SOT1613-1 | CQFP184 | CQFP184, ceramic, quad flat package; 184 terminals; 0.65 mm pitch; 31 mm x 31 mm x 3.5 mm body | CQFP-G184(JEDEC | 2017-06-11 |
SOT1615-1 | VSON10 | VSON10, plastic, very thin small outline, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.85 mm body | 2017-06-11 | |
SOT1615-2 | VSON10 | VSON10, plastic, very thin small outline, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.95 mm body | 2017-06-11 | |
SOT1615-3 | VSON10 | VSON10, plastic, very thin small outline package, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.95 mm body | 2017-06-11 | |
SOT1616-1 | VSON10 | VSON10, plastic, very thin small outline package, no leads; 10 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.5 mm body | NJR(JEDEC | 2017-06-11 |
SOT1617-1 | BGA1020 | BGA1020, plastic, ball grid array; 1020 balls; 1 mm pitch; 33 mm x 33 mm x 2.78 mm body | 2017-06-11 | |
SOT1618-1 | BGA1023 | BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.75 mm body | PBGA-B1023(JEDEC | 2017-06-11 |
SOT1619-1 | BGA1023 | BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 3.38 mm body | NONE(JEDEC | 2017-06-11 |
SOT162-1 | SO16 | plastic, small outline package; 16 leads; 1.27 mm pitch; 10.2 mm x 7.5 mm x 2.65 mm body | MS-013(JEDEC);075E03(IEC | 2003-02-19 |
SOT162-3 | SO16 | SO16, plastic, small outline package; 16 terminals; 1.27 mm pitch; 7.5 mm x 10.3 mm x 2.4 mm body | E-PDSO-G16(JEDEC | 2017-06-11 |
SOT1620-1 | BGA1023 | BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 3.13 mm body | 2017-06-11 | |
SOT1621-1 | BGA575 | BGA575, plastic, ball grid array; 575 balls; 1 mm pitch; 25 mm x 25 mm x 2.75 mm body | PBGA-B575(JEDEC | 2017-06-11 |
SOT1622-1 | BGA783 | BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.75 mm body | 2015-12-17 | |
SOT1622-2 | BGA783 | BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.7 mm body | PBGA-B783(JEDEC | 2017-06-11 |
SOT1622-3 | BGA783 | BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.76 mm body | MS-034B AAM-1(JEDEC | 2015-12-22 |
SOT1622-4 | BGA783 | BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.8 mm body | 2016-01-04 | |
SOT1623-5 | BGA783 | BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.85 mm body | PBGA-B783(JEDEC | 2017-06-11 |
SOT1624-1 | BGA783 | BGA783, plastic, ball grid array; 783 bumps; 1.0 mm pitch; 29 mm x 29 mm x 3.58 mm body | 2017-03-22 | |
SOT1625-2 | BGA783 | plastic, ball grid array; 783 bumps; 1.0 mm pitch; 29 mm x 29 mm x 3.13 mm body | 2016-01-11 | |
SOT1626-1 | FBGA431 | FBGA431, plastic, fine-pitch ball grid array; 431 balls; 0.8 mm pitch; 20 mm x 20 mm x 3.3 mm body | PBGA-B431(JEDEC | 2017-06-11 |
SOT1627-1 | HBGA620 | HBGA620, plastic, thermal enhanced ball grid array; 620 balls; 1 mm pitch; 29 mm x 29 mm x 2.46 mm body | MS-034 AAM-1(JEDEC | 2016-02-01 |
SOT1628-1 | HUQFN20 | HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body | 2017-06-11 | |
SOT1629-1 | BGA1295 | plastic, ball grid array; 1295 bumps; 1.0 mm pitch; 37.5 mm x 37.5 mm x 3.19 mm body | MS-034(JEDEC | 2015-12-24 |
SOT163-1 | SO20 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | MS-013(JEDEC);075E04(IEC | 2003-02-19 |
SOT163-4 | SO20 | SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 12.82 mm x 3.55 mm body | R-PDSO-G20(JEDEC | 2017-06-11 |
SOT163-5 | SO20 | SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 12.8 mm x 2.5 mm body | MS-013AC(JEDEC | 2016-04-01 |
SOT1630-1 | HQFN16 | HQFN16, plastic, thermal enhanced quad flat package, no leads; 16 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body | I-PQFP-N16(JEDEC | 2017-06-11 |
SOT1630-2 | HQFN16 | HQFN16, plastic, thermal enhanced quad flat package, no leads; 16 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body | 2018-05-22 | |
SOT1631-2 | HQFN24 | HQFN24, plastic, thermal enhanced quad flatpack; no leads; 24 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body | I-PQFP-N24(JEDEC | 2017-06-11 |
SOT1631-3 | HQFN24 | HQFN24, plastic, thermal enhanced quad flatpack; no leads; 24 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body | 2016-01-08 | |
SOT1631-4 | HQFN23 | HQFN23; plastic, thermally enhanced quad; flat non-leaded package; 23 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body | 2016-01-21 | |
SOT1631-5 | HQFN23 | HQFN23, plastic, thermal enhanced quad flatpack; no leads; 23 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body | NA(JEDEC | 2017-06-11 |
SOT1631-6 | HQFN16 | HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body | I-PQFP-N16(JEDEC | 2017-06-11 |
SOT1631-7 | HQFN24 | HQFN24, plastic, thermal enhanced quad flatpack; no leads; terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body | I-PQFP-N24(JEDEC | 2016-03-14 |
SOT1631-8 | HQFN24 | HQFN24, plastic, thermal enhanced quad flatpack; no leads; terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body | 2016-03-14 | |
SOT1632-1 | HQFN16 | HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 5 mm x 5 mm x 2.1 mm body | PQFP-N16(JEDEC | 2017-06-11 |
SOT1633-1 | HQFN32 | HQFN32, plastic, thermal enhanced quad flatpack; no leads; 32 terminals; 0.8 mm pitch; 8 mm x 8 mm x 2.1 mm body | PQFP-N32(JEDEC | 2017-06-11 |
SOT1634-1 | BGA456 | BGA456, plastic, ball grid array; 456 balls; 1.27 mm pitch; 35 mm x 35 mm x 2.59 mm body | PBGA-B456(JEDEC | 2017-06-11 |
SOT1635-1 | PGA241 | PGA241, plastic, pin grid array; 241 pins; 2.54 mm pitch; 47.2 mm x 47.2 mm x 3.18 mm body | PPGA-P241(JEDEC | 2017-06-11 |
SOT1636-1 | BGA360 | BGA360, plastic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.77 mm body | E-PBGA-B360(JEDEC | 2017-06-11 |
SOT1637-1 | BGA255 | BGA255, plastic, ball grid array; 255 balls; 1.27 mm pitch; 21 mm x 21 mm x 2.8 mm body | E-PBGA-B255(JEDEC | 2017-06-11 |
SOT1638-1 | HVQFN44R | HVQFN44R, plastic, thermal enhanced very thin quad flat package; no leads; 44 terminals; 0.65 mm pitch; 5 mm x 5 mm x 0.98 mm body | 2017-06-11 | |
SOT1639-1 | FBGA780 | FBGA780, plastic, fine-pitch ball grid array; 780 balls; 0.8 mm pitch; 23 mm x 23 mm x 2.36 mm body | MS-034(JEDEC | 2017-06-11 |
SOT1640-1 | VFBGA416S | VFBGA416S, plastic, very thin fine-pitch ball grid array; 416 balls; 0.5 mm pitch; 13 mm x 13 mm x 0.9 mm body | 2017-06-11 | |
SOT1641-1 | FBGA520 | FBGA520, plastic, fine-pitch ball grid array; 520 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.83 mm body | 2017-03-27 | |
SOT1642-1 | LFBGA624 | LFBGA624, plastic, low profile fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.45 mm body | 2017-03-27 | |
SOT1642-2 | LFBGA624 | LFBGA624, plastic, low profile fine-pitch ball grid array; 624 balls; 0.8 mm pitch; 21 mm x 21 mm x 1.45 mm body | 2017-06-11 | |
SOT1643-1 | FBGA624 | FBGA624; plastic, fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 2 mm body | 2016-01-07 | |
SOT1644-1 | LFBGA569S | LFBGA569S, plastic, low profile fine-pitch ball grid array; 569 balls; 0.4 mm pitch; 12 mm x 12 mm x 1.15 mm body | 2017-06-11 | |
SOT1645-1 | BGA1932 | BGA1932, plastic, ball grid array; 1932 balls; 1 mm pitch; 45 mm x 45 mm x 3.18 mm body | 2017-06-11 | |
SOT1646-1 | VQFN40R | VQFN40R, plastic, very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.98 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1647-1 | HVQFN63R | HVQFN63R, plastic, thermal enhanced very thin quad flatpack; no leads; 63 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.91 mm body | 2017-06-11 | |
SOT1648-1 | VQFN41R | VQFN41R, plastic, very thin quad flatpack; no leads; 41 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.91 mm body | 2017-06-11 | |
SOT1648-2 | VQFN41R | VQFN41R, plastic, very thin quad flatpack; no leads; 41 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.91 mm body | 2017-06-11 | |
SOT1649-1 | VFLGA64 | VFLGA64, plastic, very thin fine-pitch land grid array package; 64 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.91 mm body | 2019-05-31 | |
SOT1650-1 | BGA1152 | BGA1152, plastic, ball grid array; 1152 balls; 1 mm pitch; 35 mm x 35 mm x 2.67 mm body | 2017-06-11 | |
SOT1651-1 | BGA780 | BGA780, plastic, ball grid array; 780 balls; 1 mm pitch; 29 mm x 29 mm x 2.68 mm body | 2017-06-11 | |
SOT1652-1 | FBGA780 | FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body | 2016-01-11 | |
SOT1652-2 | FBGA780 | FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body | 2016-01-14 | |
SOT1652-3 | FBGA780 | FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body | 2016-01-27 | |
SOT1652-4 | FBGA780 | FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body | 2017-03-21 | |
SOT1653-1 | FBGA780 | FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 2.46 mm body | 2016-01-14 | |
SOT1653-2 | FBGA780 | FBGA780, fine-pitch ball grid array package, 780 terminals, 0.8 mm pitch, 23 mm x 23 mm x 2.46 mm body | 2019-02-26 | |
SOT1654-1 | BGA416 | BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 2.23 mm body | MS-034 AAL-1(JEDEC | 2017-06-11 |
SOT1655-1 | FBGA525 | FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.62 mm body | 2017-03-27 | |
SOT1655-2 | FBGA525 | FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.92 mm body | 2017-03-27 | |
SOT1655-3 | FBGA525 | FBGA525, plastic, fine-pitch ball grid array package; 525 terminals; 0.8 mm pitch; 19 mm x 19 mm x 1.97 mm body | 2023-05-20 | |
SOT1655-5 | FBGA525 | FBGA525, plastic, fine-pitch ball grid array package; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.97 mm body | 2022-09-13 | |
SOT1656-1 | BGA1292 | BGA1292, plastic, ball grid array; 1292 balls; 1 mm pitch; 37.5 mm x 37.5 mm x 3.17 mm body | 2017-06-11 | |
SOT1656-2 | BGA1292 | BGA1292, plastic, ball grid array; 1292 balls; 1 mm pitch; 37.5 mm x 37.5 mm x 3.17 mm body | 2019-04-11 | |
SOT1657-1 | FBGA896 | FBGA896, plastic, fine-pitch ball grid array; 896 balls; 0.8 mm pitch; 25 mm x 25 mm x 2.46 mm body | 2017-06-11 | |
SOT1658-1 | FBGA625 | FBGA625, plastic, fine-pitch ball grid array; 625 balls; 0.8 mm pitch; 21 mm x 21 mm x 2.35 mm body | MS-026-BBC(JEDEC | 2017-06-11 |
SOT1659-1 | HBGA448 | HBGA448, plastic, thermal enhanced ball grid array; 448 balls; 1 mm pitch; 23 mm x 23 mm x 1.93 mm body | 2017-06-11 | |
SOT1660-1 | HLQFP156 | HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1660-2 | HLQFP156 | HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body | 2018-10-26 | |
SOT1661-1 | FBGA621 | FBGA621, plastic, fine-pitch ball grid array; 621 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.92 mm body | 2016-01-13 | |
SOT1662-1 | BGA495 | BGA495, plastic, ball grid array; 495 balls; 1 mm pitch; 25 mm x 25 mm x 2.5 mm body | 2017-06-11 | |
SOT1663-1 | HQFN32 | HQFN32, plastic, thermal enhanced quad flatpack; no leads; 32 terminals; 0.8 mm pitch; 9 mm x 9 mm x 2.1 mm body | H-PQFP-N36(JEDEC | 2017-06-11 |
SOT1664-1 | HQFN24 | HQFN24, plastic, thermal enhanced quad flatpack; no leads; 24 terminals; 0.8 mm pitch; 8 mm x 8 mm x 2.1 mm body | HF-PQFN(JEDEC | 2017-06-11 |
SOT1665-1 | HBGA516 | HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body | PBGA-B516(JEDEC | 2017-06-11 |
SOT1666-1 | BGA357 | BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm body | PBGA-B357(JEDEC | 2017-06-11 |
SOT1667-1 | BGA256 | BGA256, plastic, ball grid array; 256 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.54 mm body | PBGA-B256(JEDEC | 2017-06-11 |
SOT1668-1 | SO16 | SO16, plastic, small outline package; 16 terminals; 0.8 mm pitch; 7.03 mm x 7.03 mm x 2.3 mm body | PDSO-G16(JEDEC | 2017-06-11 |
SOT1669-1 | PGA179 | PGA179, plastic, pin grid array; 179 pins; 2.54 mm pitch; 47.2 mm x 47.2 mm x 3.18 mm body | PPGA-P179(JEDEC | 2017-06-11 |
SOT1670-1 | PGA182 | PGA182, plastic, pin grid array; 182 pins; 2.54 mm pitch; 46.7 mm x 46.7 mm x 3.18 mm body | PPGA-P182(JEDEC | 2017-06-11 |
SOT1671-1 | LQFP52 | LQFP52, plastic, low profile quad flat package; 52 terminals; 0.65 mm pitch; 10 mm x 10 mm x 1.4 mm body | L-PQFP-G52(JEDEC | 2017-06-11 |
SOT1671-2 | LQFP52 | LQFP52, plastic, low profile quad flat package; 52 terminals; 0.65 mm pitch; 10 mm x 10 mm x 1.4 mm body | 2017-06-11 | |
SOT1672-1 | LQFP112 | LQFP112, plastic, low profile quad flat package; 112 terminals; 0.65 mm pitch; 20 mm x 20 mm x 1.4 mm body | L-PQFP-G112(JEDEC | 2017-06-11 |
SOT1673-1 | SNSR | SNSR M-PAK 05 Package PORTED | R-PDSO-G5(JEDEC | 2017-06-11 |
SOT1674-1 | SNSR | SNSR M-PAK 05 Package | 2017-06-11 | |
SOT1675-1 | UQFN20 | UQFN20, plastic, ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body | 2017-06-11 | |
SOT1676-1 | VQFN16 | VQFN16, plastic, very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1 mm body | 2016-01-05 | |
SOT1677-1 | HVQFN12 | HVQFN12, plastic, thermal enhanced very thin quad flatpack; no leads; 12 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.85 mm body | 2017-06-11 | |
SOT1678-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 9.6 mm x 9.6 mm x 0.81 mm body | 2017-06-11 | |
SOT1679-1 | VQFN12 | VQFN12, plastic, very thin quad flatpack; no leads; 12 terminals; 0.65 mm pitch; 3 mm x 3 mm x 1 mm body | 2017-06-11 | |
SOT1679-2 | VQFN12 | VQFN12, plastic, very thin quad flatpack; no leads; 12 terminals; 0.65 mm pitch; 3 mm x 3 mm x 1 mm body | 2017-06-11 | |
SOT1680-1 | TQFN16 | TQFN16, plastic, thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1.2 mm body | 2017-06-11 | |
SOT1681-1 | VQFN24 | VQFN24, plastic, very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 1 mm body | 2017-06-11 | |
SOT1682-1 | HQFN42 | HQFN42, plastic, thermal enhanced quad flat package, no leads; 42 terminals; 0.65 mm pitch; 9 mm x 13.6 mm x 2.65 mm body | 2017-06-11 | |
SOT1683-1 | VFBGA85 | VFBGA85, plastic, very thin fine-pitch ball grid array; 85 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body | 2017-06-11 | |
SOT1684-1 | VFBGA89 | VFBGA89, plastic, very thin fine-pitch ball grid array; 89 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1685-1 | VFBGA90 | VFBGA90, plastic, very thin fine-pitch ball grid array; 90 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body | MO-275 AACE-2(JEDEC | 2017-06-11 |
SOT1687-1 | VFBGA256 | VFBGA256, plastic, very thin fine-pitch ball grid array; 256 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.795 mm body | 2017-06-11 | |
SOT1688-1(DD) | HLQFN16 | HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package, dimple wettable flank; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.45 mm body | 2019-09-11 | |
SOT1688-1(SC) | HLQFN16 | HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.45 mm body | 2019-09-11 | |
SOT1688-2(SC) | HLQFN16 | HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.37 mm body | 2019-05-09 | |
SOT1688-3(DD) | HLQFN16 | HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package, dimple wettable flank; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.45 mm body | 2021-10-01 | |
SOT1690-2 | TFBGA500S | TFBGA500S, thin fine-pitch ball grid array package; 500 terminals, 0.65 mm pitch, 14 mm x 17 mm x 0.925 mm body | 2017-02-28 | |
SOT1691-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 1.07 mm x 1.07 mm x 1.99 mm body | PDIP-P8(JEDEC | 2017-06-11 |
SOT1691-2 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 1.07 mm x 1.07 mm x 1.99 mm body | PDIP-P8(JEDEC | 2017-06-11 |
SOT1692-1 | SO20 | SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 13.85 mm x 4.25 mm body | E-PDSO-G20(JEDEC | 2017-06-11 |
SOT1692-2 | SO20 | SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 12.85 mm x 4.25 mm body | 2017-06-11 | |
SOT1693-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 7.62 mm body | E-PDSO-G8(JEDEC | 2017-06-11 |
SOT1693-2 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 9.62 mm body | E-PDSO-G8(JEDEC | 2017-06-11 |
SOT1693-3 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 8.38 mm body | E-PDSO-G8(JEDEC | 2017-06-11 |
SOT1694-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.66 mm x 10.66 mm x 5.84 mm body | E-PDSO-G8(JEDEC | 2017-06-11 |
SOT1695-1 | QFP132 | QFP132, plastic, quad flat package; 132 terminals; 0.635 mm pitch; 24.1 mm x 24.1 mm x 3.56 mm body | PQFP-G132(JEDEC | 2017-06-11 |
SOT1696-1 | QFP208 | QFP208, plastic, quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 4.1 mm body | F-PQFP-G208(JEDEC | 2017-06-11 |
SOT1697-1 | QFP64 | QFP64, plastic, quad flat package; 64 terminals; 0.8 mm pitch; 14 mm x 14 mm x 2.2 mm body | PQFP-G64(JEDEC | 2016-01-19 |
SOT1697-2 | QFP64 | QFP64, plastic, quad flat package; 64 terminals; 0.8 mm pitch; 14 mm x 14 mm x 2.2 mm body | PQFP-G64(JEDEC | 2017-06-11 |
SOT1698-1 | QFP160S | QFP160S, plastic, quad flat package; 160 terminals; 0.65 mm pitch; 45.3 mm x 45.3 mm x 4.8 mm body | PQFP-G160(JEDEC | 2016-01-19 |
SOT1699-1 | LQFP64 | LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body | MS-026 BCD(JEDEC | 2016-01-25 |
SOT1701-1 | QFP240 | QFP240, plastic, quad flat package; 240 terminals; 0.5 mm pitch; 32 mm x 32 mm x 3.4 mm body | F-PQFP-G240(JEDEC | 2017-06-11 |
SOT1703-1 | QFP132S | QFP132S, plastic, quad flat package; 132 terminals; 0.65 mm pitch; 45.7 mm x 45.7 mm x 4.9 mm body | PQFP-G132(JEDEC | 2017-06-11 |
SOT1704-1 | PGA132 | PGA132, plastic, pin grid array; 132 pins; 2.54 mm pitch; 34.8 mm x 34.8 mm x 3.18 mm body | PPGA-P132(JEDEC | 2017-06-11 |
SOT1705-1 | BGA416 | BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body | PBGA-B416(JEDEC | 2016-01-29 |
SOT1706-1 | LBGA672 | LBGA672, plastic, low profile ball grid array; 672 balls; 1 mm pitch; 35 mm x 35 mm x 0.95 mm body | 2016-02-24 | |
SOT1707-1 | LBGA740 | LBGA740, plastic, low profile ball grid array; 740 balls; 1 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body | 2016-02-01 | |
SOT1708-1 | BGA360 | BGA360, plastic, ball grid array; 360 balls; 1 mm pitch; 23 mm x 23 mm x 1.9 mm body | 2017-06-11 | |
SOT1709-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 7.36 mm x 7.36 mm x 4.19 mm body | 2016-02-01 | |
SOT1710-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 8.26 mm x 8.26 mm x 4.8 mm body | R-PDSO-G8(JEDEC | 2017-06-11 |
SOT1711-1 | BGA255 | BGA255, plastic, ball grid array; 255 balls; 1.27 mm pitch; 23 mm x 23 mm x 1.9 mm body | PBGA-B255(JEDEC | 2017-06-11 |
SOT1712-1 | BGA388 | BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body | MS-034 AAL-1(JEDEC | 2016-03-04 |
SOT1713-1 | BGA672 | BGA672, plastic, ball grid array; 672 balls; 0.5 mm pitch; 27 mm x 27 mm x 1.73 mm body | 2017-06-11 | |
SOT1714-1 | FBGA425 | plastic, fine-pitch ball grid array; 425 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.7 mm body | 2016-01-07 | |
SOT1715-1 | FBGA457 | FBGA457, plastic, fine-pitch ball grid array; 457 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.55 mm body | 2017-06-11 | |
SOT1716-1 | FBGA512 | FBGA512, plastic, fine-pitch ball grid array; 512 balls; 0.8 mm pitch; 25 mm x 25 mm x 1.9 mm body | 2017-06-11 | |
SOT1717-1 | FBGA529 | FBGA529, plastic, fine-pitch ball grid array; 529 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.64 mm body | 2016-01-05 | |
SOT1718-1 | FBGA561 | FBGA561, plastic, fine-pitch ball grid array; 561 balls; 0.8 mm pitch; 23 mm x 23 mm x 1.95 mm body | 2017-06-11 | |
SOT1720-1 | FM14F | FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1720-2 | FM14F | FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | PDSO-F14(JEDEC | 2017-06-11 |
SOT1720-3 | FM14F | FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | PDSO-G14(JEDEC | 2017-06-11 |
SOT1721-1 | FM14F | FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 23.62 mm x 2.59 mm body | PDSO-F14(JEDEC | 2017-06-11 |
SOT1722-1 | FM15F | FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1722-2 | FM15F | FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1722-3 | FM15F | FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1723-1 | FM16 | FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1723-2 | FM16 | FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1724-1 | FM16 | FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body | PDIL-G16(JEDEC | 2017-06-11 |
SOT1724-2 | FM16 | FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body | PDIL-G16(JEDEC | 2017-06-11 |
SOT1725-1 | FM16 | FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 3.18 mm body | 2017-06-11 | |
SOT1726-1 | FM16F | FM16F, plastic, flange mount flat package; 16 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1727-1 | FM16F | FM16F, plastic, flange mount flat package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body | PDIL-F16(JEDEC | 2017-06-11 |
SOT1728-1 | FM16F | FM16F, plastic, flange mount flat package; 16 terminals; 9.02 mm x 23.62 mm x 3.18 mm body | 2017-06-11 | |
SOT1729-1 | FM16F | FM16F, plastic, flange mount flat package; 16 terminals; 11 mm x 23.62 mm x 3.17 mm body | 2017-06-11 | |
SOT172A1 | CRPM4 | studded ceramic package; 4 leads | 1999-03-29 | |
SOT172A2 | CRPM4 | studded ceramic package; 4 leads | 1999-03-29 | |
SOT1730-1 | FM17F | FM17F, plastic, flange mount flat package; 17 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1730-2 | FM17F | plastic, flange mounted package; 17 leads flat; 1.02 mm pitch; 17.53 x 9.02 x 2.59 mm body | 2016-07-05 | |
SOT1730-3 | FM17F | FM17F, plastic, flange mount flat package; 17 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1731-1 | FM2 | FM2, plastic, flange mount package; 2 terminals; 6.1 mm x 9.65 mm x 2.03 mm body | PDIP-G2(JEDEC | 2017-06-11 |
SOT1732-1 | FM2F | FM2F, plastic, flange mount flat package; 2 terminals; 6.1 mm x 9.65 mm x 2.03 mm body | PDIP-F2(JEDEC | 2017-06-11 |
SOT1733-1 | FM2F | FM2F, plastic, flange mount flat package; 2 terminals; 6.35 mm x 23.62 mm x 2.59 mm body | PDIL-F2(JEDEC | 2017-06-11 |
SOT1734-1 | FM4 | FM4, plastic, flange mount package; 4 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | 2017-06-11 | |
SOT1735-1 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 23.62 mm x 2.59 mm body | PDIL-F4(JEDEC | 2017-06-11 |
SOT1736-1 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | PDIP-F4(JEDEC | 2017-06-11 |
SOT1736-2 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 17.53 mm x 2.59 mm body | PDSO-F4(JEDEC | 2017-06-11 |
SOT1737-1 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 23.62 mm x 3.18 mm body | PDIP-F4(JEDEC | 2017-06-11 |
SOT1738-1 | FM6 | FM6, plastic, flange mount package; 6 terminals; 6.35 mm x 23.62 mm x 2.62 mm body | PDIL-C6(JEDEC | 2017-06-11 |
SOT1739-1 | FM6F | FM6F, plastic, flange mount flat package; 6 terminals; 6.35 mm x 23.62 mm x 2.59 mm body | PDIL-F6(JEDEC | 2017-06-11 |
SOT1740-1 | FM6F | FM6F, flange mount flat package; 6 terminals; 3.05 mm pitch, 9.02 mm x 17.53 mm x 2.59 mm body | 2020-06-12 | |
SOT1741-1 | FM8 | FM8, plastic, flange mount package; 8 terminals; 6.35 mm x 23.62 mm x 2.62 mm body | PDIL-C8(JEDEC | 2017-06-11 |
SOT1742-1 | FM8F | FM8F, plastic, flange mount flat package; 8 terminals; 6.35 mm x 23.62 mm x 2.59 mm body | 2017-06-11 | |
SOT1744-1 | HBGA668 | HBGA668, plastic, thermal enhanced ball grid array; 668 balls; 1 mm pitch; 29 mm x 29 mm x 1.8 mm body | HT-PBGA-B668(JEDEC | 2017-06-11 |
SOT1745-1 | HBGA689 | HBGA689, plastic, thermal enhanced ball grid array; 689 balls; 1 mm pitch; 31 mm x 31 mm x 1.86 mm body | HT-PBGA-B689(JEDEC | 2017-06-11 |
SOT1746-1 | HSOP32 | HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.22 mm body | 2016-02-01 | |
SOT1746-2 | HSOP32 | plastic, heatsink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body | 2021-01-05 | |
SOT1746-3 | HSOP32 | HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body | E-PDSO-G32(JEDEC | 2017-06-11 |
SOT1746-4 | HSOP32 | HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 4.6 mm x 7 mm exposed pad | 2018-03-08 | |
SOT1747-1 | HSOP54 | HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.22 mm body | 2016-03-02 | |
SOT1747-2 | HSOP54 | HSOP54, plastic, heatsink small outline package; W/B, tooth gap design, 54 terminals; 0.65 mm pitch; 4.6 mm x 10.4 mm exposed pad | 2021-01-06 | |
SOT1747-3 | HSOP54 | HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body | E-PDSO-G54(JEDEC | 2017-06-11 |
SOT1747-4 | HSOP54 | HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body | E-PDSO-G54(JEDEC | 2017-06-11 |
SOT1748-1 | HTQFN32 | HTQFN32, plastic, thermal enhanced thin quad flatpack; no leads; 32 terminals; 1 mm pitch; 10 mm x 10 mm x 1.55 mm body | PBMA-N32(JEDEC | 2017-06-11 |
SOT1749-1 | HTSSOP16 | HTSSOP16, plastic, thermal enhanced thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body | TS-PDSO-G16(JEDEC | 2017-06-11 |
SOT1750-1 | HVLGA71 | HVLGA71, plastic, thermal enhanced, very thin, low profile land grid array package; 71 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.9 mm body | PBMA-N71(JEDEC | 2017-06-11 |
SOT1751-1 | LBGA352 | LBGA352, plastic, low profile ball grid array; 352 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.05 mm body | HT-PBGA-B352(JEDEC | 2017-06-11 |
SOT1752-1 | LBGA480 | LBGA480, plastic, low profile ball grid array; 480 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body | HT-PBGA-B480(JEDEC | 2017-06-11 |
SOT1753-1 | SENSOR4F | SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 8 mm body | E-PSXA-F4(JEDEC | 2017-06-11 |
SOT1754-1 | SENSOR4F | SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 10.67 mm body | E-PSXC-F4(JEDEC | 2017-06-11 |
SOT1756-1 | SENSOR4F | SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 10.67 mm body | E-PSXC-F6(JEDEC | 2017-06-11 |
SOT1757-1 | SENSOR4F | SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 19.05 mm x 27.94 mm x 8 mm body | E-PSXD-F4(JEDEC | 2017-06-11 |
SOT1759-1 | SIL3 | SIL3, plastic, DIL-bent-SIL package; 3 terminals; 1.5 mm pitch; 4.15 mm x 5.5 mm x 1.5 mm body | PSSO-F3(JEDEC | 2017-06-11 |
SOT176-1 | SO8 | plastic small outline package; 8 leads; body width 7.5 mm | 2003-02-19 | |
SOT1760-1 | SIL4 | SIL4, plastic, DIL-bent-SIL package; 4 terminals; 1.7 mm pitch; 9.2 mm x 10 mm x 4.4 mm body | 2017-06-11 | |
SOT1761-1 | SO16 | SO16, plastic, small outline package; 16 terminals; 1.27 mm pitch; 7.5 mm x 10.3 mm x 3.43 mm body | F-PDSO-G16(JEDEC | 2017-06-11 |
SOT1762-1 | SSOP32 | SSOP32, plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.5 mm body | 2016-02-29 | |
SOT1762-2 | SSOP32 | SSOP32; plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body | 2023-04-07 | |
SOT1763-1 | SO4 | SO4, plastic, small outline package; 4 terminals; 1.15 mm pitch; 1.25 mm x 2 mm x 1 mm body | PDSO-G4(JEDEC | 2017-06-11 |
SOT1764-1 | SSOP54 | SSOP54, plastic, shrink small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.5 mm body | E-PDSO-G54(JEDEC | 2017-06-11 |
SOT1765-1 | TLGA99 | TLGA99, plastic, thin low profile land grid array; 99 balls; 9.5 mm x 9.5 mm x 1.1 mm body | 2016-03-21 | |
SOT1766-1 | TQFN24 | TQFN24, plastic, thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 5 mm x 3 mm x 1 mm body | 2017-06-11 | |
SOT1767-1 | TSON14 | TSON14, plastic, thin small outline package; no leads; 14 terminals; 0.4 mm pitch; 5 mm x 3 mm x 1 mm body | PBMA-N14(JEDEC | 2017-06-11 |
SOT1768-1 | TSON8 | TSON8, plastic, thin small outline; no leads; 8 terminals; 1.25 mm pitch; 3 mm x 5 mm x 1.1 mm body | 2017-06-11 | |
SOT1769-1 | TSON8 | TSON8, plastic, thin small outline package; no leads; 8 terminals; 1.25 mm pitch; 5 mm x 3 mm x 1.2 mm body | PBMA-N14(JEDEC | 2017-06-11 |
SOT1770-1 | TSOP6 | TSOP6, plastic, thin small outline package; 6 terminals; 0.65 mm pitch; 1.25 mm x 2 mm x 1 mm body | PDSO-G6(JEDEC | 2017-06-11 |
SOT1771-1 | TSSOP24 | TSSOP24, plastic, thin shrink small outline package; 24 terminals; 0.65 mm pitch; 5.6 mm x 7.8 mm x 1.05 mm body | 2017-06-11 | |
SOT1772-1 | UNIBODY4F | UNIBODY4F, unibody package; 4 terminals; 2.54 mm pitch; 15.56 mm x 15.56 mm x 5.33 mm body | E-PSXA-F4(JEDEC | 2017-06-11 |
SOT1773-1 | VQFN16 | VQFN16, plastic, very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1 mm body | 2017-06-11 | |
SOT1774-1 | WLCSP120 | WLCSP120, wafer level chip-size package; 120 terminals; 0.4 mm pitch; 5.28 mm x 5.29 mm x 0.6 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1775-1 | WLCSP142 | WLCSP142, , wafer level chip-size package; 142 terminals; 0.4 mm pitch; 5.58 mm x 4.84 mm x 0.6 mm body | 2017-06-11 | |
SOT1776-1 | WLCSP143 | WLCSP143, , wafer level chip-size package; 143 terminals; 0.4 mm pitch; 5.55 mm x 6.44 mm x 0.6 mm body | 2017-06-11 | |
SOT1777-1 | WLCSP169 | WLCSP169, wafer level chip-size package; 169 terminals; 0.4 mm pitch; 5.5 mm x 5.63 mm x 0.6 mm body | 2017-06-11 | |
SOT1778-1 | WLCSP173 | WLCSP173, wafer level chip-size package; 173 terminals; 0.5 mm pitch; 7.74 mm x 7.9 mm x 0.6 mm body | 2017-06-11 | |
SOT1779-1 | WLCSP211 | WLCSP211, , wafer level chip-size package; 211 terminals; 0.5 mm pitch; 9.33 mm x 7.91 mm x 0.6 mm body | 2017-06-11 | |
SOT1780-1 | WLCSP36 | WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.98 mm x 3.07 mm x 0.6 mm body | 2017-06-11 | |
SOT1780-10 | WLCSP36 | WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body (backside coating included) | 2018-11-01 | |
SOT1780-11 | WLCSP36 | WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) | 2018-11-30 | |
SOT1780-12 | WLCSP36 | WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body | 2018-12-04 | |
SOT1780-13 | WLCSP36 | WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.79 mm x 2.59 mm x 0.525 mm body | 2019-04-18 | |
SOT1780-2 | WLCSP36 | WLCSP36, wafer level chip-size package; 36 terminals; 0.4 mm pitch; 3.064 mm x 3.064 mm x 0.545 mm body | 2016-01-05 | |
SOT1780-3 | WLCSP36 | WLCSP36, wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.674 mm x 2.822 mm x 0.564 mm body | 2016-04-15 | |
SOT1780-4 | WLCSP36 | WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body (backside coating included) | 2017-12-20 | |
SOT1780-5 | WLCSP36 | WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body | 2017-12-08 | |
SOT1780-6 | WLCSP36 | WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body | 2017-09-18 | |
SOT1780-7 | WLCSP36 | WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body | 2017-09-18 | |
SOT1780-8 | WLCSP36 | WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 3.9 mm x 1.9 mm x 0.525 mm body (backside coating included) | 2018-06-20 | |
SOT1780-9 | WLCSP36 | WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) | 2018-11-01 | |
SOT1781-1 | WLCSP35 | WLCSP35, , wafer level chip-size package; 35 terminals; 0.4 mm pitch; 2.99 mm x 2.53 mm x 0.6 mm body | 2017-06-11 | |
SOT1781-2 | WLCSP35 | WLCSP35, wafer level chip-size package; 35 terminals; 0.4 mm pitch; 3 mm x 2.16 mm x 0.525 mm body | 2021-11-23 | |
SOT1782-1 | WLCSP64 | WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.32 mm x 3.35 mm x 0.6 mm body | 2017-06-11 | |
SOT1782-2 | WLCSP64 | WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.38 mm x 3.48 mm x 0.32 mm body | 2017-06-11 | |
SOT1782-3 | WLCSP64 | WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included) | 2018-08-02 | |
SOT1783-1 | WLCSP80 | WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.6 mm body | 2017-06-11 | |
SOT1783-2 | WLCSP80 | WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.34 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1784-1 | WLCSP89 | wafer level chip-scale package, 89 bumps, 0.4 mm pitch, 3.63 mm x 3.58 mm x 0.38 mm body | 2016-09-05 | |
SOT1785-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1785-2 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1786-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1787-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 13.72 mm pitch, 10.16 mm x 41.15 mm x 4.575 mm body | 2019-10-25 | |
SOT1788-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 13.72 mm x 34.04 mm x 4.41 mm body | 2017-06-11 | |
SOT1789-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 13.72 mm x 23.12 mm x 4.41 mm body | 2017-06-11 | |
SOT1790-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1791-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 5.85 mm x 20.32 mm x 3.82 mm body | 2017-06-11 | |
SOT1791-2 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 5.84 mm x 20.32 mm x 3.81 mm body | 2017-06-11 | |
SOT1792-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 34.04 mm x 3.75 mm body | 2017-06-11 | |
SOT1793-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1794-1 | CFM8F | CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 41.15 mm x 4.45 mm body | 2017-06-11 | |
SOT1795-1 | CFM8F | CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 32.26 mm x 4.45 mm body | 2017-06-11 | |
SOT1796-1 | CFM8F | CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 32.26 mm x 4.45 mm body | 2017-06-11 | |
SOT1797-1 | CFM8F | CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1798-1 | CFM8F | CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1798-2 | CFM8F | CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1799-1 | CFM6F | CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1799-2 | CFM6F | CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1799-3 | CFM6F | CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1799-4 | CFM6F | CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1799-6 | CFM6F | CFM6F, ceramic flange mount flat package; 6 terminals; 4.445 mm pitch, 9.78 mm x 20.58 mm x 3.75 mm body | 2018-08-14 | |
SOT1800-1 | CFM6F | CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.58 mm body | 2017-06-11 | |
SOT1800-4 | ACP-1230S-4L2S | CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.45 mm body | 2017-06-26 | |
SOT1801-1 | CFM6F | CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1801-2 | CFM6F | CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1802-1 | CFM2 | CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1803-1 | CFM2 | CFM2, ceramic, flange mount package; 2 terminals; 13.72 mm x 23.12 mm x 4.41 mm body | 2017-06-11 | |
SOT1804-1 | CFM2 | CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1804-2 | CFM2 | CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 23.12 mm x 3.75 mm body | 2017-06-11 | |
SOT1805-1 | CFM4 | CFM4, ceramic, flange mount package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1805-3 | CFM4 | CFM4, ceramic, flange mount package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1806-1 | CFM4 | CFM4, ceramic, flange mount package; 4 terminals; 10.16 mm x 32.26 mm x 4.45 mm body | 2017-06-11 | |
SOT1806-2 | CFM4 | CFM4, ceramic, flange mount package; 4 terminals; 10.16 mm x 32.26 mm x 4.58 mm body | 2017-06-11 | |
SOT1809-1 | CFM8 | CFM8, ceramic, flange mount package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body | 2017-06-11 | |
SOT1811-1 | PLD4L | PLD4L, plastic, RF over-molded package designation; 4 terminals; 5.85 mm x 6.61 mm x 1.74 mm body | PDFP-D2(JEDEC | 2017-06-11 |
SOT1811-2 | PLD4L | PLD4L, plastic, RF over-molded package designation; 4 terminals; 0 mm pitch; 5.85 mm x 6.61 mm x 1.74 mm body | 2017-06-11 | |
SOT1812-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 20.32 mm x 3.67 mm body | 2017-06-11 | |
SOT1812-2 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 20.32 mm x 3.66 mm body | 2016-03-18 | |
SOT1813-1 | CFM2 | CFM2, ceramic, flange mount package; 2 terminals; 3.68 mm x 4.7 mm x 2.51 mm body | 2017-06-11 | |
SOT1814-1 | CFM2 | CFM2, ceramic, flange mount package; 2 terminals; 5.85 mm x 20.32 mm x 3.83 mm body | 2017-06-11 | |
SOT1815-1 | FM2 | FM2, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2017-06-11 | |
SOT1815-2 | FM2 | FM2, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2017-06-11 | |
SOT1816-1 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 32.26 mm x 3.81 mm body | 2017-06-11 | |
SOT1817-1 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 23.21 mm x 3.81 mm body | 2017-06-11 | |
SOT1818-1 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2017-06-11 | |
SOT1818-3 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2017-06-11 | |
SOT1818-4 | FM4F | FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2017-06-11 | |
SOT1819-1 | FM6F | FM6F, plastic, flange mount flat package; 6 terminals; 9.96 mm x 32.26 mm x 3.81 mm body | 2017-06-11 | |
SOT1819-2 | FM6F | FM6F, plastic, flange mount flat package; 6 terminals; 9.96 mm x 32.26 mm x 3.81 mm body | 2017-06-11 | |
SOT1821-1 | FM8F | FM8F, plastic, flange mount flat package; 8 terminals; 6.1 mm x 9.65 mm x 2.03 mm body | 2017-06-11 | |
SOT1822-1 | FM2F | FM2F, plastic, flange mount flat package; 2 terminals; 6.1 mm x 10.67 mm x 2.03 mm body | PDIP-F2(JEDEC | 2017-06-11 |
SOT1823-1 | FM2F | FM2F, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2019-02-08 | |
SOT1824-1 | FM4 | FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 32.26 mm x 3.81 mm body | 2017-06-11 | |
SOT1825-1 | FM4 | FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2017-06-11 | |
SOT1825-2 | FM4 | FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body | 2017-06-11 | |
SOT1826-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.53 mm x 3.75 mm body | 2017-06-11 | |
SOT1827-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 34.04 mm x 3.75 mm body | 2017-06-11 | |
SOT1828-1 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 10.16 mm x 3.66 mm body | 2017-06-11 | |
SOT1828-3 | CFM2F | CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 10.16 mm x 3.66 mm body | 2018-03-05 | |
SOT1829-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 10.16 mm x 32.26 mm x 4.58 mm body | 2017-06-11 | |
SOT1829-2 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 10.16 mm x 32.26 mm x 4.45 mm body | 2017-06-11 | |
SOT1830-1 | HVQFN28 | plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 3.5 x 5.5 x 0.85 mm | MO-220(JEDEC | 2016-04-26 |
SOT1831-1 | HLQFN26 | HLQFN26, thermal enhanced low profile quad flat package, no leads, 1 mm pitch, 10 mm x 6 mm x 1.348 mm body | 2019-09-25 | |
SOT1831-2 | HLQFN26 | HLQFN26, thermal enhanced low profile quad flat package, no leads, 1 mm pitch, 10 mm x 6 mm x 1.365 mm body | 2019-09-26 | |
SOT1832-1 | HUQFN16 | plastic thermal enhanced ultra thin quad flat package; no leads; 16 terminals; body 2.4 x 1.6 x 0.5 mm | 2016-04-26 | |
SOT1833-1 | WLCSP75 | WLCSP75, wafer level chip-size package; 75 terminals; 0.4 mm pitch; 3.8 mm x 3.89 mm x 0.56 mm body | 2017-06-11 | |
SOT1834-1 | LFBGA304 | LFBGA304, plastic, low profile fine-pitch ball grid array; 304 balls; 0.5 mm pitch; 12 mm x 12 mm x 1.11 mm body | 2017-06-11 | |
SOT1835-1 | WLCSP25 | wafer level chip-scale package, 25 bumps | 2016-04-26 | |
SOT1836-1 | LBGA121 | LBGA121, plastic, low profile ball grid array; 121 balls; 1 mm pitch; 12 mm x 12 mm x 1.12 mm body | PBGA-B121(JEDEC | 2017-06-11 |
SOT1837-1 | LFBGA347 | LFBGA347, plastic, low profile fine-pitch ball grid array; 347 balls; 0.5 mm pitch; 12 mm x 12 mm x 1.3 mm body | 2017-06-11 | |
SOT1838-1 | LFBGA236 | LFBGA236, plastic, low profile fine-pitch ball grid array; 236 balls; 0.5 mm pitch; 9 mm x 9 mm x 1.24 mm body | 2017-06-11 | |
SOT1839-1 | TFBGA488 | TFBGA488, plastic, thin fine-pitch ball grid array; 488 balls; 0.4 mm pitch; 12 mm x 12 mm x 1.04 mm body | MO-298 TLAA-1(JEDEC | 2016-05-17 |
SOT1840-1 | FBGA621 | FBGA621, plastic, fine-pitch ball grid array; 621 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.97 mm body | 2017-06-11 | |
SOT1840-3 | FBGA621 | FBGA621, fine-pitch ball grid array package; 621 terminals, 0.65 mm pitch, 17 mm x 17 mm x 2.03 mm body | 2017-03-27 | |
SOT1840-6 | FBGA621 | FBGA621, fine-pitch ball grid array package; 621 terminals, 0.65 mm pitch, 17 mm x 17 mm x 1.97 mm body | 2019-05-28 | |
SOT1842-1 | LFBGA186 | LFBGA186, plastic, low profile fine-pitch ball grid array; 186 balls; 0.8 mm pitch; 12 mm x 12 mm x 1.18 mm body | 2017-06-11 | |
SOT1843-1 | SIL4 | SIL4, plastic, DIL-bent-SIL package; 4 terminals; 1.27 mm pitch; 6.35 mm x 9.25 mm x 3.63 mm body | R-PSIP-F4(JEDEC | 2017-06-11 |
SOT1845-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 5.46 mm body | 2020-02-13 | |
SOT1848-2 | BGA1517 | BGA1517, plastic ball grid array package; 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body | 2017-12-18 | |
SOT1849-1 | VFBGA361 | VFBGA361, plastic, very thin fine-pitch ball grid array; 361 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.8 mm body | VFBGA(JEDEC | 2017-06-11 |
SOT1850-1 | VFBGA176 | VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm body | 2018-07-13 | |
SOT1851-1 | VFBGA36 | plastic very thin fine-pitch ball grid array package, 36 balls | 2016-03-02 | |
SOT1852-1 | SENSOR6F | SENSOR6F, sensor package; 6 terminals; 2.54 mm pitch; 17.78 mm x 29.47 mm x 8.01 mm body | E-PSXB-F6(JEDEC | 2017-06-11 |
SOT1854-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 12.96 mm body | E-PDSO-F8(JEDEC | 2017-06-11 |
SOT1855-1 | WLCSP | wafer level chip-scale package; 29 bumps; 1.14 x 1.14 x 0.28 mm | 2016-10-04 | |
SOT1856-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 34.04 mm x 5.13 mm body | 2017-06-11 | |
SOT1857-1 | UFLGA64 | plastic ultra thin fine-pitch land array package: 64 lands | 2016-04-04 | |
SOT186 | TO-220F; SC-67 | plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack" exposed tabs | 2002-03-12 | |
SOT1860-1 | VFBGA64 | plastic very thin fine-pitch ball grid array package; 64 balls | 2016-05-18 | |
SOT1862-1 | HVSON16 | HVSON16, plastic, thermal enhanced very thin small outline; no leads; 16 terminals; 0.65 mm pitch; 4 mm x 6 mm x 0.9 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT1863-1 | SO8 | SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 12.96 mm body | E-PDIP-F8(JEDEC | 2017-10-24 |
SOT1865-1 | TFBGA265S | TFBGA265S, plastic thin fine-pitch ball grid array; 265 balls, 0.75 mm interstitial pitch, 13 mm x 13 mm x 1.04 mm body | 2018-09-14 | |
SOT1865-2 | TFBGA265S | TFBGA265S, plastic thin fine-pitch ball grid array; 265 balls, 0.75 mm pitch, 13 mm x 13 mm x 1.04 mm body | 2017-09-14 | |
SOT1866-1 | DBS27P | plastic DIL-bent-SIL(special bent) power package; 27 leads (lead length 6.8 mm) | 2016-06-09 | |
SOT1868-1 | VFLGA211 | VFLGA211, plastic, very thin fine-pitch land grid array package; 211 balls; 0.5 mm pitch; 9.6 mm x 9.6 mm x 0.805 mm body | 2018-12-06 | |
SOT186A | TO-220F | plastic, single-ended package; 3 leads; 2.54 mm pitch; 15.5 mm x 10 mm x 4.3 mm body | 3-lead TO-220F(JEDEC | 2006-02-14 |
SOT186B | TO-220F | plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack" | 2002-03-12 | |
SOT187-2 | PLCC44 | plastic leaded chip carrier; 44 leads | EDR-7319(EIAJ);MS-018(JEDEC);112E10(IEC | 2001-11-14 |
SOT187-3 | PLCC44 | PLCC44, plastic leaded chip carrier; 44 terminals; 1.27 mm pitch; 16.58 mm x 16.58 mm x 4.57 mm body | PQCC-J44(JEDEC | 2017-06-11 |
SOT1870-1 | WLCSP8 | Bumped die with 8 functional bumps; 2.51 mm x 2.51 mm x 0.16 mm | 2016-10-04 | |
SOT1872-1 | WLCSP7 | WLCSP7, , wafer level chip-size package; 7 terminals; 0 mm pitch; 0.38 mm x 1.47 mm x 0.38 mm body | 2017-06-11 | |
SOT1873-1 | CFM2 | CFM2, ceramic, flange mount package; 2 terminals; 3.75 mm x 34.04 mm x 3.75 mm body | 2016-03-07 | |
SOT1875-1 | WLCSP210 | WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.33 mm x 6.62 mm x 0.56 mm body | 2017-06-11 | |
SOT1875-2 | WLCSP210 | WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.94 mm x 6.94 mm x 0.56 mm body | 2017-06-11 | |
SOT1877-1 | SIL6 | SIL6, plastic, DIL-bent-SIL package; 6 terminals; 2.54 mm pitch; 15.56 mm x 15.56 mm x 5.34 mm body | E-PSXA-F6(JEDEC | 2017-06-11 |
SOT1878-1 | HX2QFN20 | plastic, thermal enhanced super thin quad flat package; no leads; 20 terminals; 0.4 mm pitch, 3.0 mm x 2.0 mm x 0.35 mm body | 2016-06-10 | |
SOT1879-1 | LFBGA393 | LFBGA393, plastic, low profile fine-pitch ball grid array; 393 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.11 mm body | 2017-06-11 | |
SOT1879-2 | LFBGA393 | LFBGA393, plastic, low profile fine-pitch ball grid array; 393 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.38 mm body | 2017-06-16 | |
SOT188-2 | PLCC68 | plastic leaded chip carrier; 68 leads | EDR-7319(EIAJ);MS-018(JEDEC);112E10(IEC | 2001-11-14 |
SOT188-3 | PLCC68 | plastic leaded chip carrier; 68 leads; pedestal, 1.27 mm pitch, 24.15 mm x 24.15 mm x 3.56 mm body | MO-047(JEDEC);112E10(IEC | 2001-11-14 |
SOT188-4 | PLCC68 | PLCC68, plastic leaded chip carrier; 68 terminals; 1.27 mm pitch; 24.2 mm x 24.2 mm x 4.57 mm body | PQCC-J68(JEDEC | 2017-06-11 |
SOT1880-1 | UFBGA16 | plastic ultra thin fine-pitch ball grid array package; 16 balls | 2016-06-16 | |
SOT1882-1 | WLCSP47 | wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body | 2016-08-01 | |
SOT1883-1 | HX2QFN16 | plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; body 2.6 x 2.6 x 0.35 mm | 2016-06-16 | |
SOT1887-1 | WLCSP48 | wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included) | 2016-10-04 | |
SOT1887-2 | WLCSP48 | WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.5 mm body | 2017-12-11 | |
SOT1887-3 | WLCSP48 | WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body | 2017-12-11 | |
SOT1887-4 | WLCSP48 | WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.50 mm body | 2017-12-19 | |
SOT1887-5 | WLCSP48 | WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body | 2017-12-08 | |
SOT1888-1 | LFBGA141 | LFBGA141, plastic, low profile fine-pitch ball grid array; 141 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.38 mm body | 2017-06-11 | |
SOT189-2 | PLCC84 | plastic leaded chip carrier; 84 leads | EDR-7319(EIAJ);MS-018(JEDEC);112E13(IEC | 2001-11-14 |
SOT189-3 | PLCC84 | plastic leaded chip carrier; 84 leads; pedestal, 1.27 mm pitch, 29.24 mm x 29.24 mm x 3.68 mm body | MO-047(JEDEC);112E13(IEC | 2001-11-14 |
SOT189-4 | PLCC84 | PLCC84, plastic leaded chip carrier; 84 terminals; 1.27 mm pitch; 29.28 mm x 29.28 mm x 4 mm body | PQCC-J84(JEDEC | 2017-06-11 |
SOT1890-1 | WLCSP56 | wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x 2.59 mm x 0.415 mm body (backside coating included) | 2016-08-09 | |
SOT1890-3 | WLCSP56 | WLCSP56, wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.95 mm x 2.6 mm x 0.415 mm body (backside coating included) | 2019-01-23 | |
SOT1893-1 | CLSON12 | CLSON12, ceramic, low-profile small outline package, no lead; 12 terminals; 0.8 mm pitch; 4 mm x 5 mm x 1.365 mm body | 2021-06-03 | |
SOT1894-1 | SO14 | plastic small outline package; 14 leads; 9.9 mm x 3.9 mm x 1.35 mm body | 2016-08-17 | |
SOT1895-1 | X2QFN24 | plastic, thermal enhanced super thin quad flat package; no leads; 24 terminals; 2.0 mm x 2.0 mm x 0.35 mm body | 2016-08-19 | |
SOT1896-1 | X2QFN16 | plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; 1.6 mm x 1.6 mm x 0.35 mm body | 2016-08-19 | |
SOT1898-1 | HLQFP64 | plastic, thermal enhanced low profile quad flat package; 64 leads; 14 x 14 x 1.5 mm body; exposed die pad | 2016-09-01 | |
SOT1899-1 | BGA1313 | BGA1313, ball grid array package, 1313 terminals, 0.75 mm pitch, 29 mm x 29 mm x 2.37 mm body | 2019-06-04 | |
SOT190-1 | VSO56 | plastic very small outline package; 56 leads | 2003-02-19 | |
SOT190-2 | VSO56 | plastic very small outline package; 56 leads; face down | 2003-02-19 | |
SOT1901-1 | WLCSP8 | WLCSP8, wafer level chip-scale package; 8 bumps; 0.810 mm x 0.505 mm x 0.23 mm body | 2017-03-08 | |
SOT1903-1 | HX2QFN24 | plastic, thermal enhanced super thin quad flat package; no leads; 24 terminals; 0.4 mm pitch, 2.4 mm x 3.2 mm x 0.35 mm body | 2016-12-16 | |
SOT1906-2 | WLCSP214 | WLCSP214, wafer level chip-scale package, 214 terminals, 0.5 mm pitch, 9.418 mm x 7.918 mm x 0.55 mm body | 2018-03-28 | |
SOT1908-1 | FBGA448 | FBGA448, fine-pitch ball grid array package, 448 terminals, 0.75 mm pitch, 17 mm x 17 mm x 2.46 mm body | 2019-06-04 | |
SOT1910-1 | LFLGA54 | LFLGA54, plastic low profile, fine pitch, land grid array package; 54 terminals; 0.5 mm pitch; 6 mm x 9.7 mm x 1.17 mm body | 2017-01-23 | |
SOT1911-1 | CFM4F | CFM4F, ceramic, flange mount flat package; 4 terminals; 5.845 mm x 16.35 mm x 3.975 mm body | 2017-06-11 | |
SOT1914-1 | WLCSP56 | WLCSP56, wafer level chip scale package, 56 terminals, 0.4 mm pitch, 4.39 mm x 3.59 mm x 0.5 mm body | 2018-02-08 | |
SOT1914-2 | WLCSP56 | WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 3.455 mm x 3.06 mm x 0.495 mm body (backside coating included) | 2020-04-06 | |
SOT1914-3 | WLCSP56 | WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 3.455 mm x 3.06 mm x 0.365 mm body (backside coating included) | 2019-09-17 | |
SOT1915-1 | FBGA525 | FBGA525, fine-pitch ball grid array package; 525 terminals, 0.8 mm pitch, 19 mm x 19 mm x 2.47 mm body | 2017-01-24 | |
SOT1915-2 | FBGA525 | FBGA525, fine-pitch ball grid array package; 525 balls, 0.8 mm pitch, 19 mm x 19 mm x 2.37 mm body | 2018-10-17 | |
SOT1916-1 | FBGA609 | FBGA609, fine-pitch ball grid array package; 609 terminals, 0.8 mm pitch, 21 mm x 21 mm x 2.37 mm body | 2019-06-04 | |
SOT1917-1 | WLCSP72 | WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 2.99 mm x 3.54 mm x 0.355 mm body | 2018-01-22 | |
SOT1917-2 | WLCSP72 | WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body | 2017-02-21 | |
SOT1917-3 | WLCSP72 | WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 3.54 mm x 2.99 mm x 0.49 mm body | 2018-04-27 | |
SOT1917-5 | WLCSP72 | WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body (backside coating included) | 2019-07-04 | |
SOT1919-1 | LFBGA157 | LFBGA157, low profile, fine-pitch ball grid array package, 157 terminals, 0.5 mm pitch, 8 mm x 8 mm x 1.25 mm body | 2017-06-12 | |
SOT1921-1 | HQFN24 | HQFN24, thermal enhanced quad flat package, no leads, step-cut wettable flank, 24 terminals, 0.8 mm pitch, 6 mm x 6 mm x 1.98 mm body | 2018-12-25 | |
SOT1921-3(D) | HQFN24 | HQFN24, thermal enhanced quad flat package, no leads, 0.1 dimple wettable flank, 24 terminals, 0.8 mm pitch, 6 mm x 6 mm x 1.98 mm body | 2019-07-26 | |
SOT1921-4(D) | HQFN24 | HQFN24, thermal enhanced quad flat package, no leads, 0.1 dimple wettable flank, 24 terminals, 0.8 mm pitch, 6 mm x 6 mm x 2.2 mm body | 2019-07-26 | |
SOT1921-5(D) | HQFN24 | HQFN24, thermal enhanced quad flat package, no leads, 0.1 dimple wettable flank, 24 terminals, 0.8 mm pitch, 6 mm x 6 mm x 1.9 mm body | 2020-06-10 | |
SOT1926-1 | WLCSP41 | WLCSP41, wafer level chip-scale package; 41 bumps; 1.500 mm x 1.455 mm x 0.275 mm body | 2017-06-14 | |
SOT1927-1 | HX2QFN | HX2QFN16, plastic, thermal enhanced super-thin quad; flat non-leaded package; 16 terminals; 0.4 mm pitch; 2.3 mm x 2.3 mm x 0.38 mm body | 2017-06-14 | |
SOT1928-1 | LFBGA249 | LFBGA249, plastic low profile fine-pitch ball grid array package; 249 balls; 12.0 mm x 12.0 mm x 1.30 mm body | 2020-03-25 | |
SOT193-2 | SIL13P | plastic single in-line power package; 13 leads | 2003-03-12 | |
SOT1930-1 | SIL3 | SIL3, plastic DIL-bent-SIL package, 3 terminals; 5.44 mm pitch; 15.92 mm x 20.96 mm x 5.07 mm body | 2017-10-18 | |
SOT1931-1(D) | HQFN24 | plastic thermal enhanced quad flat package; no leads, 0.1 dimple wettable flank; 24 terminals; 0.5 mm pitch, 4 mm x 4 mm x 1.98 mm body | 2019-06-27 | |
SOT1931-1(SC) | HQFN24 | plastic thermal enhanced quad flat package; no leads; 24 terminals; 0.5 mm pitch, 4 mm x 4 mm x 1.98 mm body | 2019-07-12 | |
SOT1932-1 | FBGA417 | FBGA417, fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, 17 mm x 17 mm x 2.58 mm body | 2019-06-04 | |
SOT1933-1 | HQFN36 | HQFN36, plastic, thermal enhanced quad flatpack; no leads; 36 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body | I-PQFP-N36(JEDEC | 2017-06-11 |
SOT1934-1 | HLFLGA17 | HLFLGA17, thermal enhanced low profile fine-pitch land grid array package, 17 terminals, 0.65 mm pitch, 4 mm x 3 mm x 1.348 mm body | 2019-02-18 | |
SOT1936-1 | HX2QFN14 | HX2QFN14, plastic thermal enchanced super thin quad flat package; no leads; 14 terminals; 3.5 mm x 3.5 mm x 0.32 mm body | 2017-07-24 | |
SOT1937-1 | SIL3 | SIL3, plastic, DIL-bent-SIL package; 3 terminals; 2.54 mm pitch; 14.32 mm x 9.96 mm x 2.50 mm body | 2019-02-13 | |
SOT1938-1 | HQFN23 | HQFN23, thermal enhanced qual flat package, no leads, 23 terminals, 0.9 mm pitch, 12 mm x 12 mm x 2.1 mm body | 2018-07-03 | |
SOT1938-2 | HQFN23 | HQFN23, thermal enhanced qual flat package, no leads, 23 terminals, 0.9 mm pitch, 12 mm x 12 mm x 2.1 mm body | 2018-07-16 | |
SOT1940-1 | HDQFP172 | PQFP-E-172; plastic qual flat package; 172 terminals, 0.65 mm pitch, 16 mm x 16 mm x 1.65 mm body. | MO-355 F(JEDEC | 2023-05-16 |
SOT1941-1 | FBGA780 | FBGA780, plastic, fine-pitch ball grid array; 780 balls, 0.65 mm pitch, 19 mm x 19 mm x 2.37 mm body | 2017-09-14 | |
SOT1942-1 | WLCSP40 | WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) | 2017-09-13 | |
SOT1944-1 | VFBGA100 | VFBGA100, very thin fine-pitch ball grid array package, 100 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.8 mm body | 2018-04-03 | |
SOT1945-1 | VFBGA180 | VFBGA180, plastic, very thin fine pitch ball grid array; 180 bumps; 0.5 mm pitch; 8 mm x 8 mm x 0.86 mm body | 2017-10-12 | |
SOT1948-1 | HWFLGA36 | HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 2.1 mm x 6 mm x 0.637 mm body | 2019-11-14 | |
SOT195 | SIP4 | plastic single-ended flat package; 4 in-line leads | 1997-06-02 | |
SOT1950-1 | WLCSP72 | WLCSP72, wafer level chip-scale package, 72 bumps, 4.46 mm x 3.96 mm x 0.53 mm body | 2017-10-05 | |
SOT1951-1 | FBGA1150 | FBGA1150, plastic, fine-pitch ball grid array package, 1150 balls, 0.65 mm pitch, 23 mm x 23 mm x 2.37 mm body | 2019-06-13 | |
SOT1952-1 | PLLMC14 | PLLMC14, plastic leadless module carrier, 14 terminals, 2.6 mm pitch, 15 mm x 12.8 mm x 0.39 mm body | 2019-01-25 | |
SOT1954-1 | FBAG352 | FBGA352, plastic fine-pitch ball grid array package, 352 balls, 0.8 mm pitch, 17 mm x 17 mm x 1.63 mm body | 2017-11-28 | |
SOT1956-1 | XQFN16 | XQFN16, plastic, extremely thin quad flat package; no leads; 16 terminals; 0.4 mm pitch, 2.2 mm x 2.8 mm x 0.50 mm body | 2017-12-07 | |
SOT1957-1 | WLCSP43 | WLCSP43, wafer level chip-scale package; 43 bumps; 0.4 mm pitch, 4.045 mm x 3.16 mm x 0.38 mm body | 2018-04-12 | |
SOT1958-1 | FBGA501 | FBGA501, plastic fine-pitch ball grid array package, 501 balls, 0.8 mm pitch, 21 mm x 21 mm x 1.63 mm body | 2017-12-12 | |
SOT1959-1 | HUQFN18 | plastic thermal enhanced ultra thin quad flat package; no leads; 18 terminals; 0.4 mm pitch, 2.6 mm x 2.6 mm x 0.55 mm body | 2019-03-01 | |
SOT1959-1(SC) | HUQFN18 | HUQFN18, thermal enhanced ultra thin quad flat package; no leads; step-cut wettable flank, 18 terminals, 0.4 mm pitch, 2.6 mm x 2.6 mm x 0.55 mm body | 2019-03-20 | |
SOT1961-1 | RDBS27P | RDBS27P, right-angle DIL-bent-SIL package, 27 terminals, 1.0 mm pitch, 15.9 mm x 29.1 mm x 4.5 mm body | 2018-01-17 | |
SOT1962-1 | LFBGA485 | LFBGA485, plastic, low profile fine-pitch ball grid array package; 485 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.25 mm body | 2018-01-12 | |
SOT1963-1 | VFBGA42 | VFBGA42, plastic very thin fine-pitch ball grid array package, 42 balls, 0.4 mm pitch, 2.6 mm x 3 mm x 0.9 mm body | 2018-02-01 | |
SOT1964-1 | WLCSP8 | WLCSP8, wafer level chip-scale package, 8 terminals, 0.205 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body | 2018-03-07 | |
SOT1966-1 | WLCSP81 | WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body | 2018-02-12 | |
SOT1966-2 | WLCSP81 | WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body (backside coating included) | 2018-03-14 | |
SOT1967-1 | LFBGA486 | LFBGA486, low profile fine-pitch ball grid array, 486 balls, 0.5 mm pitch, 14 mm x 14 mm x 1.15 mm body | 2018-08-02 | |
SOT1967-2 | LFBGA486 | LFBGA486, low profile fine-pitch ball grid array, 486 balls, 0.5 mm pitch, 14 mm x 14 mm x 1.15 mm body | 2018-03-01 | |
SOT1968-1 | LFBGA196 | LFBGA196, low profile fine pitch ball grid array, 196 terminals, 0.8 mm pitch, 12 mm x 12 mm x 1.37 mm body | 2018-03-26 | |
SOT1969-1 | HX2QFN20 | HX2QFN20, thermal enhanced super thin quad flat package; no leads; 20 terminals, 0.4 mm pitch, 3.0 mm x 3.0 mm x 0.32 mm body | MO-288(JEDEC | 2019-05-16 |
SOT1970-1 | SIL2 | SIL2, single in-line package, 2 terminals, 4.0 mm pitch, 6.9 mm x 8.9 mm x 3.3 mm body | 2021-05-04 | |
SOT1975-1 | WLCSP68 | WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.49 mm body (backside coating included) | 2018-05-16 | |
SOT1975-2 | WLCSP68 | WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.325 mm body (backside coating included) | 2019-11-25 | |
SOT1976-1 | VFBGA115 | VFBGA115, very thin, fine-pitch ball grid array package, 0.5 mm pitch, 7 mm x 7 mm x 0.86 mm body | 2018-05-18 | |
SOT1978-1 | FBAG957 | FBGA957, fine-pitch ball grid array package, 0.65 mm pitch, 21 mm x 21 mm x 2.37 mm body | 2018-05-18 | |
SOT1979-1 | FBGA187 | FBGA187, fine-pitch ball grid array package, 187 terminals, 0.5 mm pitch, 9 mm x 9 mm x 1.87 mm body | 2018-05-28 | |
SOT1980-1 | FCD36 | FCD36, flip chip die, 36 terminals, 1.63 mm x 1.53 mm x 0.225 mm body | 2020-02-13 | |
SOT1980-2 | FCD36 | FCD36, flip chip die, 36 terminals, 1.63 mm x 1.63 mm x 0.225 mm body | 2020-02-17 | |
SOT1981-1 | FM8 | FM8, flange mount package, 8 terminals, 1.02 mm pitch, 10.26 mm x 10.26 mm x 3.81 mm body | 2019-10-29 | |
SOT1982-1 | VFBGA98 | VFBGA98, very thin fine-pitch ball grid array package, 98 terminals, 0.5 mm pitch, 7 mm x 7 mm x 0.86 mm body | 2018-09-26 | |
SOT1985-1 | VFBGA36 | VFBGA36, very thin fine-pitch ball grid array package, 36 terminals, 0.5 mm pitch, 3.5 mm x 3.5 mm x 0.8 mm body | 2018-06-28 | |
SOT1986-1 | X2SON8 | X2SON8, super thin small outline package, no leads; 8 terminals; 0.35 mm pitch; 1.4 mm x 1.0 mm x 0.32 mm body | 2018-08-06 | |
SOT1989-1 | LFBGA269 | LFBGA269, low-profile fine-pitch ball grid array package, 269 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.37 mm body | 2018-07-06 | |
SOT199 | TO-247F | plastic single-ended package; heatsink mounted; 1 mounting hole; 3 lead TO-247 "full pack" | 3-lead TO-247F(JEDEC | 1999-09-13 |
SOT1990-1 | HLLAG33R | HLLGA33R, thermal enhanced low profile land grid array, 33 terminals, 0.8 mm pitch, 10 mm x 6 mm x 1.365 mm body | 2018-08-22 | |
SOT1991-1(SC) | HTQFN24 | HTQFN24, thermal enhanced thin quad flat package; no leads; step-cut wettable flank; 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 1 mm body | 2019-01-03 | |
SOT1991-3(D) | HTQFN24 | HTQFN24, thermal enhanced thin quad flat package; no leads; dimple wettable flank; 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 1 mm body | 2019-04-11 | |
SOT1991-3(SC) | HTQFN24 | HTQFN24, thermal enhanced thin quad flat package; no leads; step-cut wettable flank; 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 1 mm body | 2019-01-15 | |
SOT1992-1(DD) | HLSON16 | HLSON16, thermal enhanced low profile small outline; no leads, 16 terminals, 0.125 dimple wettable flank, 0.5 mm pitch, 4.5 mm x 3.5 mm x 1.45 mm body | 2019-02-12 | |
SOT1996-1 | HLFLGA21 | HLFLGA21, thermal enhanced low profile fine-pitch land grid array package, 21 terminals, 0.9 mm pitch, 6.2 mm x 6.2 mm x 1.148 mm body | 2018-08-29 | |
SOT1997-1 | FBGA477 | FBGA477, fine-pitch ball grid array package, 477 terminals, 0.75 mm pitch, 17 mm x 17 mm x 2.03 mm body | 2018-09-21 | |
SOT1998-1 | FCD40 | FCD40, flip chip die, 40 terminals, 1.83 mm x 1.62 mm x 0.225 mm body | 2020-02-17 | |
SOT1999-1 | WLCSP12 | WLCSP12, wafer level chip scale package; 12 terminals, 0.5 mm pitch, 2.06 mm x 2.018 mm x 0.6 mm body | 2019-06-11 | |
SOT2000-1 | FM8 | FM8, flange mount package, 8 terminals, 1.02 mm pitch, 10.26 mm x 10.26 mm x 3.81 mm body | 2019-06-12 | |
SOT2002-1 | FM8F | FM8F, flange mount package, 8 terminals, 5.16 mm pitch, 9.6 mm x 20.395 mm x 3.965 mm body | 2019-04-18 | |
SOT2002-2 | FM8F | FM8F, flange mount package, 8 terminals, 5.16 mm pitch, 9.6 mm x 20.395 mm x 4.25 mm body | 2019-04-18 | |
SOT2003-1 | FOWLP249 | FOWLP249, fan-out wafer-level package, 249 terminals, 0.4 mm pitch, 7 mm x 7 mm x 0.725 mm body | 2020-06-17 | |
SOT2005-1 | FM6F | FM6F, flange mount package, 6 terminals, 20.4 mm x 9.8 mm x 4.26 mm body | 2019-04-18 | |
SOT2007-1 | LBGA388 | LBGA388, low profile ball grid array package, 388 terminals, 0.56 mm minimum pitch, 15 mm x 15 mm x 1.55 mm body, bare die | 2020-07-07 | |
SOT2007-2 | FBGA388 | FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm x 1.96 mm body, customized array | 2019-05-01 | |
SOT2008-1 | HLFLGA12 | thermal enhanced low profile fine-pitch land grid array package, 13 terminals, 0.5 mm pitch, 2.2 mm x 2.2 mm x 0.68 mm body | 2020-02-05 | |
SOT2011-1 | WLCSP36 | WLCSP36, wafer level chip scale package, 36 terminals, 0.3 mm pitch, 1.895 mm x 1.895 mm x 0.38 mm body (backside coating included) | 2019-02-25 | |
SOT2012-1 | LFBGA164 | LFBGA164, low profile fine-pitch ball grid array package, 164 terminals, 0.5 mm pitch, 8 mm x 8 mm x 1.146 mm body | 2019-10-03 | |
SOT2013-2 | HWFLGA16 | HWFLGA16, thermal enhanced very-very thin fine-pitch land grid array package, 16 terminals, 0.4 mm pitch, 2 mm x 2 mm x 0.64 mm body | 2020-05-20 | |
SOT2014-1 | SIL5 | SIL5, single in-line package, 5 terminals, 1.27 mm pitch, 8.0 mm x 4.65 mm x 2.65 mm body | 2019-04-01 | |
SOT2015-1 | X2SON8 | X2SON8, super thin small outline; no leads, 8 terminals, 0.35 mm pitch, 1.35 mm x 1 mm x 0.32 mm body | MO-287(JEDEC | 2019-06-11 |
SOT2016-1 | WFBGA165 | WFBGA165, very very thin profile fine pitch ball grid array package; 165 terminals; 0.5 mm pitch; 7.5 mm x 7.5 mm x 0.62 mm body | 2020-06-19 | |
SOT2017-1 | X2SON4 | X2SON4, super thin small outline; no leads, 4 terminals, 0.65 mm pitch, 1.6 mm x 1.6 mm x 0.32 mm body | MO-287(JEDEC | 2019-04-04 |
SOT2018-1 | HLLGA31 | HLLGA31, thermal enhanced low profile land grid array package, 31 terminals, 1 mm pitch, 10 mm x 8 mm x 1.365 mm body | 2019-03-26 | |
SOT2019-1 | WLCSP114 | WLCSP114, wafer level chip scale package, 114 terminals, 0.35 mm pitch, 4.235 mm x 4.235 mm x 0.49 mm body (backside coating included) | 2020-04-24 | |
SOT2021-1 | BGA548 | BGA548, ball grid array package, 548 terminals, 0.5 mm pitch, 15 mm x 15 mm x 1.94 mm body | 2019-05-09 | |
SOT2022-1 | HWFLGA38 | HWFLGA38, thermal enhanced very very thin fine-pitch land grid array package, 38 terminals, 0.35 mm pitch, 4 mm x 3 mm x 0.65 mm body | 2021-03-22 | |
SOT2025-1 | FM6F | FM8F, flange mount package, 6 terminals, 9.14 mm pitch, 32.255 mm x 9.96 mm x 3.81 mm body | 2019-09-19 | |
SOT2026-1 | FBGA957 | FBGA957, fine-pitch ball grid array package; 957 terminals, 0.65 mm pitch, 21 mm x 21 mm x 2.16 mm body | 2019-06-03 | |
SOT2027-1 | FBGA780 | FBGA780, fine-pitch ball grid array package, 780 terminals, 0.65 mm pitch, 19 mm x 19 mm x 2.16 mm body | 2022-09-13 | |
SOT2028-1 | WLCSP48 | WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 3.15 mm x 2.89 mm x 0.38 mm body | 2021-05-28 | |
SOT2031-1 | FBGA576 | FBGA576, fine-pitch ball grid array package, 576 terminals, 0.75 mm pitch, 19 mm x 19 mm x 2.011 mm body | 2019-06-25 | |
SOT2033-1 | WLCSP91 | WLCSP91, wafer level chip scale package, 91 terminals with gold bump, 0.15 mm pitch, 4.425 mm x 4.06 mm x 0.263 mm body | 2019-07-08 | |
SOT2033-2 | WLCSP91 | WLCSP91, wafer level chip scale package, 91 terminals with gold bump, 0.15 mm pitch, 4.425 mm x 4.06 mm x 0.129 mm body | 2019-07-08 | |
SOT2034-1 | WLCSP48 | WLCSP48, wafer level chip scale package, 48 terminals with gold bump, 0.15 mm pitch, 3.931 mm x 2.983 mm x 0.129 mm body | 2019-07-15 | |
SOT2035-1 | WLCSP12 | WLCSP12, wafer level chip scale package, 12 terminals, 0.25 mm pitch, 1.185 mm x 0.935 mm x 0.22 mm body | 2019-10-24 | |
SOT2036-1 | BGA388 | BGA388, ball grid array package, 388 terminals, 0.56 mm pitch, 15 mm x 15 mm x 2.09 mm body | 2019-07-24 | |
SOT2037-1 | FBGA621 | FBGA621, plastic, fine-pitch ball grid array package; 621 balls; 0.8 mm pitch; 21 mm x 21 mm x 2.37 mm body | 2019-08-30 | |
SOT2039-1(SC) | HWQFN32 | HWQFN32, thermal enhanced, very-very thin quad flat package, no leads, step-cut wettable flank, 0.5 mm pitch, 5 mm x 5 mm x 0.68 mm body | 2020-05-13 | |
SOT2039-2(SC) | HWQFN32 | HWQFN32, thermal enhanced, very-very thin quad flat package, no leads, step-cut wettable flank, 0.5 mm pitch, 5 mm x 5 mm x 0.68 mm body | 2021-10-27 | |
SOT2040-1 | HLSON6 | HLSON6, thermal enhanced low profile small outline package, no leads, 6 terminals, 1.3 mm pitch, 4.5 mm x 4.0 mm x 1.2 mm body | 2019-08-01 | |
SOT2041-1 | WLCSP4 | WLCSP4, wafer level chip scale package, 4 terminals; 0.6 mm pitch; 1.015 mm x 1.015 mm x 0.38 mm body (backside coating included) | 2019-08-09 | |
SOT2042-1 | WLCSP9 | WLCSP9, wafer level chip scale package, 9 terminals; 0.3 mm pitch; 1.015 mm x 1.015 mm x 0.38 mm body (backside coating included) | 2019-08-08 | |
SOT2042-2 | WLCSP9 | WLCSP9, wafer level chip-size package, 9 terminals, 0.3 mm pitch, 0.92 mm x 0.92 mm x 0.38 mm body (backside coating included) | 2022-04-28 | |
SOT2044-1 | HUBGA182 | HUBGA182, thermal enhanced ultra thin ball grid array package, 182 terminals, 0.4 mm pitch, 6.1 mm x 6.5 mm x 0.56 mm body | 2019-09-05 | |
SOT2045-1 | HDQFP100 | PQFP-E-100; plastic qual flat package; 100 terminals, 0.65 mm pitch, 10 mm x 10 mm x 1.65 mm body size. | MO-355 C(JEDEC | 2023-05-30 |
SOT2047-1 | LFBGA548 | LFBGA548, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch, 15 mm x 15 mm x 1.331 mm body | 2023-05-11 | |
SOT2048-1 | FCD34 | FCD34, flip chip die, 34 terminals, 0.4 mm pitch, 2.45 mm x 2.87 mm x 0.091 mm body | 2020-05-21 | |
SOT2049-1 | HX2SON6 | HX2SON6, thermal enhanced super thin small outline package, no leads, 6 terminals, 0.4 mm pitch, 1.4 mm x 1.2 mm x 0.3 mm body | MO-288(JEDEC | 2019-11-27 |
SOT205-1 | QFP44 | plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm | 133E01(IEC | 2003-02-25 |
SOT2051-1 | FBGA548 | FBGA548, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch, 15 mm x 15 mm x 1.876 mm body | 2019-10-31 | |
SOT2052-1 | LFBGA485 | LFBGA485, low profile fine pitch ball grid array package, 485 terminals, 0.5 mm pitch, 15 mm x 15 mm x 1.38 mm body | 2020-02-17 | |
SOT2053-1 | HLSON10 | HLSON10, thermal enhanced low profile small outline package, no leads, 10 terminals, 1.7 mm pitch, 7 mm x 10 mm x 1.51 mm body | 2019-11-19 | |
SOT2055-1 | FBGA1150 | FBGA1150, fine pitch ball grid array package,1150 terminals, 0.65 mm pitch, 23 mm x 23 mm x 2.07 mm body | 2021-02-04 | |
SOT2057-1 | WLCSP70 | WLCSP70, wafer level chip scale package, 70 terminals, 0.4 mm pitch, 4.16 mm x 2.96 mm x 0.525 mm body (backside coating included) | 2020-05-20 | |
SOT2060-1 | WLCSP49 | WLCSP49, wafer level chip scale package, 49 terminals, 0.35 mm pitch, 2.56 mm x 2.46 mm x 0.365 mm body (backside coating included) | 2020-04-20 | |
SOT2061-1 | TFLGA486 | TFBGA486, thin fine-pitch ball grid array package, 486 terminals, 0.5 mm pitch, 14 mm x 14 mm x 0.91 mm body | 2021-04-07 | |
SOT2062-1 | VFLGA40 | VFLGA40, very thin fine-pitch land grid array package, 40 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.8 mm body | 2020-07-01 | |
SOT2063-1 | WLCSP12 | WLCSP12, wafer level chip scale package, 12 terminals, 0.35 mm pitch, 1.55 mm x 1.18 mm x 0.455 mm body (backside coating included) | 2021-03-11 | |
SOT2063-2 | WLCSP12 | WLCSP12, wafer level chip scale package, 12 terminals, 0.35 mm pitch, 1.545 mm x 1.26 mm x 0.495 mm body | 2020-09-07 | |
SOT2064-1 | TBGA306 | TBGA306, thin ball grid array package, 306 terminals, 0.5 mm pitch, 11 mm x 11 mm x 0.91 mm body, molded array | 2021-01-22 | |
SOT2066-1 | DHVQFN24 | DHVQFN24, DIL-compatible thermal enhanced very thin quad flat package, no leads, 24 terminals, 0.5 mm pitch, 3 mm x 5 mm x 0.85 mm body | 2020-10-27 | |
SOT2069-1 | WLCSP141 | WLCSP141, wafer level chip scale package, 141 terminals, 0.35 mm pitch, 4.525 mm x 4.525 mm x 0.49 mm body (back side coating included) | 2020-07-13 | |
SOT2073-1 | WLCSP76 | WLCSP76, wafer level chip scale package, 76 terminals, 3.95 mm x 3.565 mm x 0.495 mm body (backside coating included) | 2020-06-10 | |
SOT2074-1 | XQFN12 | XQFN12, extremely thin quad flat package, no leads, 12 terminals, 0.4 mm pitch, 1.75 mm x 2.2 mm x 0.5 mm body | MO-288(JEDEC | 2020-07-17 |
SOT2075-1 | TFBGA56 | TFBGA56, thin fine-pitch ball grid array package, 56 terminals, 0.4 mm pitch, 4 mm x 4 mm x 1.1 mm body | 2021-10-18 | |
SOT2078-1 | VSON6 | VSON6, very thin small outline package, no leads, 6 terminals, 0.5 mm pitch, 1.4 mm x 1.4 mm x 0.85 mm body | 2020-08-26 | |
SOT2084-1 | HWFLGA18 | HWFLGA18, thermal enhanced very-very thin fine-pitched land grid array package, 18 terminals, 0.4 mm pitch, 2.4 mm x 2 mm x 0.64 mm body | 2020-09-10 | |
SOT2084-2 | HWFLGA18 | HWFLGA18, thermal enhanced very-very thin fine-pitched land grid array package, 18 terminals, 0.4 mm pitch, 2.4 mm x 2 mm x 0.64 mm body | 2022-08-17 | |
SOT2086-1 | HVQFN116 | HVQFN116, thermal enhanced very thin quad flat package, no leads, 116 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body | 2022-04-03 | |
SOT2086-2 | HVQFN116 | HVQFN116 thermal enhanced very thin quad flat package, no leads, 116 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body | 2023-04-27 | |
SOT2088-1(SC) | HVQFN40 | HWQFN, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks, 40 terminals, 0.4 mm pitch, 5.0 mm x 5.0 mm x 0.68 mm body | 2023-10-05 | |
SOT2089-1(SC) | HWQFN28 | HWQFN28, thermal enhanced very-very thin quad flat package, no leads, step-cut wettable flank, 0.5 mm pitch, 4.5 mm x 4.5 mm x 0.68 mm body | 2021-06-25 | |
SOT2090-1(SC) | HWQFN24 | HWQFN24, thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.68 mm body | 2023-08-01 | |
SOT2091-1 | BGA360 | BGA360, ball grid array package, 360 terminals, 1 mm pitch, 23 mm x 23 mm x 2.25 mm body | 2020-10-05 | |
SOT2092-1 | FBGA529 | FBGA529, fine pitch ball grid array package, 529 terminals, 0.8 mm pitch, 19 mm x 19 mm x 1.64 mm body | 2020-10-05 | |
SOT2093-1 | HUFLGA32 | HUFLGA32, thermal enhanced ultra-thin, fine-pitched land grid array package, 32 terminals, 0.5 mm pitch, 4.5 mm x 4.5 mm x 0.46 mm body | 2020-11-09 | |
SOT2095-1 | FBGA594 | FBGA594, fine pitch ball grid array package, 594 terminals, 0.8 mm pitch, 21 mm x 21 mm x 1.63 mm body | 2021-12-22 | |
SOT2100-1 | WLCSP83 | WLCSP83, wafer level chip scale package, 83 terminals, 0.4 mm pitch, 4.6 mm x 4.2 mm x 0.75 mm body | 2020-09-16 | |
SOT2101-1 | HVQFN76 | HVQFN76, thermal enhanced very thin quad flat package, no leads, 76 terminals, 0.4 mm pitch, 9 mm x 9 mm x 0.85 mm body | 2014-03-13 | |
SOT2102-1 | HVQFN72 | HVQFN72, thermal enhanced very thin quad flat package, no leads, 72 terminals, 0.5 mm pitch, 10 mm x 10 mm x 0.85 mm body | 2014-03-13 | |
SOT2103-1 | HVQFN92 | HVQFN92, thermal enhanced very thin quad flat package, no leads, 92 terminals, 0.5 mm pitch, 9.5 mm x 11 mm x 0.85 mm body | 2012-03-06 | |
SOT2104-1 | HVQFN124 | HVQFN124, thermal enhanced very thin quad flat package, no leads, 124 terminals, 0.55 mm pitch, 11 mm x 11 mm x 0.85 mm body | 2014-08-21 | |
SOT2104-2 | HVQFN124 | HVQFN124, thermal enhanced very thin quad flat package, no leads, 124 terminals, 0.55 mm pitch, 11 mm x 11 mm x 0.85 mm body | 2021-03-08 | |
SOT2106-1 | HVQFN98 | HVQFN98, thermal enhanced very thin quad flat package, no leads, 98 terminals, 0.4 mm pitch, 9 mm x 9 mm x 0.85 mm body | 2016-09-19 | |
SOT2107-1 | HVQFN68 | HVQFN68, thermal enhanced very thin quad flat package, no leads, 68 terminals, 0.4 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2020-04-06 | |
SOT2109-1 | WLCSP74 | WLCSP74, wafer level chip scale package, 74 terminals, 0.4 mm pitch, 3.46 mm x 4.675 mm x 0.76 mm body | 2020-10-07 | |
SOT2110-1 | LFBGA231 | LFBGA231, low profile fine pitch ball grid array package, 231 terminals, 0.65 mm pitch, 12 mm x 12 mm x 1.2 mm body | 2011-01-28 | |
SOT2111-1 | HVQFN148 | HVQFN148, thermal enhanced very thin quad flat package, no leads, 148 terminals, 0.5 mm pitch, 11 mm x 11 mm x 0.85 mm body | 2021-04-20 | |
SOT2111-2 | HVQFN148 | HVQFN148, thermal enhanced very thin quad flat package, no leads, 148 terminals, 0.5 mm pitch, 11 mm x 11 mm x 0.85 mm body | 2021-07-26 | |
SOT2112-1 | HVQFN114 | HVQFN114, thermal enhanced very thin quad flat package, no leads, 114 terminals, 0.5 mm pitch, 10 mm x 10 mm x 0.85 mm body | 2020-04-08 | |
SOT2113-1 | VFBGA120 | VFBGA120, very thin fine pitch ball grid array package, 120 terminals, 0.5 mm pitch, 7 mm x 7 mm x 0.87 mm body | 2020-10-12 | |
SOT2114-1(D) | HVQFN68 | HVQFN68, thermal enhanced very thin quad flat package, no leads, 68 terminals, 0.4 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2016-09-08 | |
SOT2114-2 | HVQFN68 | HVQFN68, thermal enhanced very thin quad flat package, no leads, 68 terminals, 0.4 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2020-07-06 | |
SOT2119-1 | HVQFN68 | HVQFN68, thermal enhanced very thin quad flat package, no leads, 68 terminals, 0.4 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2020-06-16 | |
SOT2120-1 | LFBGA358 | LFBGA358, low-profile, fine-pitch ball grid array package, 358 terminals, 0.65 mm pitch, 15 mm x 15 mm x 1.21 mm body | 2017-03-15 | |
SOT2122-1 | HVQFN124 | HVQFN124, thermal enhanced very thin quad flat package, no leads, 124 terminals, 0.4 mm pitch, 11.8 mm x 11 mm x 0.8 mm body | 2016-01-04 | |
SOT2123-1 | LFBGA292 | LFBGA292, low profile, fine-pitch ball grid array package, 292 terminals, 0.8 mm pitch, 17 mm x 17 mm x 1.24 mm body | 2014-11-06 | |
SOT2124-1 | HVQFN88 | HVQFN88, thermal enhanced very thin quad flat package, no leads, 88 terminals, 0.4 mm pitch, 10 mm x 10 mm x 0.85 mm body | 2020-07-08 | |
SOT2125-1 | WLCSP79 | WLCSP79, wafer level chip scale package, 79 terminals, 0.35 mm pitch, 3.58 mm x 3.185 mm x 0.37 mm body (backside coating included) | 2021-03-31 | |
SOT2126-1 | WLCSP140 | WLCSP140, wafer level chip-size package; 140 terminals; 0.3 mm pitch; 4.385 mm x 4.96 mm x 0.455 mm body | 2022-01-13 | |
SOT2127-1 | WLCSP16 | WLCSP16, wafer level chip scale package, 16 terminals, 0.35 mm pitch, 1.41 mm x 1.41 mm x 0.49 mm body (backside coating included) | 2021-01-12 | |
SOT2128-1 | LFBGA309 | LFBGA309, low profile fine-pitched ball grid array package, 309 terminals, 0.5 mm pitch, molded array, 10.6 mm x 11.3 mm x 1.13 mm body | 2023-06-21 | |
SOT2130-1 | FBGA400 | LFBGA400, low profile fine-pitch ball grid array; 400 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.63 mm body | 2021-12-22 | |
SOT2134-1 | LFBGA144, low-profile fine-pitch ball grid array package, 144 terminals, 0.8 mm pitch, 10 mm x 10 mm x 1.37 mm body | 2021-03-30 | ||
SOT2135-1 | WLCSP103 | WLCSP103, wafer level chip scale package, 103 terminals, 0.33 mm pitch, 4.05 mm x 3.16 mm x 0.38 mm body | 2021-08-20 | |
SOT2139-1 | LFBGA169 | LFBGA169, low-profile fine-pitch ball grid array package, 169 terminals, 0.65 mm pitch, 9 mm x 9 mm x 1.3 mm body | 2021-04-28 | |
SOT2140-1 | VFBGA486 | VFBGA486, very thin fine-pitch ball grid array package, 486 terminals, 0.5 mm pitch, 14 mm x 14 mm x 0.725 mm body | 2021-05-04 | |
SOT2141-1 | VFBGA486 | VFBGA486, very thin fine-pitch ball grid array package, 486 terminals, 0.5 mm pitch, 14 mm x 14 mm x 0.775 mm body | 2021-12-03 | |
SOT2142-1 | VFBGA486 | VFBGA486, very thin, fine-pitch ball grid array package, 486 terminals, 0.5 mm pitch, 14 mm x 14 mm x 0.825 mm body | 2021-05-04 | |
SOT2143-1 | HVSON12 | HVSON12, plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 3 mm x 3 mm x 0.85 mm | 2021-05-25 | |
SOT2146-1 | WLCSP70 | WLCSP70, wafer level chip scale package, 70 terminals, 0.35 mm pitch, 3.64 mm x 3.16 mm x 0.49 mm body (backside coating included) | 2021-06-01 | |
SOT2147-1 | VFBGA512 | VFBGA512, very thin fine-pitch ball grid array package, 512 terminals, 0.4 mm pitch, 9.4 mm x 9.4 mm x 0.811 mm body | 2021-06-15 | |
SOT2148-1 | FBGA975 | FBGA975, fine pitch ball grid array package, 975 terminals, 0.8 mm pitch, 27 mm x 27 mm x 1.63 mm body | 2021-12-22 | |
SOT2150-1 | FCD2 | FCD2, flip chip die, 2 terminals, 0.51 mm pitch, 0.808 mm x 0.528 mm x 0.408 mm body | 2021-06-18 | |
SOT2151-1 | LFBGA169 | LFBGA169, low profile fine-pitch ball grid array package, 169 terminals, 0.8 mm pitch, 11 mm x 11 mm x 1.37 mm body | 2021-06-23 | |
SOT2152-1 | WLCSP151 | WLCSP151 wafer level chip-size package, 151 terminals, 0.3 mm pitch, 5.165 mm x 4.68 mm x 0.455 mm body (backside coating included) | 2023-05-04 | |
SOT2153-1 | TFBGA145 | TFBGA145 very thin fine-pitch ball grid array, 145 terminals, 0.5 mm pitch, 8 mm x 8 mm x 1.07 mm body | 2023-04-27 | |
SOT2154-1(SC) | HQFN16 | HQFN16, thermal enhanced quad flat package, no leads, 16 terminals, 1.0 mm pitch, 6 mm x 6 mm x 1.9 mm body | 2021-06-07 | |
SOT2155-1 | VFBGA198 | VFBGA198, very thin fine-pitch ball grid array package, 198 terminals, 0.5 mm pitch, 9.0 mm x 9.35 mm x 0.834 mm body | 2022-06-01 | |
SOT2156-1 | FCD42 | FCD42, flip chip die, 42 terminals; 2.1 mm x 1.7 mm x 0.225 mm body | 2021-08-06 | |
SOT2159-1 | HX2SON4 | HX2SON4, thermal enhanced super thin small outline package, no leads, 4 terminals, 0.65 mm pitch, 1.6 mm x 1.6 mm x 0.32 mm body | 2021-11-29 | |
SOT2162-1 | VFBGA59 | VFBGA59, very thin fine-pitch ball grid array package, 59 terminals, 0.4 mm pitch, 4 mm x 4 mm x 0.77 mm body | 2022-09-02 | |
SOT2163-1 | DHVQFN18 | DHVQFN18: DIL-compatible thermal enhanced very thin quad flatpack; no leads;18 terminals; body 3.0 x 4.5 x 0.85 mm | 2022-12-06 | |
SOT2165-1 | TFBGA306 | TFBGA306, thin fine-pitch ball grid array package, 306 terminals, 0.5 mm pitch, 11 mm x 11 mm x 1.258 mm body | 2021-05-11 | |
SOT2167-1 | LFBGA306 | LFBGA306, low profile fine-pitched ball grid array package, 306 terminals, 0.5 mm pitch, 11 mm x 11 mm x 1.124 mm body | 2021-08-11 | |
SOT2167-2 | LFBGA306 | LFBGA306, low profile fine-pitched ball grid array package, 306 terminals, 0.5 mm pitch, 11 mm x 11 mm x 1.124 mm body | 2022-10-03 | |
SOT2168-1 | HWFLGA60 | HWFLGA60, thermal enhanced very very thin finepitch land grid array package, 0.4 mm pitch, 9.05 mm x 4.05 mm x 0.63 mm body | 2022-10-31 | |
SOT2169-1 | HWFLGA36 | HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 4.45 mm x 3.65 mm x 0.63 mm body | 2021-12-15 | |
SOT2171-1 | HLGA25 | HLGA25, thermal enhanced land grid array package, 25 terminals, 2.5 mm pitch, 20 mm x 16 mm x 1.947 mm body | 2021-11-29 | |
SOT2172-1 | VFBGA184 | VFBGA184, very thin fine-pitch ball grid array package, 184 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.86 mm body | 2021-12-21 | |
SOT2174-1 | HUFLGA16, thermal enhanced very very thin finepitch land grid array package, 0.4 mm pitch, 2 mm x 2 mm x 0.54 mm body | 2022-01-27 | ||
SOT2197-1(SC) | DLQFN12 | DLQFN12; Depopulated Low profile quad flat package, no leads; 12 terminals; 0.65 mm pitch; 3 mm x 3 mm x 1.25 mm body | 2024-01-17 | |
SOT222-1 | DIP24 | plastic, dual in-line package; 24 leads; 2.54 mm pitch, 31.7 mm x 6.5 mm x 4.7 mm body | MS-001(JEDEC | 2003-03-12 |
SOT2228-1(D) | HQFN28 | HQFN28, thermal enhanced quad flat package, no leads, 0.1 dimple wettable flank, 28 terminals, 0.8 mm pitch, 8 mm x 6 mm x 1.9 mm body | 2023-12-15 | |
SOT2228-2(D) | HQFN28 | HQFN28, thermal enhanced quad flat package, no leads, 0.1 dimple wettable flank, 28 terminals, 0.8 mm pitch, 8 mm x 6 mm x 1.9 mm body | 2023-12-18 | |
SOT223 | SC-73 | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | SC-73(EIAJ | 2006-03-16 |
SOT223-1 | SO4 | plastic small outline package; 4 leads; body width 3.5 mm | TO-261(JEDEC | 2003-02-19 |
SOT226 | I2PAK | plastic, single-ended package (I2PAK); 3 terminals; 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body | TO-262(JEDEC | 2009-08-25 |
SOT226A | I2PAK | plastic single-ended package (I2PAK); TO-262 | TO-262(JEDEC | 2009-08-25 |
SOT226B | I2PAK | plastic, single-ended package (I2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.5 mm body | 2016-06-08 | |
SOT226C | I2PAK | plastic, single-ended package (I2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.5 mm body | 2016-08-08 | |
SOT23 | TO-236AB | plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body | TO-236AB(JEDEC | 2006-03-16 |
SOT232-1 | SDIP32 | plastic shrink dual in-line package; 32 leads (400 mil) | 2003-02-13 | |
SOT232-2 | SDIP32 | SDIP32, plastic, shrink dual in-line package; 32 terminals; 1.778 mm pitch; 9.9 mm x 28.1 mm x 4.9 mm body | E-PDIP-T32(JEDEC | 2017-06-11 |
SOT234-1 | SDIP24 | plastic shrink dual in-line package; 24 leads (400 mil) | 2003-02-13 | |
SOT238-2 | PLCC52 | plastic leaded chip carrier; 52 leads | EDR-7319(EIAJ);MS-018(JEDEC);112E11(IEC | 2001-11-15 |
SOT238-3 | PLCC52 | plastic leaded chip carrier; 52 leads; pedestal, 1.27 mm pitch, 19.1 mm x 19.1 mm x 4.38 mm body | MO-047(JEDEC);112E11(IEC | 2001-11-15 |
SOT238-4 | PLCC52 | PLCC52, plastic leaded chip carrier; 52 terminals; 1.27 mm pitch; 19.12 mm x 19.12 mm x 4.57 mm body | PQCC-J52(JEDEC | 2017-06-11 |
SOT240-1 | DIP48 | plastic dual in-line package; 48 leads (600 mil) | MS-011(JEDEC | 2003-02-13 |
SOT243-1 | DBS17P | plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) | 2003-03-12 | |
SOT243-3 | DBS17P | plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) | 2003-03-12 | |
SOT247-1 | SDIP52 | plastic shrink dual in-line package; 52 leads (600 mil) | MS-020(JEDEC | 2003-02-13 |
SOT257-2 | CPGA68 | ceramic pin grid array package; 68 pins; body 27.9 x 27.9 x 2.4 mm | 2002-11-01 | |
SOT258-2 | CPGA84 | ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm | 2002-11-01 | |
SOT259-2 | CPGA120 | ceramic pin grid array package; 120 pins; body 33.5 x 33.5 x 2.6 mm | 2002-11-01 | |
SOT261-2 | PLCC28 | plastic, leaded chip carrier; 28 leads; 1.27 mm pitch; 11.48 mm x 11.48 mm x 4.38 mm body | EDR-7319(EIAJ);MS-018(JEDEC);112E08(IEC | 2001-11-15 |
SOT261-3 | PLCC28 | plastic leaded chip carrier; 28 leads; pedestal, 1.27 mm pitch, 11.5 mm x 11.5 mm x 4.38 mm body | MO-047(JEDEC);112E08(IEC | 2001-11-15 |
SOT263 | TO-220-5 | plastic, single-ended package; 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body | 5-lead TO-220(JEDEC | 2006-02-14 |
SOT263-01 | TO-220-5 option | plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option | 5-lead TO-220(JEDEC | 2006-02-14 |
SOT263B | TO-220-5 | plastic, single-ended package (heatsink mounted, 1 mounting hole); 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body | 5-lead TO-220(JEDEC | 2001-01-11 |
SOT263B-01 | TO-220-5 option | plastic, single-ended package; 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body | 5-lead TO-220(JEDEC | 2001-01-11 |
SOT266-1 | SSOP20 | plastic shrink small outline package; 20 leads; body width 4.4 mm | MO-152(JEDEC | 2003-02-19 |
SOT27-1 | DIP14 | plastic, dual in-line package; 14 leads; 2.54 mm pitch; 19 mm x 6.35 mm x 4.2 mm body | SC-501-14(EIAJ);MO-001(JEDEC);050G04(IEC | 2003-02-13 |
SOT270-1 | SDIP42 | plastic shrink dual in-line package; 42 leads (600 mil) | MS-020(JEDEC | 2003-02-13 |
SOT270-3 | SDIP42 | SDIP42, plastic, shrink dual in-line package; 42 terminals; 1.778 mm pitch; 13.97 mm x 36.83 mm x 5.08 mm body | E-PDIP-T42(JEDEC | 2017-06-11 |
SOT274-1 | SDIP64 | plastic shrink dual in-line package; 64 leads (750 mil) | MS-021(JEDEC | 2003-02-13 |
SOT274-2 | SDIP64 | plastic shrink dual in-line package; 64 leads (750 mil); face down | MS-021(JEDEC | 2006-02-24 |
SOT281 | TO-220 | plastic single-ended package; 5-lead low-profile TO-220 | 1997-06-11 | |
SOT287-1 | SO32 | plastic small outline package; 32 leads; body width 7.5 mm | MO-119(JEDEC | 2003-02-19 |
SOT307-2 | QFP44 | plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm | 2003-02-25 | |
SOT310-1 | QFP80 | plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 20 x 3.0 mm | MS-022(JEDEC);112E08(IEC | 2003-02-25 |
SOT313-2 | LQFP48 | plastic, low profile quad flat package; 48 leads; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026(JEDEC);136E05(IEC | 2003-02-25 |
SOT313-3 | LQFP48 | LQFP48, plastic, low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | L-PQFP-G48(JEDEC | 2017-06-11 |
SOT314-2 | LQFP64 | plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm | MS-026(JEDEC);136E10(IEC | 2003-02-25 |
SOT315-1 | LQFP80 | plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm | MS-026(JEDEC | 2003-02-25 |
SOT315-2 | LQFP80 | LQFP80, plastic, low profile quad flat package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1.6 mm body | FL-PQFP-G80(JEDEC | 2016-07-12 |
SOT316-1 | SQFP208 | plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height | MS-029(JEDEC | 2003-02-25 |
SOT317-1 | QFP100 | plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height | MO-112(JEDEC | 2003-02-25 |
SOT317-2 | QFP100 | plastic quad flat package; 100 leads (lead length 1.95 mm); 0.65 mm pitch, 14 mm x 20 mm x 2.8 mm body | MO-112(JEDEC | 2003-02-25 |
SOT317-3 | QFP100 | plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm | MO-112(JEDEC | 2003-02-25 |
SOT318-1 | QFP80 | plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height | MO-112(JEDEC | 2003-02-25 |
SOT318-2 | QFP80 | plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm | MO-112(JEDEC | 2003-02-25 |
SOT318-5 | QFP80 | plastic quad flat package; 80 leads (lead length 1.95 mm; slope angle 60 deg); body 14 x 20 x 2.8 mm | 2003-02-25 | |
SOT319-2 | QFP64 | plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm | MO-112(JEDEC | 2003-02-25 |
SOT32 | TO-126 | plastic single-ended leaded (through hole) package; mountable to heatsink, 1 mounting hole; 3 leads | TO-126(JEDEC | 1997-03-04 |
SOT320-2 | QFP128 | plastic quad flat package; 128 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height | MS-022(JEDEC);134E13(IEC | 2003-02-25 |
SOT320-3 | QFP128 | plastic quad flat package; 128 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg | MO-112(JEDEC | 2003-02-19 |
SOT322-1 | QFP160 | plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height | MO-112(JEDEC | 2003-02-25 |
SOT322-2 | QFP160 | plastic quad flat package; 160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height | MS-022(JEDEC);135E12(IEC | 2003-02-25 |
SOT322-3 | QFP160 | plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg | MO-112(JEDEC | 2004-09-13 |
SOT322-4 | QFP160 | QFP160, plastic, quad flat package; 160 terminals; 0.65 mm pitch; 28 mm x 28 mm x 3.3 mm body | PQFP-G160(JEDEC | 2017-06-11 |
SOT323 | SC-70 | plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | SC-70(EIAJ | 2006-03-16 |
SOT334-2 | SQFP240 | plastic shrink quad flat package; 240 leads (lead length 1.3 mm); body 32 x 32 x 3.4 mm; high stand-off height | MS-029(JEDEC | 2003-05-21 |
SOT337-1 | SSOP14 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | MO-150(JEDEC | 2003-02-19 |
SOT338-1 | SSOP16 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | MO-150(JEDEC | 2003-02-19 |
SOT338-2 | SSOP16 | SSOP16, plastic, shrink small outline package; 16 terminals; 0.65 mm pitch; 5.3 mm x 5.45 mm x 2 mm body | 2017-06-11 | |
SOT339-1 | SSOP20 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | MO-150(JEDEC | 2003-02-19 |
SOT339-2 | SSOP20 | SSOP20, plastic, shrink small outline package; 20 terminals; 0.65 mm pitch; 5.3 mm x 7.2 mm x 1.8 mm body | 2017-06-11 | |
SOT340-1 | SSOP24 | plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body | MO-150(JEDEC | 2003-02-19 |
SOT341-1 | SSOP28 | plastic, shrink small outline package; 28 leads; 0.65 mm pitch; 10.2 mm x 5.3 mm x 2 mm body | MO-150(JEDEC | 2003-02-19 |
SOT343F | DFP4 | Plastic surface-mounted flat pack package; 4 leads | 2006-03-16 | |
SOT343N | SO4 | plastic surface-mounted package; 4 leads | 2006-03-16 | |
SOT343R | CMPAK-4 | plastic surface-mounted package; reverse pinning; 4 leads | 2006-03-16 | |
SOT346 | SMT3; MPAK | plastic, surface-mounted package; 3 leads; 1.9 mm pitch; 2.9 mm x 1.5 mm x 1.15 mm body | SC-59A(EIAJ);TO-236(JEDEC | 2006-03-16 |
SOT349-2 | QFP120 | plastic quad flat package; 120 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height | MS-022(JEDEC);134E11(IEC | 2003-02-25 |
SOT352-1 | RBS9MPF | plastic rectangular-bent single in-line medium power package with fin; 9 leads | 2003-03-12 | |
SOT353 | SOT353 | plastic, surface-mounted package; 5 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | SC-88A(EIAJ | 2006-03-16 |
SOT353-1 | TSSOP5 | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | SC-88A(EIAJ);MO-203(JEDEC | 2003-02-19 |
SOT354-1 | SMS9P | plastic surface-mounted single in-line power package; 9 leads | 2006-03-16 | |
SOT355-1 | TSSOP24 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body | MO-153(JEDEC | 2003-02-19 |
SOT357-1 | TQFP64 | plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm | MS-026(JEDEC);137E10(IEC | 2002-03-14 |
SOT358-1 | LQFP32 | plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm | MS-026(JEDEC);136E03(IEC | 2005-11-09 |
SOT358-3 | LQFP32 | LQFP32, plastic, low profile quad flat package; 32 terminals; 0.8 mm pitch; 7 mm x 7 mm x 1.4 mm body | L-PQFP-G32(JEDEC | 2017-06-11 |
SOT360-1 | TSSOP20 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | MO-153(JEDEC | 2003-02-19 |
SOT360-2 | TSSOP20 | TSSOP20, plastic, thin shrink small outline package; 20 terminals; 0.65 mm pitch; 4.4 mm x 6.5 mm x 1.05 mm body | TS-PDSO-G20(JEDEC | 2017-06-11 |
SOT361-1 | TSSOP28 | plastic thin shrink small outline package; 28 leads; body width 4.4 mm | MO-153(JEDEC | 2003-02-19 |
SOT361-2 | TSSOP28 | TSSOP28, plastic, thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 0.95 mm body | MO-153 AE(JEDEC | 2016-03-08 |
SOT362-1 | TSSOP48 | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | MO-153(JEDEC | 2003-02-19 |
SOT363 | TSSOP6 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | SC-88(EIAJ | 2006-03-16 |
SOT364-1 | TSSOP56 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | MO-153(JEDEC | 2003-02-19 |
SOT369-1 | SSOP16 | plastic shrink small outline package; 16 leads; body width 4.4 mm | MO-152(JEDEC | 2003-02-19 |
SOT370-1 | SSOP48 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | MO-118(JEDEC | 2003-02-19 |
SOT371-1 | SSOP56 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | MO-118(JEDEC | 2003-02-18 |
SOT375-1 | TQFP80 | plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm | MS-026(JEDEC | 2003-02-25 |
SOT376-1 | TQFP44 | plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm | MS-026(JEDEC);137E08(IEC | 2002-03-14 |
SOT379-1 | QFP52 | plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2 mm | MS-022(JEDEC);135E04(IEC | 2003-02-25 |
SOT379-2 | QFP52 | plastic, quad flat package; 52 leads; 0.65 mm pitch; 10 mm x 10 mm x 2 mm body | MS-022(JEDEC | 2003-02-25 |
SOT38-1 | DIP16 | plastic dual in-line package; 16 leads (300 mil); long body | SC-503-16(EIAJ);MO-001(JEDEC);050G09(IEC | 2003-02-13 |
SOT38-10 | DIP16 | DIP16, plastic, dual in-line package; 16 terminals; 2.54 mm pitch; 6.6 mm x 19.18 mm x 4.44 mm body | E-PDIP-T16(JEDEC | 2017-06-11 |
SOT38-4 | DIP16 | plastic, dual in-line package; 16 leads; 2.54 mm pitch; 19 mm x 6.35 mm x 4.2 mm body | 2003-02-13 | |
SOT380-1 | PLCC20 | plastic, leaded chip carrier; 20 leads; 1.27 mm pitch; 9 mm x 9 mm x 4.5 mm body | EDR-7319(EIAJ);MS-018(JEDEC);112E04(IEC | 2001-11-20 |
SOT385-1 | PLLMC | plastic leadless module carrier | 2003-09-23 | |
SOT386-1 | TQFP100 | plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm | MS-026(JEDEC);137E20(IEC | 2003-02-25 |
SOT387-3 | SQFP128 | plastic shrink quad flat package;128 leads (lead length 1.6 mm); body 14 x 20 x 2.72 mm | 2003-02-25 | |
SOT389-1 | LQFP44 | plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm | MS-026(JEDEC);136E08(IEC | 2002-06-07 |
SOT389-2 | LQFP44 | LQFP44, plastic, low profile quad flat package; 44 terminals; 0.8 mm pitch; 10 mm x 10 mm x 1.4 mm body | L-PQFP-G44(JEDEC | 2017-06-11 |
SOT391B | CDFM2 | flangeless ceramic package; 2 leads | 1997-05-29 | |
SOT393-1 | QFP64 | plastic, quad flat package; 64 leads; 0.8 mm pitch; 14 mm x 14 mm x 2.7 mm body | MS-022(JEDEC);134E07(IEC | 2003-02-20 |
SOT397-1 | HSOP20 | plastic, heatsink small outline package; 20 leads, 1.27 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body | 2003-07-23 | |
SOT397-2 | HSOP20 | HSOP20, plastic, thermal enhanced small outline package; 20 terminals; 1.27 mm pitch; 11 mm x 15.9 mm x 3 mm body | PDSO-G20(JEDEC | 2017-06-11 |
SOT398-1 | HDIP18 | plastic heat-dissipating dual in-line package; 18 leads | 2003-02-13 | |
SOT399 | TOP-3D | plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads | 1998-11-06 | |
SOT400-1 | SDIP56 | plastic shrink dual in-line package; 56 leads (600 mil) | 2003-02-13 | |
SOT400-3 | SDIP56 | SDIP56, plastic, shrink dual in-line package; 56 terminals; 1.778 mm pitch; 13.97 mm x 52.08 mm x 5.08 mm body | E-PDIP-T56(JEDEC | 2017-06-11 |
SOT401-1 | LQFP32 | plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm | MS-026(JEDEC);136E01(IEC | 2003-02-20 |
SOT401-2 | LQFP32 | LQFP32, plastic, low profile quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1.4 mm body | FL-PQFP-G32(JEDEC | 2017-06-11 |
SOT402-1 | TSSOP14 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | MO-153(JEDEC | 2003-02-18 |
SOT403-1 | TSSOP16 | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch, 5 mm x 4.4 mm x 1.1 mm body | MO-153(JEDEC | 2019-12-10 |
SOT403-2 | TSSOP16 | TSSOP16, plastic, thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body | TS-PDSO-G14(JEDEC | 2017-06-11 |
SOT403-3 | TSSOP16 | TSSOP16, plastic, thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body | TS-PDSO-G16(JEDEC | 2017-06-11 |
SOT404 | D2PAK | plastic, single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body | 2013-02-25 | |
SOT404A | D2PAK | plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body | 2013-03-12 | |
SOT407-1 | LQFP100 | LQFP100, plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body | MS-026(JEDEC);136E20(IEC | 2003-02-20 |
SOT407-2 | LQFP100 | LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body | FL-PQFP-G100(JEDEC | 2017-06-11 |
SOT407-3 | LQFP100 | LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.7 mm body | FL-PQFP-G100(JEDEC | 2017-06-11 |
SOT409A1 | CDIP8 | ceramic surface mounted package; 8 leads | 2001-03-01 | |
SOT409B1 | CDIP8 | ceramic surface mounted package; 8 leads | 1998-01-27 | |
SOT411-1 | DBS23P | plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) | 2002-04-24 | |
SOT411-2 | DBS23P | plastic DIL-bent-SIL power package; 23 leads (lead length 12 mm) | 2002-04-24 | |
SOT414-1 | LQFP64 | plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm | MS-026(JEDEC);136E06(IEC | 2003-02-20 |
SOT416 | SC-75 | plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 0.75 mm x 0.9 mm body | SC-75(EIAJ | 2013-06-07 |
SOT418-2 | HSOP20 | plastic, heatsink small outline package; 20 leads; low stand-off height | 2003-07-23 | |
SOT418-3 | HSOP20 | plastic, heatsink small outline package; 20 leads; low stand-off height, 1.27 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body | 2003-07-23 | |
SOT418-4 | HSOP20 | plastic, heatsink small outline package; 20 leads; low stand-off height | 2005-03-10 | |
SOT420-1 | LQFP128 | plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm | MS-026(JEDEC | 2003-02-20 |
SOT420-2 | LQFP128 | LQFP128, plastic, low profile quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1.4 mm body | FL-PQFP-G128(JEDEC | 2017-06-11 |
SOT425-1 | LQFP128 | plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm | MS-026(JEDEC);136E28(IEC | 2003-02-20 |
SOT425-2 | LQFP128 | LQFP128, plastic, low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body | FLR-PQFPG128(JEDEC | 2017-06-11 |
SOT426 | D2PAK | plastic, single-ended surface-mounted package (D2PAK); 5 leads; 1.7 mm pitch; 11 mm x 10 mm x 4.3 mm body | 2006-03-16 | |
SOT427 | D2PAK-7 | plastic, single-ended surface-mounted package (D2PAK-7); 7 leads; 1.27 mm pitch; 11 mm x 10 mm x 4.3 mm body | 2006-03-16 | |
SOT428 | DPAK | plastic, single-ended surface-mounted package (DPAK); 3 leads; 2.285 mm pitch; 6 mm x 6.6 mm x 2.3 mm body | SC-63(EIAJ);TO-252(JEDEC | 2014-06-10 |
SOT429 | TO-247 | plastic, single-ended through-hole package; 3 leads; 5.45 mm pitch; 20.45 mm x 15.6 mm x 4.95 mm body | TO-247(JEDEC | 2013-03-25 |
SOT431-1 | HSQFP208 | plastic thermal enhanced shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink | 2003-02-20 | |
SOT435-1 | LQFP160 | plastic low profile quad flat package; 160 leads; body 24 x 24 x 1.4 mm | 2003-02-20 | |
SOT435-2 | LQFP160 | LQFP160, plastic, low profile quad flat package; 160 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | FL-PQFP-G160(JEDEC | 2017-06-11 |
SOT441A | CRDB4 | studless ceramic package; 4 leads | 1999-03-29 | |
SOT442A | CRPM4 | studded ceramic package; 4 leads | 1999-03-29 | |
SOT445A | CDFM2 | flanged hermetic ceramic package; 2 mounting holes; 2 leads | 1999-03-29 | |
SOT449-1 | SOJ40 | plastic small outline package; 40 leads (J-bent); body width 10.16 mm | MS-027(JEDEC | 2003-02-18 |
SOT449-2 | SOJ40 | plastic small outline package; 40 leads (J-bent); body width 10.16 mm | MS-027(JEDEC | 2003-04-08 |
SOT453A | SIP2 | plastic single-ended multi-chip package; magnetized ferrite magnet (3.8 x 2 x 0.8 mm); 4 interconnections; 2 in-line leads | 2000-08-31 | |
SOT453B | SIP2 | plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 2 in-line leads | 2000-08-31 | |
SOT453C | SIP2 | plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads | 2000-08-31 | |
SOT453E | SIP2 | Plastic single-ended multi-chip package; magnetized ferrite magnet (4.25 x 5.2 x 3 mm); 4 interconnections; 2 in-line leads | 2013-11-26+01:00 | |
SOT457 | TSOP6 | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | SC-74(EIAJ | 2006-03-16 |
SOT457-1 | TSOP6 | TSOP6, plastic thin small outline package; 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | SC-74(EIAJ | 2006-03-16 |
SOT459-1 | LQFP208 | plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm | MS-026(JEDEC);136E30(IEC | 2003-02-20 |
SOT459-2 | LQFP208 | LQFP208, plastic, low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body | FL-PQFP-G208(JEDEC | 2017-06-11 |
SOT462-1 | RDBS13P | plastic rectangular-DIL-bent-SIL (reverse bent) power package; 13 leads | 2003-03-12 | |
SOT462-2 | RDBS13P | plastic rectangular-DIL-bent-SIL (reverse bent) power package; 13 leads, 1.7 mm pitch, 23.7 mm x 12 mm x 4.5 mm body | 2003-03-12 | |
SOT464-1 | HSQFP240 | plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm | 1999-11-12 | |
SOT464-2 | HSQFP240 | plastic thermal enhanced shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm; heatsink | 2002-06-19 | |
SOT467A | CDFM2 | flanged ceramic package; 2 mounting holes; 2 leads | 1999-12-28 | |
SOT470-1 | HLQFP100 | plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; heatsink | MS-026(JEDEC | 2003-02-20 |
SOT470-2 | HLQFP100 | plastic thermal enhanced low profile quad flat package; 100 leads; exposed die pad | MS-026(JEDEC | 2013-04-24 |
SOT470-4 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2016-03-18 | |
SOT470-5 | HLQFP100 | plastic, thermal enhanced low profile quad flat package; 100 leads; body 14 mm x 14 mm x 1.6 mm; exposed die pad | 2017-03-03 | |
SOT471-1 | BGA256 | plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm | MS-034(JEDEC);144E(IEC | 2003-01-22 |
SOT472-1 | BGA156 | plastic, ball grid array package; 156 balls; 1 mm pitch; 15 mm x 15 mm x 1.15 mm body | MS-034(JEDEC);144E(IEC | 2003-01-22 |
SOT475-1 | DBS17P | plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) | 2003-03-12 | |
SOT477A | SIP3 | plastic single-ended multi-chip package; magnetized ferrite magnet (3.8 x 2 x 0.8 mm); 4 interconnections; 3 in-line leads | 2000-08-31 | |
SOT477B | SIP3 | plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads | 2000-08-31 | |
SOT477C | SIP3 | plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 3 in-line leads | 2000-08-31 | |
SOT477D | SIP3 | plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 3 in-line leads | 2003-06-11 | |
SOT480-1 | TSSOP48 | plastic, thin shrink small outline package; 48 leads; 0.4 mm pitch; 9.7 mm x 4.4 mm x 0.9 mm body | MO-153(JEDEC | 2003-02-18 |
SOT481-2 | TSSOP56 | plastic, thin shrink small outline package; 56 leads; 0.4 mm pitch; 11.3 mm x 4.4 mm x 1.2 mm body | MO-194(JEDEC | 2001-11-24 |
SOT486-1 | LQFP144 | plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm | MS-026(JEDEC);136E23(IEC | 2003-02-20 |
SOT486-2 | LQFP144 | LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body | FL-PQFP-G144(JEDEC | 2017-06-11 |
SOT487-1 | TSSOP32 | plastic, thin shrink small outline package; 32 leads; 0.65 mm pitch; 11 mm x 6.1 mm x 0.9 mm body | MO-153(JEDEC | 2003-02-18 |
SOT489-1 | BGA292 | plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-22 |
SOT490 | SC-89 | plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 0.85 mm x 0.7 mm body | SC-89(EIAJ | 2006-03-16 |
SOT496-1 | QFP80 | plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm | ED-7311EE(EIAJ);MS-022(JEDEC);135E06(IEC | 2002-10-04 |
SOT500-1 | PLLMC | plastic leadless module carrier package; 35 mm wide tape | 2013-01-16 | |
SOT500-2 | PLLMC | plastic leadless module carrier package; 35 mm wide tape | 2006-05-22 | |
SOT500-3 | PLLMC | plastic leadless module carrier package; 35 mm wide tape | 2007-10-18 | |
SOT500-4 | PLLMC | plastic leadless module carrier package; 35 mm wide tape | 2011-02-18 | |
SOT500-5 | PLLMC | PLLMC, plastic leadless module carrier package; 35 mm wide tape | 2017-08-17 | |
SOT505-1 | TSSOP8 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | 2003-02-18 | |
SOT505-2 | TSSOP | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | 2002-01-16 | |
SOT506-1 | LQFP176 | plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm | MS-026(JEDEC);136E25(IEC | 2003-02-20 |
SOT506-2 | LQFP176 | LQFP176, plastic, low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | FL-PQFP-G176(JEDEC | 2017-06-11 |
SOT509-2 | HLBGA304 | plastic thermal enhanced low profile ball grid array package; 304 balls; body 31 x 31 x 0.9 mm; heatsink | MO-149(JEDEC | 2005-09-01 |
SOT510-1 | TSSOP38 | plastic, thin shrink small outline package; 38 leads; 0.5 mm pitch; 9.7 mm x 4.4 mm x 1.1 mm body | MO-153(JEDEC | 2005-11-02 |
SOT513-1 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink | 2003-02-20 | |
SOT513-2 | HTQFP80 | HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G80(JEDEC | 2017-06-11 |
SOT517-1 | SMS13P | plastic surface mounted single in-line power package; 13 leads | 2003-03-12 | |
SOT519-1 | SSOP16 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | 2003-02-18 | |
SOT521-1 | DBS27P | plastic DIL-bent-SIL power package; 27 leads (lead length 7.7 mm) | 2002-04-24 | |
SOT523-1 | DBS9P | plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad | 2003-03-12 | |
SOT524-1 | DBS7P | plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad | 2003-03-12 | |
SOT527-1 | HTSSOP20 | plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad | MO-153(JEDEC | 2005-11-02 |
SOT527-2 | HTSSOP20 | HTSSOP20, plastic, thermal enhanced thin shrink small outline package; 20 terminals; 0.65 mm pitch; 4.4 mm x 6.5 mm x 0.9 mm body | TS-PDSO-G28(JEDEC | 2017-06-11 |
SOT528-1 | RDBS13P | plastic rectangular-DIL-bent-SIL power package; 13 leads | 2003-03-12 | |
SOT528-2 | RDBS13P | plastic rectangular-DIL-bent-SIL power package; 13 leads | 2003-03-12 | |
SOT530-1 | TSSOP8 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | MO-153(JEDEC | 2003-02-18 |
SOT531-1 | BGA316 | plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-22 |
SOT532-1 | BGA388 | plastic, ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2003-01-23 |
SOT532-2 | BGA388 | plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2006-08-24 |
SOT533 | IPAK | plastic, single-ended package (IPAK); 3 leads; 2.285 mm pitch; 6 mm x 6.6 mm x 2.3 mm body | TO-251(JEDEC | 2006-02-14 |
SOT533A | IPAK | plastic single-ended package (IPAK); 3 short leads (in line) | TO-251(JEDEC | 2008-08-07 |
SOT534-1 | LFBGA64 | plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm | 2003-02-05 | |
SOT536-1 | LFBGA96 | plastic, low profile fine-pitch ball grid array package; 96 balls; 0.8 mm pitch; 13.5 mm x 5.5 mm x 1.5 mm body | 2003-02-05 | |
SOT537-1 | LFBGA114 | plastic, low profile fine-pitch ball grid array package; 114 balls; 0.8 mm pitch; 16 mm x 5.5 mm x 1.5 mm body | 2003-02-05 | |
SOT54 | TO-92 | plastic, single-ended leaded (through hole) package; 3 leads; 2.54 mm pitch; 4.6 mm x 3.9 mm x 5.1 mm body | SC-43A(EIAJ);TO-92(JEDEC | 2004-11-16 |
SOT542-1 | TFBGA56 | plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm | MO-195(JEDEC | 2002-06-10 |
SOT543-1 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm | MO-195(JEDEC | 2002-04-09 |
SOT545-1 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-01-29 |
SOT545-2 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-01-29 |
SOT545-3 | HTQFP48 | plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-02-05 |
SOT546-2 | HBGA352 | plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm | 2000-03-04 | |
SOT549-1 | HTSSOP32 | plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad | MO-153(JEDEC | 2005-11-02 |
SOT549-3 | HTSSOP32 | plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad | MO-153(JEDEC | 2005-11-02 |
SOT54A | PBCYT3 | plastic single-ended leaded (through hole) package; 3 leads (wide pitch) | 2004-06-28 | |
SOT54V | PBCYT3 | plastic single-ended leaded (through hole) package; 3 leads (on-circle) | 2005-01-10 | |
SOT550-1 | BGA304 | plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-23 |
SOT550-2 | BGA304 | plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm | MS-034(JEDEC | 2004-07-28 |
SOT552-1 | TSSOP10 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | 2021-07-08 | |
SOT553-1 | HBGA292 | plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2002-02-27 |
SOT555-4 | PGA206 | PGA206, plastic, pin grid array package, 206 pins, 2.54 mm pitch, 47.2 mm x 47.2 mm x 3.2 mm body | 2017-06-11 | |
SOT556-1 | SSOP24 | plastic, shrink small outline package; 24 leads; 0.635 mm pitch; 8.7 mm x 3.9 mm x 1.47 mm body | MO-137(JEDEC | 2003-02-18 |
SOT559A | QMAN16 | leadless surface mounted package; plastic cap; 16 terminations | 2006-03-16 | |
SOT560-1 | HBCC32 | plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm | MO-217(JEDEC | 2003-03-12 |
SOT564-1 | HBCC24 | plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm | MO-217(JEDEC | 2003-03-12 |
SOT566-1 | HSOP24 | plastic, heatsink small outline package; 24 leads | 2003-07-23 | |
SOT566-2 | HSOP24 | plastic, heatsink small outline package; 24 leads; low stand-off height | 2003-07-23 | |
SOT566-3 | HSOP24 | plastic, heatsink small outline package; 24 leads; low stand-off height, 1.0 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body | 2003-07-23 | |
SOT567A | DMAN8 | leadless surface mounted package; plastic cap; 8 terminations | 2006-03-16 | |
SOT569-1 | TFBGA144 | plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm | MO-216(JEDEC | 2005-09-14 |
SOT569-2 | TFBGA144 | plastic thin fine-pitch ball grid array package; 144 balls | 2008-03-14 | |
SOT570-1 | TFBGA180 | plastic thin fine-pitch ball grid array package; 180 balls | MO-216(JEDEC | 2003-07-09 |
SOT570-2 | TFBGA180 | plastic thin fine-pitch ball grid array package; 180 balls | 2006-03-14 | |
SOT570-3 | TFBGA180 | plastic thin fine-pitch ball grid array package; 180 balls, 0.8 mm pitch, 12 mm x 12 mm x 0.71 mm body | 2010-04-15 | |
SOT572-1 | LQFP100 | plastic low profile quad flat package; 100 leads; body 12 x 12 x 1.4 mm | MS-026(JEDEC | 2003-02-20 |
SOT573-1 | QFP144 | plastic quad flat package; 144 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm | MS-022(JEDEC | 2003-02-20 |
SOT573-2 | QFP144 | QFP144, plastic, quad flat package; 144 terminals; 0.65 mm pitch; 28 mm x 28 mm x 4.1 mm body | PQFP-G144(JEDEC | 2017-06-11 |
SOT574-1 | TQFP128 | plastic thin quad flat package; 128 leads; body 14 x 14 x 1 mm | 2003-02-20 | |
SOT576-1 | HQFP160 | plastic thermal enhanced quad flat package;160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink | 2003-02-20 | |
SOT577-2 | RDBS17P | plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) | 2003-03-12 | |
SOT578-1 | TBS13P | plastic Triple-bent-SIL power package; 13 leads (lead length 7.7 mm) | 2003-03-12 | |
SOT579-1 | BGA272 | plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm | MS-034(JEDEC);144E(IEC | 2004-09-28 |
SOT581-1 | BGA352 | plastic, ball grid array package; 352 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body | ED-7311-9A(EIAJ);MS-034(JEDEC);144E(IEC | 2003-01-23 |
SOT584-1 | BGA456 | plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2007-06-26 |
SOT587-1 | BGA596 | plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-23 |
SOT588-1 | BGA656 | plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-24 |
SOT589-1 | BGA553 | plastic, ball grid array package; 553 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2005-11-25 |
SOT594-1 | CWQCCN32 | Ceramic window quad chip carrier; no leads; 32 terminals;body 10.67 x 10.67 x 2.23 mm | MS-009(JEDEC | 2003-03-12 |
SOT595-1 | BGA208 | plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm | MS-034(JEDEC);144E(IEC | 2003-01-24 |
SOT597-1 | TFBGA96 | plastic, thin fine-pitch ball grid array package; 96 balls; 0.5 mm pitch; 8 mm x 8 mm x 0.8 mm body | MO-195(JEDEC | 2003-03-03 |
SOT598-1 | TFBGA100 | plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm | MO-216(JEDEC | 2003-03-03 |
SOT599-1 | TFBGA132 | plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm | MO-216(JEDEC | 2003-07-09 |
SOT599-2 | TFBGA132 | plastic, thin fine-pitch ball grid array package; 132 balls; 0.8 mm pitch; 12 mm x 12 mm x 0.8 mm body | 2006-01-09 | |
SOT600-1 | TFBGA208 | plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm | MO-216(JEDEC | 2003-07-09 |
SOT601-1 | TFBGA280 | plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm | MO-216(JEDEC | 2003-07-09 |
SOT602-1 | HBGA256 | plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-03-17 |
SOT603-1 | HBGA420 | plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-03-17 |
SOT604-1 | HBGA504 | plastic, thermal enhanced ball grid array package; 504 balls; 1.27 mm pitch; 35 mm x 35 mm x 0.9 mm body | MS-034(JEDEC);144E(IEC | 2003-03-17 |
SOT605-1 | HBGA600 | plastic, thermal enhanced ball grid array package; 600 balls; 1.27 mm pitch; 40 mm x 40 mm x 0.9 mm body | MS-034(JEDEC);144E(IEC | 2003-03-17 |
SOT607-1 | TSSOP30 | plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm | MO-153(JEDEC | 2003-02-18 |
SOT610-1 | HBGA456 | plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink | MS-034(JEDEC);144E(IEC | 2009-08-14 |
SOT611-1 | BGA329 | plastic, ball grid array package; 329 balls; 1.27 mm pitch; 31 mm x 31 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2003-01-24 |
SOT611-2 | BGA329 | plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-30 |
SOT612-2 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad | MS-026(JEDEC | 2004-07-05 |
SOT612-3 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad | MS-026(JEDEC | 2004-07-05 |
SOT612-4 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad | MS-026(JEDEC | 2008-01-18 |
SOT612-5 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad | MS-026(JEDEC | 2008-11-21 |
SOT612-6 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad | MS-026(JEDEC | 2010-02-25 |
SOT612-7 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads | MS-026(JEDEC | 2011-11-28 |
SOT616-1 | HVQFN24 | plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | MO-220(JEDEC | 2002-10-22 |
SOT616-3 | HVQFN24 | plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | MO-220(JEDEC | 2015-02-19 |
SOT616-4 | HVQFN24 | plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | MO-220(JEDEC | 2008-03-06 |
SOT616-5 | HVQFN24 | HVQFN24, plastic, thermal enhanced very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 1 mm body | TS-PQFP-N24(JEDEC | 2017-06-11 |
SOT616-6 | HVQFN24 | HVQFN24, plastic, thermal enhanced very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.85 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT616-7 | HVQFN24 | HVQFN24, plastic, thermal enhanced very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.85 mm body | 2017-06-11 | |
SOT616-8 | HVQFN24 | HVQFN24, plastic, thermally enhanced very thin quad; flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.9 mm body | 2016-01-12 | |
SOT616-9 | HVQFN24 | HVQFN24, thermal enhanced very thin quad flat package, no leads, 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 0.85 mm body | 2021-01-21 | |
SOT617-1 | HVQFN32 | HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | MO-220(JEDEC | 2002-10-18 |
SOT617-11 | HVQFN32 | HVQFN32, plastic thermal enhanced very thin quad flat package; no leads; 32 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | MO-220(JEDEC | 2013-01-29 |
SOT617-12 | HVQFN32 | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm | MO-220(JEDEC | 2013-11-05 |
SOT617-13 | HVQFN | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm | 2015-01-12 | |
SOT617-14 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body | HTS-PQFP-N32(JEDEC | 2017-06-11 |
SOT617-15 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body | 2017-06-11 | |
SOT617-16 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body | TS-PQFP-N32(JEDEC | 2017-06-11 |
SOT617-17 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.9 mm body | 2016-01-12 | |
SOT617-18 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2017-06-11 | |
SOT617-19 | HVQFN32 | HVQFN32, plastic, thermally enhanced very thin quad; flat non-leaded package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2022-09-14 | |
SOT617-2 | HVQFN32 | HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | MO-220(JEDEC | 2003-05-02 |
SOT617-20 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body | HF-PQFN-N32(JEDEC | 2017-06-11 |
SOT617-21 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body | HTS-PQFP-N32(JEDEC | 2017-06-11 |
SOT617-24 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flat package, no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2019-10-30 | |
SOT617-24(SC) | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flat package, no leads; step-cut wettable flank; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2019-10-28 | |
SOT617-26(D) | HVQFN32 | HVQFN32, thermal enhanced very thin quad flat package, no leads, wettable flanks, 32 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | 2024-01-02 | |
SOT617-27 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flat package, no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2021-07-15 | |
SOT617-28(DD) | HVQFN32 | HVQFN32, thermal enhanced very thin quad flat package, no leads, wettable flanks, 32 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | 2021-01-27 | |
SOT617-3 | HVQFN32 | plastic, thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body | MO-220(JEDEC | 2002-10-22 |
SOT617-5 | HVQFN32 | HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | MO-220(JEDEC | 2008-03-12 |
SOT617-7 | HVQFN32 | HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | 2010-02-09 | |
SOT617-9 | HVQFN32 | HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body | MO-220(JEDEC | 2012-07-02 |
SOT618-1 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2022-11-22 |
SOT618-10 | HVQFN40 | HVQFN40, plastic, thermal enhanced very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.9 mm body | HTS-PQFP-N40(JEDEC | 2017-06-11 |
SOT618-11 | HVQFN40 | HVQFN40, plastic, thermal enhanced very thin quad flat package; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.9 mm body | MO-220 VJJD-2(JEDEC | 2016-11-03 |
SOT618-12 | HVQFN40 | HVQFN40, plastic, thermal enhanced very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.85 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT618-13(DD) | HVQFN40 | HVQFN40, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2018-11-13 | |
SOT618-14 | HVQFN40 | HVQFN40, plastic thermal enhanced very thin quad flatpack; no leads, 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2017-10-11 | |
SOT618-16(SC) | HVQFN40 | HVQFN40, thermal enhanced very thin quad flat package; no leads; step-cut wettable flank; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.8 mm body | 2019-03-07 | |
SOT618-17(D) | HVQFN40 | HVQFN40, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.9 mm body | 2019-10-07 | |
SOT618-18(D) | HVQFN40 | HVQFN40, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2022-10-11 | |
SOT618-18(DD) | HVQFN40 | HVQFN40, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2022-10-05 | |
SOT618-2 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2003-04-22 |
SOT618-3 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2004-04-08 |
SOT618-4 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2005-10-06 |
SOT618-5 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2008-06-27 |
SOT618-6 | HVQFN40 | HVQFN40, plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | MO-220(JEDEC | 2021-04-28 |
SOT618-7 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals | MO-220(JEDEC | 2010-11-05 |
SOT618-7(D) | HVQFN40 | HVQFN40, plastic thermal enhanced very thin quad flat wettable flanks package; no leads; 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | MO-220(JEDEC | 2022-10-03 |
SOT618-7(DD) | HVQFN40 | HVQFN40, plastic thermal enhanced very thin quad flat package; no leads, 0.125 dimple wettable flank, 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body | MO-220(JEDEC | 2022-06-30 |
SOT618-8 | HVQFN40 | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.85 mm body | 2017-03-17 | |
SOT618-9 | HVQFN40 | HVQFN40, plastic, thermal enhanced very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.9 mm body | 2017-06-11 | |
SOT619-1 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; 7 mm x 7 mm x 0.85 mm body | MO-220(JEDEC | 2017-12-13 |
SOT619-10 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals | MO-220(JEDEC | 2009-12-11 |
SOT619-11 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals | MO-220(JEDEC | 2009-12-11 |
SOT619-13 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals | MO-220(JEDEC | 2013-03-27 |
SOT619-14 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1 mm body | MO-220 VKKD-2(JEDEC | 2016-02-02 |
SOT619-15 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1 mm body | TS-PQFP-N48(JEDEC | 2017-06-11 |
SOT619-16 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | 2016-01-07 | |
SOT619-17 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT619-17(D) | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 0.1 dimple wettable flank, 48 terminals; 7 mm x 7 mm x 0.85 mm body | 2018-09-28 | |
SOT619-18 | HVQFN48 | plastic, thermally enhanced very thin quad flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | 2016-01-12 | |
SOT619-19 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT619-2 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2002-10-22 |
SOT619-20 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1 mm body | HF-PQFN-N48(JEDEC | 2017-06-11 |
SOT619-21 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | 2017-06-11 | |
SOT619-22 | HVQFN48 | plastic, thermally enhanced very thin quad flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.9 mm body | 2016-01-12 | |
SOT619-23 | HVQFN48 | HVQFN48, plastic,thermal enhanced very thin quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | 2019-05-27 | |
SOT619-24 | HVQFN48 | HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body | 2017-06-11 | |
SOT619-25(D) | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 0.1 dimple wettable flank, 48 terminals; 7 mm x 7 mm x 0.9 mm body | 2018-02-28 | |
SOT619-26(D) | HVQFN48 | HVQFN48, thermal enhanced very thin quad flat package, no leads, 48 terminals, 0.1 mm dimple wettable flank, 0.5 mm pitch, 7 mm x 7 mm x 0.85 mm body | 2021-01-22 | |
SOT619-26(DD) | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; dimple wettable flank, 48 terminals; 7 mm x 7 mm x 0.85 mm body | 2019-01-04 | |
SOT619-26(SC) | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; step-cut, wettable flank, 48 terminals; 7 mm x 7 mm x 0.85 mm body | 2018-12-04 | |
SOT619-27(D) | HVQFN48 | HVQFN48, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 48 terminals; 0.5 mm pitch, 7 mm x 7 mm x 0.9 mm body | 2019-09-20 | |
SOT619-28 | HVQFN48 | HVQFN48, thermal enhanced very thin quad flat package; no leads; 48 terminals; 0.5 mm pitch, 7 mm x 7 mm x 0.85 mm body | 2020-07-03 | |
SOT619-3 | HVQFN48 | plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm | MO-220(JEDEC | 2001-09-07 |
SOT619-4 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2002-09-30 |
SOT619-5 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm | MO-220(JEDEC | 2005-06-10 |
SOT619-6 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2005-06-16 |
SOT619-7 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2005-10-25 |
SOT619-8 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2007-01-30 |
SOT619-9 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2008-11-13 |
SOT622-1 | LFBGA180 | plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm | MO-205(JEDEC | 2002-02-13 |
SOT623-1 | BGA658 | plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-24 |
SOT624-1 | HBGA1312 | plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-01-14 |
SOT627-1 | TFBGA81 | plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm | MO-216(JEDEC | 2002-02-15 |
SOT629-1 | HVQFN16 | plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm | MO-220(JEDEC | 2002-10-22 |
SOT630-1 | TFBGA112 | plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm | 2006-04-27 | |
SOT630-2 | TFBGA112 | plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.7 mm | MO-195(JEDEC | 2006-04-27 |
SOT631-1 | LFBGA208 | plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.25 mm | MO-205(JEDEC | 2002-08-19 |
SOT631-2 | LFBGA208 | plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm | MO-205(JEDEC | 2002-08-14 |
SOT631-3 | LFBGA208 | plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm | MO-205(JEDEC | 2003-10-20 |
SOT631-4 | LFBGA208 | plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm | MO-205(JEDEC | 2007-03-19 |
SOT632A | QMAN12 | leadless surface mounted package; plastic cap; 12 terminations | 2006-03-16 | |
SOT633-3 | HTSSOP38 | plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad | 2004-01-22 | |
SOT635-1 | HBGA596 | plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-01-14 |
SOT636-1 | HBGA388 | plastic, heatsink ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2001-12-11 |
SOT637 | SIP5 | plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads | 2004-12-10 | |
SOT638-1 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2005-02-02 |
SOT638-2 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2005-02-02 |
SOT638-3 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2008-04-08 |
SOT638-4 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2008-11-12 |
SOT638-5 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad | MS-026(JEDEC | 2008-11-12 |
SOT638-6 | HTQFP100 | plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad, 0.5 mm pitch, 14 mm x 14 mm x 1 mm body | 2009-09-01 | |
SOT638-7 | HTQFP100 | HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G100(JEDEC | 2017-06-11 |
SOT638-8 | HTQFP100 | HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body | TS-PQFP-G100(JEDEC | 2017-06-11 |
SOT639-2 | HBCC16 | plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm | MO-217(JEDEC | 2003-03-12 |
SOT640-1 | TFBGA180 | plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm | MO-195(JEDEC | 2003-03-03 |
SOT643-1 | LFBGA81 | plastic low profile fine-pitch ball grid array package; 81 balls; body 9 x 9 x 1.05 mm | MO-205(JEDEC | 2002-03-28 |
SOT644-1 | LFBGA144 | plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm | MO-205(JEDEC | 2003-02-05 |
SOT646-1 | TSSOP64 | plastic, thin shrink small outline package; 64 leads; 0.5 mm pitch; 17 mm x 6.1 mm x 1.2 mm body | MO-153(JEDEC | 2003-02-18 |
SOT647-1 | TSSOP80 | plastic thin shrink small outline package; 80 leads; body width 6.1 mm | MO-153(JEDEC | 2003-02-18 |
SOT648-1 | BGA225 | plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm | ED-7311-9A(EIAJ);MS-034(JEDEC);144E(IEC | 2003-01-24 |
SOT649A | QMAN22 | leadless surface mounted package; plastic cap; 22 terminations | 2006-03-16 | |
SOT650-1 | HVSON10 | plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 mm x 3 mm x 0.85 mm | MO-229(JEDEC | 2024-02-07 |
SOT650-2 | HVSON10 | plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm | MO-229(JEDEC | 2009-03-18 |
SOT651-1 | BGA956 | plastic ball grid array package; 956 balls; body 40 x 40 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-24 |
SOT652-1 | BGA760 | plastic ball grid array package; 760 balls; body 40 x 40 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2003-01-24 |
SOT655-1 | TFBGA228 | plastic thin fine-pitch ball grid array package; 228 balls; body 12 x 12 x 0.8 mm | MO-195(JEDEC | 2002-02-08 |
SOT658-1 | PLLMC8 | palladium plated contact chip card module (super 35 mm tape format, 8-contact) | 2012-09-14 | |
SOT658-3 | PLLMC8 | dual interface chip card module (Plug-in type; super 35 mm tape format, 8-contact) | 2012-09-14 | |
SOT658-6 | PLLMC8 | dual interface chip card module (Plug-in type; super 35 mm tape format, 8-contact) | 2012-09-14 | |
SOT658-7 | PLLMC8 | dual interface chip card module (Plug-in type; super 35 mm tape format, 8-contact) | 2012-09-14 | |
SOT662-1 | HVQFN20 | plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm | MO-220(JEDEC | 2002-10-22 |
SOT663 | SOT663 | plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | 2006-03-16 | |
SOT665 | SOT665 | plastic, surface-mounted package; 5 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | 2006-03-16 | |
SOT666 | SOT666 | plastic, surface-mounted package; 6 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | 2006-03-16 | |
SOT668-2 | RDBS17P | plastic rectangular-DIL-bent-SIL (reverse bent) power package; 17 leads (row spacing 2.54 mm) | 2003-03-12 | |
SOT669 | LFPAK56; Power-SO8 | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | MO-235(JEDEC | 2013-02-27 |
SOT680-1 | SO5 | plastic small outline package; 5 leads; body width 1.6 mm | MO-178(JEDEC | 2001-11-15 |
SOT683-1 | HBGA960 | plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink | MS-034(JEDEC | 2002-05-01 |
SOT684-1 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm | MO-220(JEDEC | 2002-10-22 |
SOT684-10 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals | 2010-10-20 | |
SOT684-13 | HVQFN56 | HVQFN56, plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm | 2015-07-13 | |
SOT684-14 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm | 2015-07-13 | |
SOT684-15 | HVQFN56 | HVQFN56, plastic, thermal enhanced very thin quad flatpack; no leads; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body | 2017-06-11 | |
SOT684-16 | HVQFN56 | HVQFN56, plastic, thermally enhanced very thin quad flat, non-leaded package; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body | 2019-07-12 | |
SOT684-17 | HVQFN56 | HVQFN56, plastic, thermal enhanced very thin quad flatpack; no leads; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.9 mm body | 2017-06-11 | |
SOT684-18 | HVQFN56 | plastic, thermally enhanced very thin quad flat non-leaded package; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body | 2020-01-30 | |
SOT684-19(D) | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package, no leads, 56 terminals, 0.1 mm dimple wettable flank, 0.5 mm pitch, 8 mm x 8 mm x 0.9 mm body | 2021-06-29 | |
SOT684-2 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm | MO-220(JEDEC | 2002-10-22 |
SOT684-20 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm | 2017-04-24 | |
SOT684-21 | HVQFN56 | HVQFN56, plastic, thermally enhanced very thin quad flat package, no-leads, 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body | 2018-10-30 | |
SOT684-21(DDSC) | HVQFN56 | HVQFN56, plastic, thermally enhanced very thin quad flat package, no-leads, wettable flanks; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body | 2018-10-30 | |
SOT684-23 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; wettable flank, 56 terminals; 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2019-01-31 | |
SOT684-24(DD) | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 56 terminals; 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2018-07-10 | |
SOT684-25(DD) | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 56 terminals; 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2018-08-01 | |
SOT684-26 | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package, no leads, 56 terminals, 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2020-03-16 | |
SOT684-26(SC) | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package; no leads; step-cut wettable flank; 56 terminals; 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2019-03-05 | |
SOT684-29(D) | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package, no leads, 56 terminals, 0.1 mm dimble wettable flank, 0.5 mm pitch, 8 mm x 8 mm x 0.9 mm body | 2021-03-19 | |
SOT684-3 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm | MO-220(JEDEC | 2003-03-11 |
SOT684-30(D) | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package, no leads, 56 terminals, 0.1 mm dimple wettable flank, 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body | 2021-05-07 | |
SOT684-30(DD) | HVQFN56 | HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm | 2022-11-29 | |
SOT684-4 | HVQFN56 | plastic, thermal enhanced very thin quad flat package; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body | MO-220(JEDEC | 2004-09-14 |
SOT684-6 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm | 2002-11-27 | |
SOT684-7 | HVQFN56 | HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm | MO-220(JEDEC | 2009-03-04 |
SOT684-8 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm | 2009-02-24 | |
SOT684-9 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals | 2009-05-25 | |
SOT685-1 | HVSON8; QFPAK | plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 6 x 5 x 0.85 mm | 2002-11-27 | |
SOT685-3 | HVSON8; QFPAK | plastic, thermal enhanced very thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2011-08-30 |
SOT686-1 | LFBGA64 | plastic low profile fine-pitch ball grid array package; 64 balls; body 6 x 6 x 1.05 mm | 2002-03-11 | |
SOT687-1 | HVQFN68; MLF | plastic, thermal enhanced very thin quad flat package; 68 terminals; 0.5 mm pitch; 10 mm x 10 mm x 0.85 mm body | MO-220(JEDEC | 2003-06-13 |
SOT697-1 | LFBGA180 | plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm | MO-205(JEDEC | 2002-02-13 |
SOT698-2 | BGA272 | BGA272, plastic, ball grid array; 272 balls; 1.27 mm pitch; 27 mm x 27 mm x 1.95 mm body | PBGA-B272(JEDEC | 2017-06-11 |
SOT700-1 | LBGA156 | plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm | MO-192(JEDEC | 2001-11-06 |
SOT702-1 | VFBGA56 | plastic, very thin fine-pitch ball grid array package; 56 balls; 0.65 mm pitch; 4.5 mm x 7 mm x 0.65 mm body | MO-225(JEDEC | 2003-07-01 |
SOT702-2 | VFBGA56 | plastic, very thin fine-pitch ball grid array package; 56 balls; 0.65 mm pitch; 4.5 mm x 7 mm x 0.85 mm body | 2014-08-21 | |
SOT706-1 | HBGA552 | plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink | 2002-11-13 | |
SOT707-1 | HBGA584 | plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink | 2002-11-22 | |
SOT710-1 | BGA217 | plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2001-11-01 |
SOT710-2 | BGA217 | BGA217, plastic, ball grid array; 217 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.65 mm body | PBGA-B217(JEDEC | 2017-06-11 |
SOT711-1 | BGA240 | plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm | IC-7315-001(EIAJ);MS-034(JEDEC);144E(IEC | 2001-11-01 |
SOT711-2 | BGA240 | plastic, ball grid array package; 240 balls; 1.27 mm pitch; 23 mm x 23 mm x 1.55 mm body | MS-034(JEDEC);144E(IEC | 2005-03-14 |
SOT713-1 | TFBGA204 | plastic, thin fine-pitch ball grid array package; 204 balls; 0.5 mm pitch; 11 mm x 11 mm x 0.8 mm body | MO-195(JEDEC | 2005-06-23 |
SOT714-1 | HBGA329 | plastic thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2001-10-30 |
SOT715-1 | LFBGA216 | plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm | MO-205(JEDEC | 2001-11-14 |
SOT724-1 | SSOP20 | plastic, shrink small outline package; 20 leads; 0.635 mm pitch; 8.7 mm x 3.9 mm x 1.73 mm body | MO-137(JEDEC | 2003-02-18 |
SOT725-1 | DBS37P | plastic DIL-bent-SIL power package; 37 leads (lead length 6.8 mm) | 2002-11-22 | |
SOT726-1 | TCP | plastic tape carrier package; 35 mm wide tape | 2002-02-14 | |
SOT727-1 | HLBGA475 | plastic thermal enhanced low profile ball grid array package; 475 balls; body 35 x 35 x 0.9 mm; heatsink | MO-192(JEDEC | 2002-02-07 |
SOT728-1 | LBGA324 | plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1.05 mm | MO-192(JEDEC | 2001-11-01 |
SOT728-2 | LBGA324 | plastic, low profile ball grid array package; 324 balls; 1 mm pitch; 19 mm x 19 mm x 1 mm body | MO-192(JEDEC | 2005-05-25 |
SOT728-3 | LBGA324 | LBGA324, plastic, low profile ball grid array; 324 balls; 1 mm pitch; 19 mm x 19 mm x 1.54 mm body | PBGA-B324(JEDEC | 2017-06-11 |
SOT730-1 | CWQCCN32L | ceramic window quad chip carrier; no leads; with lens; body 10.7 x 10.7 x 8 mm | 2002-08-12 | |
SOT732-1 | FCP2 | metal flip chip package; 2 leads; 35 mm wide tape | 2005-03-04 | |
SOT734-1 | SSOP16T | plastic shrink small outline package/transparent; 16 leads (straight leads); body width 4.4 mm | 2001-11-09 | |
SOT740-1 | LBGA256 | plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm | MO-192(JEDEC | 2002-01-09 |
SOT740-2 | LBGA256 | plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm | MO-192(JEDEC | 2005-08-04 |
SOT740-3 | LBGA256 | LBGA256; plastic, low profile ball grid array; 256 bumps; 1.0 mm pitch; 17 mm x 17 mm x 1.7 mm body | 2016-01-07 | |
SOT740-4 | LBGA256 | LBGA256, plastic, low profile ball grid array; 256 balls; 1 mm pitch; 17 mm x 17 mm x 1.16 mm body | 2016-02-05 | |
SOT741-1 | BGA376 | plastic, ball grid array package; 376 balls; 1 mm pitch; 23 mm x 23 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2002-01-14 |
SOT744-1 | LFBGA64 | plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm | 2001-12-11 | |
SOT745-1 | LFBGA72 | plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm | 2004-05-19 | |
SOT746-1 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm | MO-195(JEDEC | 2002-01-11 |
SOT747-1 | TFBGA72 | plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm | MO-195(JEDEC | 2002-01-11 |
SOT748-1 | COF | plastic chip on foil package; 35 mm wide tape | 2002-04-24 | |
SOT748-2 | COF | plastic chip on foil package; 35 mm wide tape | 2002-10-18 | |
SOT748-3 | COF | plastic chip on foil package; 48 mm wide tape | 2002-10-18 | |
SOT748-4 | COF | plastic chip on foil package; 48 mm wide tape | 2002-10-18 | |
SOT750A | QMAN28 | leadless surface mounted package; plastic cap; 28 terminations | 2006-03-16 | |
SOT751-1 | LFBGA80 | plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm | 2003-09-16 | |
SOT751-2 | LFBGA80 | plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm | 2003-09-16 | |
SOT753 | TSOP5 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | SC-74A(EIAJ | 2006-03-16 |
SOT754-1 | TFBGA256 | plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm | MO-216(JEDEC | 2002-01-14 |
SOT754-2 | TFBGA256 | plastic thin fine-pitch ball grid array package; 256 balls, 0.8 mm pitch, 15 mm x 15 mm x 0.71 mm body | MO-216(JEDEC | 2009-10-27 |
SOT756 | SPAK-5 | plastic single-ended surface-mounted package; 5 leads | 2008-02-15 | |
SOT758-1 | HVQFN16 | plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm | MO-220(JEDEC | 2002-10-21 |
SOT758-2 | HVQFN16 | plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm | MO-220(JEDEC | 2007-01-26 |
SOT758-3 | HVQFN16 | plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm | MO-220(JEDEC | 2008-02-08 |
SOT758-4 | HVQFN16 | HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.85 mm body | 2017-06-11 | |
SOT758-5 | HVQFN16 | plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; 0.5 mm pitch, 3 mm x 3 mm x 0.9 mm | 2018-08-13 | |
SOT758-6(DD) | HVQFN16 | HVQFN16, thermal enhanced very thin quad flat package, no leads, 16 terminals, 0.125 mm dimple wettable flank, 0.5 mm pitch, 3 mm x 3 mm x 0.85 mm body | 2020-10-15 | |
SOT759-1 | LFBGA228 | plastic low profile fine-pitch ball grid array package; 228 balls; body 12 x 12 x 1.05 mm | 2002-03-18 | |
SOT761-1 | TFBGA72 | plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm | MO-195(JEDEC | 2002-04-10 |
SOT762-1 | DHVQFN14 | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | MO-241(JEDEC | 2015-05-05 |
SOT763-1 | DHVQFN16 | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | MO-241(JEDEC | 2003-01-27 |
SOT764-1 | DHVQFN20 | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | MO-241(JEDEC | 2014-12-12 |
SOT765-1 | VSSOP8 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | MO-187(JEDEC | 2019-04-10 |
SOT766-1 | HLQFP176 | plastic thermal enhanced low profile quad flat package; 176 leads; body 24 mm x 24 mm x 1.4 mm; exposed die pad | MS-026(JEDEC | 2002-06-13 |
SOT766-2 | HLQFP176 | Plastic thermal enhanced low profile quad flat package; 176 leads, 0.5 mm pitch, 24 mm x 24 mm x 1.4 mm body | MS-026(JEDEC | 2014-04-01 |
SOT766-4 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-06-11 | |
SOT766-5 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.50 mm pitch; 24 mm x 24 mm x 1.6 mm body | 2017-03-27 | |
SOT766-6 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-06-11 | |
SOT766-7 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad; flat leaded package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-03-27 | |
SOT766-9 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-06-11 | |
SOT767-1 | DBS27P | plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 7.7 mm) | 2002-05-02 | |
SOT770-1 | HTSSOP8 | plastic thermal enhanced thin shrink small outline package; 8 leads; body width 3 mm; exposed die pad | 2002-05-14 | |
SOT773-1 | HVQFN14 | plastic thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 2.5 x 0.85 mm | 2002-07-05 | |
SOT774-1 | LBGA208 | plastic low profile ball grid array package; 208 balls; body 17 x 17 x 1.05 mm | MO-192(JEDEC | 2002-05-14 |
SOT774-2 | LBGA208 | plastic low profile ball grid array package; 208 balls; body 17 x 17 x 1 mm | MO-192(JEDEC | 2006-02-02 |
SOT775A | QMAN16 | leadless surface mounted package; plastic cap; 16 terminations | 2006-03-16 | |
SOT776-1 | HSSON14 | plastic, thermal enhanced shrink small outline package; 14 terminals; 1.075 mm pitch; 12 mm x 12 mm x 2.1 mm body | 2005-06-06 | |
SOT777-1 | TFBGA100 | plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm | MO-195(JEDEC | 2002-06-20 |
SOT778-1 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm | 2004-02-10 | |
SOT778-2 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm | 2004-02-16 | |
SOT778-3 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm | 2004-06-23 | |
SOT778-4 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm | 2016-07-12 | |
SOT778-5 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm | 2002-10-30 | |
SOT778-7 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 mm x 6 mm x 0.85 mm | 2016-04-22 | |
SOT778-8 | HVQFN48 | HVQFN48, thermal enhanced very thin quad flat package, no leads, 48 terminals, 0.4 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2020-06-16 | |
SOT778-8, | HVQFN48 | HVQFN48, thermal enhanced very thin quad flat package, no leads, 48 terminals, 0.4 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2020-06-16 | |
SOT778-9 | HVQFN48 | plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; 0.4 mm pitch, 6 mm x 6 mm x 0.85 mm body | 2020-12-17 | |
SOT78 | TO-220AB | plastic, single-ended package (heatsink mounted, 1 mounting hole); 3 leads; 2.54 mm pitch; 15.6 mm x 10 mm x 4.4 mm body | SC-46(EIAJ);3-lead TO-220AB(JEDEC | 2008-06-13 |
SOT780-1 | HTQFP52 | plastic thermal enhanced thin quad flat package; 52 leads; body 10 x 10 x 1 mm; exposed die pad | MS-026(JEDEC | 2002-09-04 |
SOT782-1 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals; 0.65 mm pitch, 3 mm x 3 mm x 0.85 mm body | MO-229(JEDEC | 2009-08-28 |
SOT782-2 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2011-08-30 |
SOT784-1 | LQFP100 | plastic low profile quad flat package; 100 leads; body 14 x 20 x 1.4 mm | ED-7311PD(EIAJ);MS-026(JEDEC);136E27(IEC | 2002-08-14 |
SOT785-1 | LFBGA180 | plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm | MO-205(JEDEC | 2002-09-30 |
SOT785-2 | LFBGA180 | plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 1 mm | MO-205(JEDEC | 2005-11-30 |
SOT786-2 | HSO8 | plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad | 2013-08-02 | |
SOT786-3 | HSO8 | plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad | 2015-02-12 | |
SOT788-1 | HVQFN28 | plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2002-10-22 |
SOT788-2 | HVQFN28 | plastic, thermal enhanced very thin quad flat package; no leads; 28 terminals; 6 x 6 x 0.85 mm body | 2016-07-21 | |
SOT788-3(DD) | HVQFN28 | HVQFN28, plastic, thermally enhanced very thin quad flat, non-leaded package, 0.125 mm dimple wettable flank; 28 terminals; 0.65 mm pitch; 6 mm x 6 mm x 0.85 mm body | 2020-01-15 | |
SOT789A | QMAN32 | leadless surface mounted package; plastic cap; 32 terminations | 2006-03-16 | |
SOT78A | TO-220AB | plastic, single-ended package (heatsink mounted, 1 mounting hole); 3 leads; 2.54 mm pitch; 15.5 mm x 10 mm x 4.3 mm body | SC-46(EIAJ);3-lead TO-220AB(JEDEC | 2005-03-14 |
SOT78B | TO-220AB | plastic, single-ended package; 3 leads; 2.54 mm pitch; 15.5 mm x 10 mm x 4.3 mm body | SC-46(EIAJ);3-lead TO-220AB(JEDEC | 2006-02-14 |
SOT78C | TO-220AB | plastic, single-ended package; 3 leads; 2.54 mm pitch; 15 mm x 10 mm x 4.5 mm body | 2012-11-28 | |
SOT78D | TO-220AB | plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 | SC-46(EIAJ);3-lead TO-220AB(JEDEC | 2007-07-10 |
SOT791-1 | LQFP64 | plastic low profile quad flat package; 64 leads; body 14 x 14 x 1.4 mm | ED-7311EC(EIAJ);MS-026(JEDEC);136E18(IEC | 2002-10-22 |
SOT791-2 | LQFP64 | LQFP64, plastic, low profile quad flat package; 64 terminals; 0.8 mm pitch; 14 mm x 14 mm x 1.4 mm body | L-PQFP-G64(JEDEC | 2017-06-11 |
SOT792-1 | HLQFP44 | plastic thermal enhanced low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm; heatsink | MS-026(JEDEC | 2002-11-15 |
SOT793-1 | HTSSOP56 | plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad | MO-153(JEDEC);143E36T(IEC | 2003-03-04 |
SOT795-1 | BGA456 | plastic ball grid array package; 456 balls | MS-034(JEDEC);144E(IEC | 2008-06-09 |
SOT796A | QMAN18 | leadless surface mounted package; plastic cap; 18 terminations | 2006-03-16 | |
SOT797-1 | HVQFN20 | plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 x 3 x 0.85 mm | 2003-03-19 | |
SOT799-1 | HBGA564 | plastic thermal enhanced ball grid array package; 564 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2002-11-18 |
SOT800A | CDFM4 | flanged double-ended ceramic package; 2 mounting holes; 4 leads | 2003-11-18 | |
SOT802-1 | TFBGA160 | plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.8 mm | 2003-01-29 | |
SOT802-2 | TFBGA160 | plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm | 2005-07-13 | |
SOT803-1 | QFP44 | plastic quad flat package; 44 leads (lead length 1.6 mm); body 10 x 10 x 2 mm | ED-7311CB(EIAJ);MS-022(JEDEC);134E05(IEC | 2003-01-29 |
SOT803-2 | QFP44 | QFP44, plastic, quad flat package; 44 terminals; 0.8 mm pitch; 10 mm x 10 mm x 2 mm body | PQFP-G44(JEDEC | 2017-06-11 |
SOT804-1 | HVQFN64 | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm | MO-220(JEDEC | 2003-03-26 |
SOT804-2 | HVQFN64 | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm | MO-220(JEDEC | 2004-03-25 |
SOT804-3 | HVQFN64 | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm | 2009-02-24 | |
SOT804-3(D) | HVQFN64 | HVQFN64, thermal enhanced very thin quad flat package, no leads, dimple wettable flank; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body | 2018-07-20 | |
SOT804-4 | HVQFN64 | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body | 2010-05-27 | |
SOT804-5 | HVQFN64 | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals | 2011-08-30 | |
SOT804-6 | HVQFN64 | HVQFN64, plastic, thermal enhanced very thin quad flatpack; no leads; 64 terminals; 0.5 mm pitch; 9 mm x 9 mm x 1 mm body | HF-PQFN-N64(JEDEC | 2017-06-11 |
SOT804-7 | HVQFN64 | HVQFN64, plastic, thermal enhanced very thin quad flatpack; no leads; 64 terminals; 0.5 mm pitch; 9 mm x 9 mm x 1 mm body | HF-PQFN-N64(JEDEC | 2017-06-11 |
SOT804-8(DD) | HVQFN64 | HVQFN64, Thermal enhanced very thin quad flat package; no leads; 64 terminals; 0.5 mm pitch, 9 mm x 9 mm x 0.9 mm body | 2022-12-20 | |
SOT807-1 | HBGA156 | plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink | MS-034(JEDEC | 2003-03-06 |
SOT809-1 | LBGA224 | plastic low profile ball grid array package; 224 balls; body 17 x 17 x 1.05 mm | MO-192(JEDEC | 2003-05-22 |
SOT810-1 | HSSON18 | plastic, thermal enhanced shrink small outline package; 18 terminals; 1 mm pitch; 8 mm x 12 mm x 2.1 mm body | 2005-04-04 | |
SOT811-1 | BGA256 | plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm | MS-034(JEDEC | 2003-04-15 |
SOT812-1 | BGA288 | plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm | MS-034(JEDEC);144E(IEC | 2003-05-15 |
SOT813-2 | HVQFN72 | plastic thermal enhanced very thin quad flat package; no leads; 72 terminals | MO-220(JEDEC | 2004-10-13 |
SOT813-3 | HVQFN72 | plastic thermal enhanced very thin quad flat package; no leads; 72 terminals | 2010-04-02 | |
SOT813-4 | HVQFN72 | plastic thermal enhanced very thin quad flat package; no leads; 72 terminals, 0.5 mm pitch, 10 mm x 10 mm x 0.85 mm body | MO-220(JEDEC | 2012-07-26 |
SOT813-5 | HVQFN72 | plastic thermal enhanced very thin quad flat package; no leads; 72 terminals | MO-220(JEDEC | 2013-06-13 |
SOT814-1 | HTSSON16T | plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 6.6 x 5.2 x 1.1 mm | 2003-11-19 | |
SOT815-1 | DHVQFN24 | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 3.5 mm x 5.5 mm x 0.85 mm body | 2003-04-29 | |
SOT817-1 | HVQFN100 | plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm | MO-220(JEDEC | 2003-06-13 |
SOT818-1 | HVQFN36 | plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm | MO-220(JEDEC | 2003-06-13 |
SOT819-1 | HLLGA28R | plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm | 2007-11-14 | |
SOT82 | SIP3 | plastic single-ended package; 3 leads (in-line) | SIP3; TO-220(JEDEC | 1997-06-11 |
SOT820-1 | HSOP16 | plastic thermal enhanced small outline package; 16 leads; body width 7.5 mm; heatsink | 2005-05-23 | |
SOT821-1 | LFBGA228 | plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm | 2004-02-25 | |
SOT823-1 | LQFP80 | plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm | MS-026(JEDEC);136E19(IEC | 2003-07-15 |
SOT823-2 | LQFP80 | LQFP80, plastic, low profile quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2017-06-11 | |
SOT823-3 | LQFP80 | LQFP80, plastic, low profile quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1.4 mm body | L-PQFP-G80(JEDEC | 2017-06-11 |
SOT824-1 | LFBGA320 | plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm | 2003-07-09 | |
SOT825-1 | LFBGA183 | plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm | MO-205(JEDEC | 2003-07-14 |
SOT826-1 | LFBGA73 | plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm | 2003-08-05 | |
SOT827-1 | DBS27P | plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) | 2013-05-30 | |
SOT829-1 | TFBGA256 | plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm | MO-195(JEDEC | 2003-09-25 |
SOT830-1 | HTSSON16TR | plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; resin based; body 5.4 x 3.9 x 1.2 mm | 2007-11-14 | |
SOT832-1 | LFBGA240 | plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm | 2003-10-22 | |
SOT833-1 | XSON8 | plastic, extremely thin small outline package; 8 terminals; 0.6 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | MO-252(JEDEC | 2007-12-07 |
SOT835-1 | HBGA672 | plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink | 2003-11-18 | |
SOT836-1 | LFBGA167 | plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm | 2003-10-20 | |
SOT840-1 | HLLGA52R | plastic thermal enhanced low profile land grid array package; 52 lands; resin based; body 8 x 7 x 1.4 mm | 2007-11-14 | |
SOT841-1 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-01-15 |
SOT841-2 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad | MS-026(JEDEC | 2004-04-21 |
SOT841-4 | HTQFP80 | plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad | MS-026(JEDEC | 2006-06-20 |
SOT841-5 | HTQFP80 | HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1 mm body | TS-PQFP-G80(JEDEC | 2017-06-11 |
SOT844-1 | LFBGA183 | plastic low profile fine-pitch ball grid array package; 183 balls; body 10 x 10 x 1.05 mm | 2004-01-15 | |
SOT844-2 | LFBGA183 | plastic low profile fine-pitch ball grid array package; 183 balls; body 10 x 10 x 0.9 mm | 2005-11-29 | |
SOT845-1 | LFBGA240 | plastic low profile fine-pitch ball grid array package; 240 balls; body 10 x 10 x 1.05 mm | 2004-01-15 | |
SOT846-1 | HBGA760 | plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC | 2005-08-19 |
SOT847-1 | BGA420 | plastic ball grid array package; 420 balls; body 23 x 23 x 1.7 mm | MS-034(JEDEC);144E(IEC | 2004-02-12 |
SOT847-2 | BGA420 | plastic ball grid array package; 420 balls; body 23 x 23 x 1.55 mm | 144E(IEC | 2005-03-16 |
SOT848-2 | HLQFP128 | HLQFP128, plastic, thermal enhanced low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body | 2017-06-11 | |
SOT848-3 | HLQFP128 | HLQFP128, plastic, thermal enhanced low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body | 2017-03-08 | |
SOT849-1 | QIP90 | plastic quadruple in-line package; 90 leads | 2004-11-22 | |
SOT849-2 | QIP90 | plastic quadruple in-line package; 90 leads; face down | 2004-11-22 | |
SOT850-1 | HBGA256 | plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink | MS-034(JEDEC | 2004-03-19 |
SOT851-2 | HSOP36 | plastic, heatsink small outline package; 36 leads; low stand-off height, 0.65 mm pitch, 11 mm x 15.9 mm x 3.35 mm body | 2004-05-04 | |
SOT851-3 | HSOP36 | plastic, heatsink small outline package; 36 leads; low stand-off-height | 2018-11-05 | |
SOT852-2 | HVQFN68 | plastic thermal enhanced very thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.85 mm | 2005-05-23 | |
SOT853-1 | QFP44 | plastic quad flat package; 44 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm | 2004-04-20 | |
SOT855-1 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad | MS-026(JEDEC | 2005-05-11 |
SOT855-2 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; 10 x 10 x 1 mm; exposed diepad | 2010-02-15 | |
SOT855-3 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad | MS-026(JEDEC | 2010-04-22 |
SOT855-4 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad | MS-026(JEDEC | 2011-04-12 |
SOT855-5 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; 0.5 mm pitch, 10 mm x 10 mm x 1 mm body | 2018-12-18 | |
SOT855-6 | HTQFP64 | HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body; exposed die pad | 2021-12-14 | |
SOT856-1 | LFBGA72 | plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm | 2004-05-12 | |
SOT857-1 | TFBGA128 | plastic thin fine-pitch ball grid array package; 128 balls; body 9 x 9 x 0.8 mm | MO-195(JEDEC | 2004-06-22 |
SOT858-1 | HLLGA68R | plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 15 x 1.3 mm | 2007-11-14 | |
SOT858-2 | HLLGA68R | plastic, thermal enhanced low profile land grid array package; 68 lands; 0.65 mm pitch; 10 mm x 15 mm x 1.25 mm body | 2007-11-15 | |
SOT859-1 | VFBGA52 | plastic very thin fine-pitch ball grid array package; 52 balls; body 4.5 x 7 x 0.65 mm | MO-225(JEDEC | 2005-01-17 |
SOT860-1 | HBGA624 | plastic, thermal enhanced ball grid array package; 624 balls; 1.27 mm pitch; 40 mm x 40 mm x 1.75 mm body | MS-034(JEDEC | 2005-09-22 |
SOT861-1 | TFBGA393 | plastic thin fine-pitch ball grid array package; 280 balls; body 14 x 14 x 0.7 mm | 2004-07-19 | |
SOT862-1 | LFBGA336 | plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm | 2004-07-26 | |
SOT862-2 | LFBGA336 | plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1 mm | 2005-07-18 | |
SOT863-1 | HLLGA48R | plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.4 mm | 2008-08-15 | |
SOT864-1 | HTSSOP24 | plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad | MO-153(JEDEC | 2005-12-06 |
SOT865-1 | HVQFN32 | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2004-09-20 |
SOT865-2 | HVQFN32 | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm | 2009-03-05 | |
SOT865-3 | HVQFN32 | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; 0.65 mm pitch, 7 mm x 7 mm x 0.85 mm body | MO-220(JEDEC | 2009-02-05 |
SOT865-4 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.65 mm pitch; 7 mm x 7 mm x 0.85 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT865-5 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.65 mm pitch; 7 mm x 7 mm x 0.85 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
SOT866-1 | HVQFN32 | plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm | MO-220(JEDEC | 2004-09-20 |
SOT866-2 | HVQFN32 | HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.65 mm pitch; 6 mm x 6 mm x 0.85 mm body | 2017-06-11 | |
SOT868-1 | TFBGA240 | plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm | 2004-09-28 | |
SOT869-1 | BGA288 | plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm | MS-034(JEDEC | 2005-05-11 |
SOT870-1 | TSON4R | plastic thin small outline package; no leads; 4 terminals; body 1.6 x 2 x 1.1 mm | 2007-11-14 | |
SOT871-1 | HVQFN52 | plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm | 2004-12-16 | |
SOT873-1 | DFN3333-8 | plastic, thermal enhanced very thin small outline package; 8 terminals; 0.65 mm pitch; 3.3 mm x 3.3 mm x 1 mm body | 2010-04-19 | |
SOT874-1 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3.3 x 3.3 x 0.85 mm | 2005-11-29 | |
SOT875-1 | BGA756 | plastic ball grid array package; 756 balls; body 35 x 35 x 1.75 mm | MS-034(JEDEC | 2004-12-06 |
SOT878-1 | RDBS27P | plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads, (row spacing 2.54 mm) | 2012-12-19 | |
SOT878-2 | RDBS27P | plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm) | 2012-12-19 | |
SOT879-1 | LBGA196 | plastic low profile ball grid array package; 196 balls; body 15 x 15 x 1 mm | MO-192(JEDEC | 2005-04-19 |
SOT879-2 | LBGA196 | LBGA196, plastic, low profile ball grid array; 196 balls; 1 mm pitch; 15 mm x 15 mm x 1.16 mm body | 2015-12-24 | |
SOT879-3 | LBGA196 | LBGA196, plastic, low profile ball grid array; 196 balls; 1 mm pitch; 15 mm x 15 mm x 1.7 mm body | 2017-06-11 | |
SOT880 | SIP3 | plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads | 2007-09-11 | |
SOT881-1 | BGA292 | plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm | MS-034(JEDEC | 2005-02-10 |
SOT882-1 | LBGA260 | plastic low profile ball grid array package; 260 balls; body 19 x 19 x 1 mm | MO-192(JEDEC | 2005-02-28 |
SOT883 | DFN1006-3 | plastic, leadless ultra small package; 3 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.48 mm body | SC-101(EIAJ | 2003-04-03 |
SOT883B | DFN1006B-3 | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1 mm x 0.6 mm x 0.37 mm body | 2011-06-30 | |
SOT883C | DFN1006C-3 | Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.34 mm | MO-252(JEDEC | 2013-04-09 |
SOT886 | XSON6 | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | MO-252(JEDEC | 2004-07-22 |
SOT886-1 | XSON6 | plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm | 2013-07-10 | |
SOT889-1 | RDBS23P | plastic rectangular-DIL-bent-SIL (reverse bent) power package; 23 leads (row spacing 2.54 mm) | 2005-03-24 | |
SOT89 | SOT89 | plastic, surface-mounted package; 3 leads; 1.5 mm pitch; 4.5 mm x 2.5 mm x 1.5 mm body | SC-62(EIAJ);TO-243(JEDEC | 2006-08-29 |
SOT891 | XSON6 | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | 2007-05-15 | |
SOT893-1 | LFBGA240 | plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 1 mm | 2005-03-16 | |
SOT894-1 | LFBGA280 | plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm | 2005-03-16 | |
SOT895-1 | DFM2 | plastic flanged cavity package; 2 mounting slots; 2 leads | 2006-02-21 | |
SOT898-1 | HTQFN48R | plastic thermal enhanced thin quad flat package; no leads; 48 terminals; body 7 x 7 x 1 mm | 2007-11-14 | |
SOT899-1 | HVSON2 | plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 x 2 x 0.85 mm | 2005-05-09 | |
SOT900-1 | HBGA456 | plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2005-09-02 |
SOT901-1 | BGA400 | plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm | MS-034(JEDEC | 2005-10-25 |
SOT902-1 | XQFN8U | plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm | MO-255(JEDEC | 2007-11-14 |
SOT902-2 | XQFN8 | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | MO-255(JEDEC | 2016-07-12 |
SOT902-3 | XQFN8 | plastic, extremely thin quad flat package, no leads; 8 terminals; 0.6 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | MO-255(JEDEC | 2020-10-09 |
SOT903-1 | HLQFN64R | plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm | 2007-11-14 | |
SOT903-2 | HLQFN64R | plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based | 2011-11-04 | |
SOT904-1 | TFBGA84 | plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm | MO-195(JEDEC | 2005-06-09 |
SOT905-1 | HVQFN24 | HVQFN24, plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3 mm x 3 mm x 0.85 mm | 2006-03-31 | |
SOT906-1 | HVQFN88 | plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm | 2005-08-09 | |
SOT906-2 | HVQFN88 | plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm | 2006-08-31 | |
SOT906-3 | HVQFN88 | plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm | 2007-03-21 | |
SOT906-4 | HVQFN88 | plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm | 2007-08-21 | |
SOT906-5 | HVQFN88 | plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm | 2008-04-29 | |
SOT906-6 | HVQFN88 | HVQFN88, plastic, thermal enhanced very thin quad flatpack; no leads; 88 terminals; 0.4 mm pitch; 10 mm x 10 mm x 0.9 mm body | 2017-06-11 | |
SOT907-3 | HVSON6 | HVSON6, plastic, thermal enhanced very thin small outline; no leads; 6 terminals; 0.95 mm pitch; 3 mm x 3 mm x 0.9 mm body | 2017-06-11 | |
SOT908-1 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2005-10-05 |
SOT908-2 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2010-03-08 |
SOT908-3 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2011-12-23 |
SOT908-4 | HVSON8 | HVSON8, plastic, thermal enhanced very thin small outline; no leads; 8 terminals; 0.5 mm pitch; 2 mm x 2 mm x 0.85 mm body | 2017-06-11 | |
SOT909-1 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm | MO-229(JEDEC | 2005-09-28 |
SOT909-2 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2012-01-25 |
SOT909-3 | HVSON8 | HVSON8, plastic, thermal enhanced very thin small outline; no leads; 8 terminals; 0.8 mm pitch; 4 mm x 4 mm x 0.9 mm body | 2017-06-11 | |
SOT909-4 | HVSON8 | HVSON8, plastic, thermal enhanced very thin small outline; no leads; 8 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1 mm body | H-PDFP-N8(JEDEC | 2017-06-11 |
SOT910-1 | HVQFN20 | plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 6 x 5 x 0.85 mm | MO-220(JEDEC | 2005-10-11 |
SOT911-1 | TFBGA56 | plastic thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.8 mm | 2005-09-14 | |
SOT912-1 | TFBGA36 | plastic thin fine-pitch ball grid array package; 36 balls; body 3.5 x 3.5 x 0.8 mm | 2005-09-01 | |
SOT913-1 | LFBGA340 | plastic low profile fine-pitch ball grid array package; 340 balls; body 12 x 12 x 1 mm | 2005-09-13 | |
SOT915-1 | VFBGA373S | plastic very thin fine-pitch ball grid array package; 373 balls; top 119 lands; stackable; body 14 x 14 x 0.65 mm | 2005-11-28 | |
SOT915-2 | VFBGA373S | plastic very thin fine-pitch ball grid array package; 373 balls; top 120 lands; stackable; body 14 x 14 x 0.65 mm | 2006-03-07 | |
SOT916-1 | HTQFN56R | plastic thermal enhanced thin quad flat package; no leads; 56 terminals; body 9 x 9 x 1.1 mm | 2007-11-14 | |
SOT917-1 | HVQFN20 | plastic thermal enhanced very thin quad flat package; no leads; 20 terminals | MO-220(JEDEC | 2005-10-31 |
SOT917-2 | HVQFN20 | plastic thermal enhanced very thin quad flat package; no leads; 20 terminals | 2009-12-30 | |
SOT917-3 | HVQFN20 | plastic thermal enhanced very thin quad flat package; no leads; 20 terminals | - - -(EIAJ);MO-220(JEDEC | 2011-03-21 |
SOT917-4 | HVQFN | plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 mm x 4 mm x 0.85 mm | 2014-11-07 | |
SOT917-5 | HVQFN | HVQFN20, plastic thermal enchanced very thin quad flat package; no leads; 20 terminals; 4 mm x 4 mm 0.85 mm body | 2017-04-03 | |
SOT917-6(DD) | HVQFN20 | HVQFN20, plastic thermal enchanced very thin quad flat package; no leads; 20 terminals; 0.125 dimple wettable flank, 0.5 mm pitch, 4 mm x 4 mm 0.85 mm body | 2022-06-24 | |
SOT917-7 | HVQFN20 | HVQFN20, plastic thermal enchanced very thin quad flat package; no leads; 20 terminals; 0.5 mm pitch, 4 mm x 4 mm 0.85 mm body | 2023-02-20 | |
SOT918-1 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm | MO-195(JEDEC | 2005-10-13 |
SOT919-1 | DBS27P | plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) | 2005-10-27 | |
SOT920-1 | RDBS27P | plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm) | 2005-10-27 | |
SOT923-1 | HVQFN64 | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm | 2005-11-03 | |
SOT923-2 | HVQFN64 | plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm | 2008-03-26 | |
SOT925-1 | BGA364 | plastic ball grid array package; 364 balls; body 27 x 27 x 1.75 mm | 2005-11-24 | |
SOT926-1 | TFBGA100 | plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm | 2005-12-22 | |
SOT927-1 | LFBGA420 | plastic low profile fine-pitch ball grid array package; 420 balls; body 13 x 13 x 1.1 mm | 2006-03-30 | |
SOT928-1 | TQFP64 | plastic thin quad flat package; 64 leads; body 7 x 7 x 1 mm | MS-026(JEDEC | 2006-01-03 |
SOT929-1 | LFBGA272 | plastic low profile fine-pitch ball grid array package; 272 balls; body 15 x 15 x 1 mm | MO-205(JEDEC | 2005-12-21 |
SOT930-1 | TFBGA208 | plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm | 2006-01-03 | |
SOT931-1 | HLSON10R | plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm | 2007-11-14 | |
SOT932-1 | TFBGA176 | plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm | MO-246(JEDEC | 2006-01-16 |
SOT933-1 | LFBGA180 | plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm | MO-205(JEDEC | 2006-01-23 |
SOT935-2 | HLQFN56R | plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based | 2011-08-18 | |
SOT938-1 | HSOP36 | plastic, heatsink small outline package; 36 leads; low stand-off height | 2006-04-07 | |
SOT941-1 | HVQFN112U | plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; body 7 x 7 x 0.9 mm | 2007-11-14 | |
SOT941-2 | HVQFN112U | plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; UTLP based; body 7 x 7 x 0.9 mm | 2007-11-14 | |
SOT942-1 | HUQFN88U | plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; body 6 x 6 x 0.55 mm | 2007-11-14 | |
SOT943-1 | HUQFN68U | plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm | 2007-11-14 | |
SOT945-1 | HVQFN40R | plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 x 5 x 0.8 mm | 2007-11-14 | |
SOT946-1 | LFBGA296 | plastic low profile fine-pitch ball grid array package; 296 balls; body 10 x 10 x 1 mm | 2006-06-02 | |
SOT947-1 | BGA564 | plastic, ball grid array package; 564 balls; body 40 x 40 x 1.75 mm | 2006-05-31 | |
SOT948-1 | HBGA1092 | plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2006-05-31 |
SOT949-1 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2007-02-13 |
SOT949-2 | HVQFN56 | plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm | MO-220(JEDEC | 2012-09-18 |
SOT949-4 | HVQFN56 | HVQFN56, plastic, thermal enhanced very thin quad flatpack; no leads; 56 terminals; 0.4 mm pitch; 7 mm x 7 mm x 0.9 mm body | 2017-06-11 | |
SOT949-5 | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package; no leads; 56 terminals; 0.4 mm pitch, 7 mm x 7 mm x 0.85 mm body | 2018-06-05 | |
SOT949-6 | HVQFN56 | HVQFN56, thermal enhanced very thin quad flat package, no leads; 56 terminals, 0.4 mm pitch, 7 mm x 7 mm x 0.85 mm body | 2019-03-01 | |
SOT950-1 | TFBGA208 | plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm | 2006-06-14 | |
SOT951-1 | TFBGA88 | plastic thin fine-pitch ball grid array package; 88 balls; body 7 x 7 x 0.8 mm | MO-195(JEDEC | 2006-08-25 |
SOT952-1 | BGA432 | plastic ball grid array package; 432 balls; body 35 x 35 x 1.75 mm | MS-034(JEDEC);144E(IEC | 2006-06-21 |
SOT953-1 | HBGA432 | plastic thermal enhanced ball grid array package; 432 balls; body 35 x 35 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2006-06-21 |
SOT954-1 | HVSON8 | plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.85 mm | 2006-08-25 | |
SOT955-1 | HVSON12 | plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.85 mm | 2006-08-25 | |
SOT956-1 | HVSON16 | plastic thermal enhanced very thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.85 mm | 2006-08-25 | |
SOT958-1 | LFBGA260 | plastic low profile fine-pitch ball grid array package; 260 balls; body 10 x 10 x 1 mm | 2006-07-06 | |
SOT959-1 | LFBGA393 | plastic low profile fine-pitch ball grid array package; 393 balls; body 14 x 14 x 1 mm | 2006-07-06 | |
SOT96-1 | SO8 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | MS-012(JEDEC);076E03(IEC | 2003-02-18 |
SOT96-2 | SO8 | plastic small outline package; 8 leads (straight); body width 3.9 mm | 2006-08-01 | |
SOT96-3 | SO8 | plastic small outline package; 8 leads; body width 3.9 mm; body thickness 1.47 mm | MS-012(JEDEC | 2006-08-25 |
SOT96-4 | SO8 | SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 3.9 mm x 4.9 mm x 1.5 mm body | MS-012AA(JEDEC | 2017-06-11 |
SOT960-1 | HTQFN60R | plastic thermal enhanced thin quad flat package; no leads; 60 terminals; body 5.5 x 8.5 x 1.15 mm | 2007-11-14 | |
SOT961-1 | VFBGA352S | plastic very thin fine-pitch ball grid array package; 352 balls; top 128 lands; stackable; body 12 x 12 x 0.65 mm | 2006-08-02 | |
SOT962-1 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls | 2008-06-16 | |
SOT962-2 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls | 2008-06-13 | |
SOT962-3 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls | 2008-06-18 | |
SOT963-1 | TFBGA44 | plastic thin fine-pitch ball grid array package; 44 balls; body 3 x 5 x 0.9 mm | 2006-08-22 | |
SOT965-1 | LFBGA516 | plastic low profile fine-pitch ball grid array package; 516 balls; body 14 x 14 x 1.2 mm | 2006-08-25 | |
SOT966-1 | LFBGA208 | plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm | 2006-08-22 | |
SOT968-1 | LFBGA288 | plastic low profile fine-pitch ball grid array package; 288 balls; body 10 x 15 x 1 mm | 2006-09-20 | |
SOT969-1 | TFBGA64 | plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm | 2006-09-27 | |
SOT97-1 | DIP8 | plastic, dual in-line package; 8 leads; 2.54 mm pitch; 9.5 mm x 6.34 mm x 4.2 mm body | SC-504-8(EIAJ);MO-001(JEDEC);050G01(IEC | 2003-02-13 |
SOT97-2 | DIP8 | plastic dual in-line package; 8 leads (300 mil) | MO-001(JEDEC | 2010-10-18 |
SOT97-3 | DIP8 | DIP8, plastic, dual in-line package; 8 terminals; 2.54 mm pitch; 6.35 mm x 10 mm x 5.3 mm body | E-PDIP-T8(JEDEC | 2017-06-11 |
SOT972-1 | HXSON8 | plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm | 2006-11-13 | |
SOT972-2 | DFN1714-8 | plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.5 mm body | 2013-08-02 | |
SOT973-1 | HXSON12 | plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.5 mm | 2006-11-13 | |
SOT973-2 | DFN2514-12 | plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.35 mm x 0.5 mm body | 2010-03-25 | |
SOT974-1 | HXSON16 | plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals | 2006-11-13 | |
SOT974-2 | DFN3314-16 | plastic, thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body | 2010-03-25 | |
SOT978-1 | LFBGA276 | plastic low profile fine-pitch ball grid array package; 276 balls; body 15 x 15 x 1 mm | MO-205(JEDEC | 2006-11-10 |
SOT983-1 | DFN1714U-8 | plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.5 mm body | 2007-11-14 | |
SOT984-1 | DFN2514U-12 | plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.35 mm 0.5 mm body | 2007-11-14 | |
SOT985-1 | DFN3314U-16 | plastic, thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body | 2007-11-14 | |
SOT989-1 | LFBGA401 | plastic low profile fine-pitch ball grid array package; 401 balls; body 13 x 13 x 1 mm | 2007-01-03 | |
SOT991-1 | VFBGA56 | plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm | 2007-02-07 | |
SOT992-1 | LFBGA544 | plastic low profile fine-pitch ball grid array package; 544 balls; body 14 x 14 x 1.25 mm | 2007-02-02 | |
SOT993-1 | HVQFN28 | plastic thermal enhanced very thin quad flat package; no leads; 28 terminals | MO-220(JEDEC | 2007-03-08 |
SOT993-3 | HVQFN28 | HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals | MO-220(JEDEC | 2010-03-02 |
SOT993-4 | HVQFN28 | HVQFN28, plastic, thermal enhanced very thin quad flatpack; no leads; 28 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body | 2017-06-11 | |
SOT994-1 | HWQFN24 | plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; 0.5 mm pitch, 4 mm x 4 mm x 0.75 mm body | MO-220(JEDEC | 2019-09-20 |
SOT995-1 | HLQFN48R | plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; body 7 x 7 x 1.2 mm | 2007-11-14 | |
SOT995-2 | HLQFN48R | plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; resin based | 2011-12-23 | |
SOT996-2 | XSON8 | plastic, extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body | 2007-12-21 | |
SOT996-3 | XSON8 | Plastic extremely thin small outline package; no leads; 8 terminals | MO-229(JEDEC | 2011-03-30 |
SOT998-1 | LFBGA459 | plastic low profile fine-pitch ball grid array package; 459 balls | 2008-03-14 | |
SOT999-1 | TFBGA256 | plastic thin fine-pitch ball grid array package; 256 balls | MO-195(JEDEC | 2007-06-21 |
TFBGA484 | TFBGA_ASC88x | Pb and Halogen free; 484 balls | 2012-03-09 | |
WLCSP | WLCSP | wafer level chip-size package; 5 bumps (2-1-2) | 2007-05-25 | |
WLCSP10_4-2-4 | WLCSP | wafer level chip-size package; 10 bumps (4-2-4) | 2010-02-11 | |
WLCSP15_6-3-6 | WLCSP | wafer level chip-size package; 15 bumps (6-3-6) | 2010-02-11 | |
WLCSP17_6-5-6 | WLCSP | wafer level chip-size package; 17 bumps (6-5-6) | 2012-05-03 | |
WLCSP25_217X232 | WLCSP25 | wafer level chip-size package; 25 bumps | 2012-02-13 | |
WLCSP25_5X5 | WLCSP | wafer level chip-size package; 25 bumps (5 x 5) | 2010-02-11 | |
WLCSP30 | WLCSP30 | wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm | 2016-01-25 | |
WLCSP4 | WLCSP4 | wafer level chip-scale package; 4 bumps; 0.83 x 0.78 x 0.53 mm (backside coating included) | 2016-04-13 | |
WLCSP5_2-1-2 | WLCSP | wafer level chip-size package; 5 bumps (2-1-2) | 2010-02-11 | |
WLCSP6 | WLCSP | wafer level chip-size package; 6 bumps | 2012-01-11 |