NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    DSP56F807PY80E
Package Description:    LQFP 160 24*24*1.4P0.5
Tracking Number:   K10949D164


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, Copper    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant    RoHS CoA
Epoxy Die Attach    RoHS CoA
Lead Frame Plating    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request