NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
KCIMX6X1CVK08AB
Package Description:
Pele MAPBGA 14*14
Tracking Number:
K00153D024
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Non-Conductive Epoxy/Adhesive
RoHS CoA
Organic Substrate
AUS 308
RoHS CoA
E679FGB
RoHS CoA
COPPER FOIL
RoHS CoA
Silicon Semiconductor Die
FAB 14
RoHS CoA
LEAD FREE BUMP
RoHS CoA
Solder Balls - Lead Free
RoHS CoA
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