NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    KMPC8265ACVVMIBC
Package Description:    TBGA 480 37*37*1.7P1.27
Tracking Number:   K00080D024


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Organic Substrate, Halogen-free  COPPER  RoHS CoA
  TSA-67  RoHS CoA
  AUS 21  RoHS CoA
Silicon Semiconductor Die  HIP4D/P  RoHS CoA
Solder Balls - Lead Free    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request