NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    LS1088AE7KDUMA


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Agent    RoHS CoA
Die Encapsulant, Filler    RoHS CoA
Heat Spreader    RoHS CoA
Organic Substrate, Halogen-free  E700G  RoHS CoA
  PHP-900  RoHS CoA
  GX13  RoHS CoA
  AUS 703  RoHS CoA
  COPPER  RoHS CoA
Pb-free Bumped Semiconductor Die  BUMP 6  RoHS CoA
  TSMC 12  RoHS CoA
Solder Balls - Lead Free    RoHS CoA
Underfill    RoHS CoA


  Questions or additional information on a RoHS CoA report, please enter a service request