NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    LS2088ASE7V1B
Package Description:    FCPBGA 1292 37.5��2*3.17
Tracking Number:   K50008S336


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Agent    RoHS CoA
Die Encapsulant, Filler    RoHS CoA
Heat Spreader    RoHS CoA
Organic Substrate, Halogen-free  PHP-900 IR6  RoHS CoA
  AUS703  RoHS CoA
  GX13  RoHS CoA
  E700GR  RoHS CoA
  COPPER FOIL  RoHS CoA
Pb-free Bumped Semiconductor Die  TSMC 12  RoHS CoA
  BUMP 6  RoHS CoA
Solder Balls - Lead Free    RoHS CoA
Underfill    RoHS CoA


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