NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC13892DJVK
Package Description:    13*13 GRID DEPOP
Tracking Number:   K11274D006


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Non-Conductive Epoxy/Adhesive    RoHS CoA
Silicon Semiconductor Die    RoHS CoA
Solder Balls - Lead Free    RoHS CoA
Substrate  AUS 308  RoHS CoA
  E679FGBM  RoHS CoA


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